HK1211682A1 - 微通道冷卻的高熱負荷發光裝置 - Google Patents

微通道冷卻的高熱負荷發光裝置

Info

Publication number
HK1211682A1
HK1211682A1 HK15111019.7A HK15111019A HK1211682A1 HK 1211682 A1 HK1211682 A1 HK 1211682A1 HK 15111019 A HK15111019 A HK 15111019A HK 1211682 A1 HK1211682 A1 HK 1211682A1
Authority
HK
Hong Kong
Prior art keywords
micro
channel
light emitting
emitting device
high heat
Prior art date
Application number
HK15111019.7A
Other languages
English (en)
Inventor
．達姆
．瓊吉瓦爾德
．坎貝爾
Original Assignee
Heraeus Noblelight Fusion Uv Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Heraeus Noblelight Fusion Uv Inc filed Critical Heraeus Noblelight Fusion Uv Inc
Publication of HK1211682A1 publication Critical patent/HK1211682A1/zh

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/06—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation
    • B05D3/061—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to radiation using U.V.
    • B05D3/065—After-treatment
    • B05D3/067—Curing or cross-linking the coating
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2101/00—Point-like light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
HK15111019.7A 2010-01-27 2013-07-23 微通道冷卻的高熱負荷發光裝置 HK1211682A1 (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33697910P 2010-01-27 2010-01-27
US34159410P 2010-04-01 2010-04-01
US45642610P 2010-11-05 2010-11-05

Publications (1)

Publication Number Publication Date
HK1211682A1 true HK1211682A1 (zh) 2016-05-27

Family

ID=44319740

Family Applications (1)

Application Number Title Priority Date Filing Date
HK15111019.7A HK1211682A1 (zh) 2010-01-27 2013-07-23 微通道冷卻的高熱負荷發光裝置

Country Status (8)

Country Link
US (2) US8378322B2 (zh)
EP (2) EP2529156B9 (zh)
JP (1) JP5820397B2 (zh)
CN (2) CN104613441B (zh)
ES (1) ES2671912T3 (zh)
HK (1) HK1211682A1 (zh)
TW (1) TWI557379B (zh)
WO (1) WO2011094293A1 (zh)

Families Citing this family (58)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060149343A1 (en) * 1996-12-02 2006-07-06 Palomar Medical Technologies, Inc. Cooling system for a photocosmetic device
US6648904B2 (en) * 2001-11-29 2003-11-18 Palomar Medical Technologies, Inc. Method and apparatus for controlling the temperature of a surface
CA2489506A1 (en) * 2002-06-19 2003-12-31 Palomar Medical Technologies, Inc. Method and apparatus for treatment of cutaneous and subcutaneous conditions
US7856985B2 (en) 2005-04-22 2010-12-28 Cynosure, Inc. Method of treatment body tissue using a non-uniform laser beam
US7586957B2 (en) 2006-08-02 2009-09-08 Cynosure, Inc Picosecond laser apparatus and methods for its operation and use
WO2010102108A1 (en) * 2009-03-05 2010-09-10 Cynosure, Inc. Pulsed therapeutic light system and method
US9255686B2 (en) 2009-05-29 2016-02-09 Cree, Inc. Multi-lens LED-array optic system
ES2671912T3 (es) * 2010-01-27 2018-06-11 Heraeus Noblelight Fusion Uv Inc. Dispositivo emisor de luz con alta carga térmica enfriado por microcanal
US9401103B2 (en) 2011-02-04 2016-07-26 Cree, Inc. LED-array light source with aspect ratio greater than 1
EP2559682B1 (en) * 2011-08-15 2016-08-03 Rohm and Haas Electronic Materials LLC Organometallic compound preparation
US8840278B2 (en) * 2011-09-20 2014-09-23 Cree, Inc. Specular reflector and LED lamps using same
EP2766762B1 (en) * 2011-10-12 2019-07-17 Phoseon Technology, Inc. Multiple light collection and lens combinations with co-located foci for curing optical fibers
CN103890533A (zh) * 2011-10-26 2014-06-25 开利公司 聚合物管热交换器
CN104350327A (zh) * 2012-04-06 2015-02-11 克里公司 纵横比大于1的led阵列光源
WO2013158299A1 (en) 2012-04-18 2013-10-24 Cynosure, Inc. Picosecond laser apparatus and methods for treating target tissues with same
WO2014031095A1 (en) 2012-08-20 2014-02-27 Fusion Uv Systems. Inc. Micro-channel-cooled high heat load light emitting device
JP2015529396A (ja) 2012-08-22 2015-10-05 フレックス‐エヌ‐ゲート アドバンスト プロダクト ディベロップメント エルエルシー Ｌｅｄヘッドランプ用マイクロチャネルヒートシンク
US8888328B2 (en) * 2012-12-12 2014-11-18 Orbotech Ltd. Light engine
US9057488B2 (en) * 2013-02-15 2015-06-16 Wavien, Inc. Liquid-cooled LED lamp
USRE48245E1 (en) * 2013-03-01 2020-10-06 Spdi, Inc. Mobile UVA curing system and method for collision and cosmetic repair of vehicles
US9099213B2 (en) * 2013-03-01 2015-08-04 Spdi, Inc. Mobile UVA curing system and method for collision and cosmetic repair of vehicles
US10285757B2 (en) 2013-03-15 2019-05-14 Cynosure, Llc Picosecond optical radiation systems and methods of use
DE102013006286A1 (de) 2013-04-12 2014-10-16 Sto Se & Co. Kgaa Verfahren zur Beschichtung einer Gebäudeoberfläche, insbesondere einer Wand-, Decken- oder einer Bodenoberfläche eines Gebäudes
JP6187089B2 (ja) * 2013-09-25 2017-08-30 岩崎電気株式会社 発光素子ユニット、光源装置、及び照射器
US9622483B2 (en) 2014-02-19 2017-04-18 Corning Incorporated Antimicrobial glass compositions, glasses and polymeric articles incorporating the same
US11039620B2 (en) 2014-02-19 2021-06-22 Corning Incorporated Antimicrobial glass compositions, glasses and polymeric articles incorporating the same
KR101660582B1 (ko) * 2014-06-19 2016-09-29 황규천 엘이디등 및 이를 포함하는 경화기
US20150378072A1 (en) 2014-06-26 2015-12-31 Heraeus Noblelight America Llc Modular uv led lamp reflector assembly
SG11201700677XA (en) 2014-07-31 2017-02-27 Carrier Corp Coated heat exchanger
US9664371B2 (en) * 2015-01-15 2017-05-30 Heraeus Noblelight America Llc Lamp head assemblies and methods of assembling the same
US9644831B2 (en) * 2015-01-15 2017-05-09 Heraeus Noblelight America Llc Intelligent manifold assemblies for a light source, light sources including intelligent manifold assemblies, and methods of operating the same
US10217919B2 (en) * 2015-07-08 2019-02-26 Air Motion Systems, Inc. LED module
US9958134B2 (en) * 2015-07-17 2018-05-01 Cooper Technologies Company Low profile clamp
US9927097B2 (en) * 2015-07-30 2018-03-27 Vital Vio Inc. Single diode disinfection
JP2018527760A (ja) * 2015-08-26 2018-09-20 シン サーマル エクスチェンジ ピーティーイー エルティーディー 真空コア回路基板
US10180248B2 (en) 2015-09-02 2019-01-15 ProPhotonix Limited LED lamp with sensing capabilities
US9953899B2 (en) 2015-09-30 2018-04-24 Microfabrica Inc. Micro heat transfer arrays, micro cold plates, and thermal management systems for cooling semiconductor devices, and methods for using and making such arrays, plates, and systems
US10076800B2 (en) 2015-11-30 2018-09-18 Cree Fayetteville, Inc. Method and device for a high temperature vacuum-safe solder stop utilizing laser processing of solderable surfaces for an electronic module assembly
US10096537B1 (en) 2015-12-31 2018-10-09 Microfabrica Inc. Thermal management systems, methods for making, and methods for using
EP3249685B1 (en) * 2016-05-24 2019-11-27 Mitsubishi Electric R&D Centre Europe B.V. System comprising at least one power module comprising at least one power die that is cooled by a liquid cooled busbar
EP3301999B1 (en) 2016-09-30 2020-06-17 HP Scitex Ltd Light emitting diode heatsink
US20180149333A1 (en) * 2016-11-29 2018-05-31 Ford Global Technologies, Llc Low-profile efficient vehicular lighting modules
US10458626B2 (en) * 2017-01-27 2019-10-29 Heraeus Noblelight America Llc Light systems including field replaceable assembly, and methods of assembling and operating the same
JP6939041B2 (ja) * 2017-04-19 2021-09-22 富士フイルムビジネスイノベーション株式会社 光照射装置、光照射システム、画像形成装置
EP3640525B1 (en) * 2017-06-13 2023-11-29 Jiangsu GoodLed Precision Optoelectronics Co. Ltd. Ultraviolet curing device and control method therefor
CN107336527A (zh) * 2017-07-07 2017-11-10 江苏科思机电工程有限公司 一种用于喷印彩色图案的喷印系统
CN107347225B (zh) * 2017-07-07 2019-02-05 厦门大学 一种针对荧光透明陶瓷大功率led光源的控制方法
CN107734840B (zh) * 2017-11-29 2023-08-18 中国电子科技集团公司第二十六研究所 基于印制电路板三维微通道阵列液冷冷却结构
KR102627248B1 (ko) 2018-02-26 2024-01-19 싸이노슈어, 엘엘씨 Q-스위치드 캐비티 덤핑 서브 나노초 레이저
US10709015B1 (en) * 2019-02-25 2020-07-07 Dura Operating, Llc Structural support elements of light guide and electrical housing
US20200386392A1 (en) * 2019-06-10 2020-12-10 Applied Materials, Inc. Heat exchange arrangement for light emitting diode lamp modules
US11670666B2 (en) * 2019-10-08 2023-06-06 Luminus, Inc. Light-emitting systems with close-packed LEDs and/or electrically isolated substrates and methods of making and/or operating the same
US20210129182A1 (en) * 2019-11-04 2021-05-06 Roeslein & Associates, Inc. Ultraviolet bottom coating system and method of operating
US11769710B2 (en) 2020-03-27 2023-09-26 Xilinx, Inc. Heterogeneous integration module comprising thermal management apparatus
CN113695204B (zh) * 2020-05-21 2022-10-18 长鑫存储技术有限公司 膜层固化装置
CN114236334B (zh) * 2021-11-05 2023-10-10 严群 通过光激发增强电流注入led电致发光性能检测系统
US11729951B2 (en) 2022-01-13 2023-08-15 Toyota Motor Engineering & Manufacturing North America, Inc. Heat flux micro coolers having multi-stepped features and fluid wicking
TWI825905B (zh) * 2022-08-05 2023-12-11 台亞半導體股份有限公司 具有長條狀光型之深紫外線發光二極體封裝結構

Family Cites Families (51)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5105429A (en) 1990-07-06 1992-04-14 The United States Of America As Represented By The Department Of Energy Modular package for cooling a laser diode array
US5105430A (en) 1991-04-09 1992-04-14 The United States Of America As Represented By The United States Department Of Energy Thin planar package for cooling an array of edge-emitting laser diodes
US5294831A (en) * 1991-12-16 1994-03-15 At&T Bell Laboratories Circuit pack layout with improved dissipation of heat produced by high power electronic components
US6514075B1 (en) 1998-09-15 2003-02-04 Gregory S. Jacob Dental curing apparatus for light-sensitive materials
WO2001075359A1 (en) 2000-04-03 2001-10-11 Getinge/Castle, Inc. High power led source and optical delivery system
US6554414B2 (en) * 2001-01-02 2003-04-29 3M Innovative Properties Company Rotatable drum inkjet printing apparatus for radiation curable ink
CA2332190A1 (en) 2001-01-25 2002-07-25 Efos Inc. Addressable semiconductor array light source for localized radiation delivery
US7075112B2 (en) 2001-01-31 2006-07-11 Gentex Corporation High power radiation emitter device and heat dissipating package for electronic components
US7439449B1 (en) * 2002-02-14 2008-10-21 Finisar Corporation Flexible circuit for establishing electrical connectivity with optical subassembly
US6942018B2 (en) 2001-09-28 2005-09-13 The Board Of Trustees Of The Leland Stanford Junior University Electroosmotic microchannel cooling system
WO2003096387A2 (en) * 2002-05-08 2003-11-20 Phoseon Technology, Inc. High efficiency solid-state light source and methods of use and manufacture
KR101164758B1 (ko) 2002-07-25 2012-07-12 조나단 에스. 담 경화용 발광 다이오드를 사용하기 위한 방법 및 장치
JP2004127988A (ja) 2002-09-30 2004-04-22 Toyoda Gosei Co Ltd 白色発光装置
US6851837B2 (en) 2002-12-04 2005-02-08 Osram Sylvania Inc. Stackable led modules
US6991356B2 (en) * 2002-12-20 2006-01-31 Efraim Tsimerman LED curing light
US7021797B2 (en) * 2003-05-13 2006-04-04 Light Prescriptions Innovators, Llc Optical device for repositioning and redistributing an LED's light
WO2005091392A1 (en) * 2004-03-18 2005-09-29 Phoseon Technology, Inc. Micro-reflectors on a substrate for high-density led array
WO2005091388A1 (en) * 2004-03-18 2005-09-29 Matsushita Electric Industrial Co., Ltd. Nitride based led with a p-type injection region
EP1754259B1 (en) 2004-03-18 2019-07-17 Phoseon Technology, Inc. Direct and indirect cooling of leds
US7095614B2 (en) * 2004-04-20 2006-08-22 International Business Machines Corporation Electronic module assembly
US7581846B2 (en) 2004-07-02 2009-09-01 Discus Dental, Llc Dental light devices having an improved heat sink
US20080032252A1 (en) 2004-08-25 2008-02-07 Discus Dental Impressions, Llc Illumination system for dental applications
US20090142724A1 (en) 2004-08-25 2009-06-04 Discus Dental Impressions, Llc Illumination system for dentistry applications
KR100646264B1 (ko) * 2004-09-07 2006-11-23 엘지전자 주식회사 프로젝션 시스템의 발광 다이오드(led) 조명장치
US7642644B2 (en) 2004-12-03 2010-01-05 Mayo Foundation For Medical Education And Research Packaging for high power integrated circuits
JP4218677B2 (ja) * 2005-03-08 2009-02-04 セイコーエプソン株式会社 マイクロチャンネル構造体及びその製造方法、光源装置、並びにプロジェクタ
CN100555070C (zh) * 2005-03-08 2009-10-28 精工爱普生株式会社 微通道结构体及其制造方法、光源装置和投影机
JP5320060B2 (ja) 2005-04-27 2013-10-23 コーニンクレッカ フィリップス エヌ ヴェ 発光半導体デバイス用冷却装置及びそのような冷却装置の製造方法
US7445340B2 (en) * 2005-05-19 2008-11-04 3M Innovative Properties Company Polarized, LED-based illumination source
US7836940B2 (en) * 2005-06-29 2010-11-23 Microvection, Inc. Microchannel cooling device for small heat sources
TWI302821B (en) * 2005-08-18 2008-11-01 Ind Tech Res Inst Flexible circuit board with heat sink
KR101189135B1 (ko) * 2005-11-29 2012-10-10 엘지디스플레이 주식회사 액정표시장치모듈
US7478932B2 (en) 2005-11-29 2009-01-20 Visteon Global Technologies, Inc. Headlamp assembly having cooling channel
US7540616B2 (en) * 2005-12-23 2009-06-02 3M Innovative Properties Company Polarized, multicolor LED-based illumination source
US7642527B2 (en) 2005-12-30 2010-01-05 Phoseon Technology, Inc. Multi-attribute light effects for use in curing and other applications involving photoreactions and processing
US20070252268A1 (en) 2006-03-31 2007-11-01 Chew Tong F Thermally controllable substrate
US7784969B2 (en) 2006-04-12 2010-08-31 Bhc Interim Funding Iii, L.P. LED based light engine
US7791892B2 (en) * 2007-01-31 2010-09-07 International Business Machines Corporation Electronic component for an electronic carrier substrate
EP2153115B1 (en) 2007-05-04 2021-07-07 Signify Holding B.V. Led-based fixtures and related methods for thermal management
US20090004557A1 (en) 2007-06-26 2009-01-01 Nokia Corporation Protecting a functional component and a protected functional component
JP4479839B2 (ja) * 2007-08-10 2010-06-09 パナソニック電工株式会社 パッケージおよび半導体装置
US7922354B2 (en) * 2007-08-13 2011-04-12 Everhart Robert L Solid-state lighting fixtures
US8104911B2 (en) * 2007-09-28 2012-01-31 Apple Inc. Display system with distributed LED backlight
JP4893582B2 (ja) * 2007-10-25 2012-03-07 豊田合成株式会社 光源装置
US8044416B2 (en) * 2008-03-25 2011-10-25 Lattice Power (Jiangxi) Corporation Method for fabricating high-power light-emitting diode arrays
US8302671B2 (en) * 2008-04-29 2012-11-06 Raytheon Company Scaleable parallel flow micro-channel heat exchanger and method for manufacturing same
US9500416B2 (en) * 2008-05-31 2016-11-22 The Boeing Company Thermal management device and method for making the same
US20100195306A1 (en) * 2009-02-03 2010-08-05 Rene Helbing Light emitting diode lamp with phosphor coated reflector
US8330377B2 (en) * 2009-12-10 2012-12-11 Phoseon Technology, Inc. Monitoring voltage to track temperature in solid state light modules
ES2671912T3 (es) * 2010-01-27 2018-06-11 Heraeus Noblelight Fusion Uv Inc. Dispositivo emisor de luz con alta carga térmica enfriado por microcanal
US8822961B2 (en) 2010-03-04 2014-09-02 Tcg International Inc. LED curing lamp and method

Also Published As

Publication number Publication date
TW201235604A (en) 2012-09-01
US8723146B2 (en) 2014-05-13
CN104613441A (zh) 2015-05-13
EP2529156B1 (en) 2018-03-07
EP2529156A4 (en) 2014-08-20
CN104613441B (zh) 2018-04-27
EP2610014A2 (en) 2013-07-03
JP2013522812A (ja) 2013-06-13
US20130187063A1 (en) 2013-07-25
US20110204261A1 (en) 2011-08-25
ES2671912T9 (es) 2018-07-23
ES2671912T3 (es) 2018-06-11
TWI557379B (zh) 2016-11-11
EP2529156B9 (en) 2018-07-04
JP5820397B2 (ja) 2015-11-24
EP2610014A3 (en) 2014-08-20
WO2011094293A1 (en) 2011-08-04
CN102906497B (zh) 2016-08-17
US8378322B2 (en) 2013-02-19
CN102906497A (zh) 2013-01-30
EP2529156A1 (en) 2012-12-05
EP2610014B1 (en) 2018-01-03

Similar Documents

Publication Publication Date Title
HK1211682A1 (zh) 微通道冷卻的高熱負荷發光裝置
HK1165093A1 (zh) 半導體發光設備
HK1167743A1 (en) Semiconductor light emitting device
HK1163348A1 (zh) 半導體發光器件
GB2483113B (en) Lighting device
EP2644977A4 (en) LED LIGHTING DEVICE
TWI561771B (en) Lighting device
EP2553320A4 (en) LED LAMP COMPRISING A THERMOELECTRIC GENERATOR
EP2578932A4 (en) LIGHTING DEVICE
HK1165532A1 (zh) 照明裝置
ZA201304926B (en) Light emitting device
EP2594846A4 (en) ILLUMINATION DEVICE
TWM389218U (en) Optical light-emitting device
EP2597688A4 (en) LIGHT EMITTING ELEMENT
EP2544252A4 (en) LIGHT EMITTING DEVICE
EP2469160A4 (en) LIGHTING DEVICE
HK1210321A1 (zh) 微通道冷卻熱負荷高的發光裝置
EP2578925A4 (en) ILLUMINATION DEVICE
EP2573454A4 (en) LIGHTING DEVICE
EP2940743A4 (en) LIGHT-EMITTING DEVICE
EP2535635A4 (en) ILLUMINATION DEVICE
EP2940742A4 (en) LIGHT-EMITTING DEVICE
ZA201209127B (en) Led lighting devices
EP2466195A4 (en) ILLUMINATION DEVICE
EP2555596A4 (en) LIGHT EMITTING DEVICE