HK1208269A1 - Liquid deposition photolithography - Google Patents
Liquid deposition photolithographyInfo
- Publication number
- HK1208269A1 HK1208269A1 HK15108928.3A HK15108928A HK1208269A1 HK 1208269 A1 HK1208269 A1 HK 1208269A1 HK 15108928 A HK15108928 A HK 15108928A HK 1208269 A1 HK1208269 A1 HK 1208269A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- liquid deposition
- deposition photolithography
- photolithography
- liquid
- deposition
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/0035—Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261614356P | 2012-03-22 | 2012-03-22 | |
PCT/US2013/033581 WO2013142830A1 (en) | 2012-03-22 | 2013-03-22 | Liquid deposition photolithography |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1208269A1 true HK1208269A1 (en) | 2016-02-26 |
Family
ID=49212157
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK15108928.3A HK1208269A1 (en) | 2012-03-22 | 2015-09-11 | Liquid deposition photolithography |
Country Status (8)
Country | Link |
---|---|
US (2) | US9034568B2 (xx) |
EP (1) | EP2828709A4 (xx) |
JP (1) | JP2015514318A (xx) |
CN (1) | CN104471483A (xx) |
CA (1) | CA2867861A1 (xx) |
HK (1) | HK1208269A1 (xx) |
SG (1) | SG11201405876YA (xx) |
WO (1) | WO2013142830A1 (xx) |
Families Citing this family (31)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9498920B2 (en) | 2013-02-12 | 2016-11-22 | Carbon3D, Inc. | Method and apparatus for three-dimensional fabrication |
ES2588485T5 (es) | 2013-02-12 | 2020-02-27 | Carbon Inc | Impresión de interfaz líquida continua |
MX350841B (es) * | 2013-02-12 | 2017-09-18 | Carbon3D Inc | Método y aparato para fabricación tridimensional. |
US9360757B2 (en) | 2013-08-14 | 2016-06-07 | Carbon3D, Inc. | Continuous liquid interphase printing |
US11260208B2 (en) | 2018-06-08 | 2022-03-01 | Acclarent, Inc. | Dilation catheter with removable bulb tip |
US10073424B2 (en) | 2014-05-13 | 2018-09-11 | Autodesk, Inc. | Intelligent 3D printing through optimization of 3D print parameters |
US9841750B2 (en) | 2014-05-13 | 2017-12-12 | Autodesk, Inc. | Dynamic real-time slice engine for 3D printing |
US9782934B2 (en) | 2014-05-13 | 2017-10-10 | Autodesk, Inc. | 3D print adhesion reduction during cure process |
SG11201609656UA (en) | 2014-06-20 | 2017-01-27 | Carbon Inc | Three-dimensional printing with reciprocal feeding of polymerizable liquid |
KR20170023977A (ko) | 2014-06-23 | 2017-03-06 | 카본, 인크. | 3차원 물체의 제조에 사용하기 위한, 다중 경화 메커니즘을 갖는 폴리우레탄 수지 |
US10166725B2 (en) | 2014-09-08 | 2019-01-01 | Holo, Inc. | Three dimensional printing adhesion reduction using photoinhibition |
US11141919B2 (en) | 2015-12-09 | 2021-10-12 | Holo, Inc. | Multi-material stereolithographic three dimensional printing |
US10935891B2 (en) | 2017-03-13 | 2021-03-02 | Holo, Inc. | Multi wavelength stereolithography hardware configurations |
US10316213B1 (en) | 2017-05-01 | 2019-06-11 | Formlabs, Inc. | Dual-cure resins and related methods |
GB2564956B (en) | 2017-05-15 | 2020-04-29 | Holo Inc | Viscous film three-dimensional printing systems and methods |
US10245785B2 (en) | 2017-06-16 | 2019-04-02 | Holo, Inc. | Methods for stereolithography three-dimensional printing |
DE102017210384B3 (de) | 2017-06-21 | 2018-08-30 | Sirona Dental Systems Gmbh | Behälter zum Einsatz in Stereolithographie-Anlagen und Stereolithographie-Anlage |
US11084222B2 (en) | 2017-06-30 | 2021-08-10 | Autodesk, Inc. | Systems and methods for determining dynamic forces in a liquefier system in additive manufacturing |
US11104075B2 (en) | 2018-11-01 | 2021-08-31 | Stratasys, Inc. | System for window separation in an additive manufacturing process |
CN216941832U (zh) | 2018-11-01 | 2022-07-12 | 斯特塔西公司 | 增材制造系统 |
EP3902659A4 (en) | 2018-12-26 | 2022-09-07 | Holo, Inc. | SENSORS FOR THREE-DIMENSIONAL PRESSURE SYSTEMS AND PROCESSES |
CN112238611A (zh) * | 2019-07-19 | 2021-01-19 | 三纬国际立体列印科技股份有限公司 | 可快速打印并保持液面平整的光固化3d打印机 |
CN115485310A (zh) | 2020-03-13 | 2022-12-16 | 阿莱恩技术有限公司 | 热固性材料中用于提高韧性的弱共价交联 |
US11661468B2 (en) | 2020-08-27 | 2023-05-30 | Align Technology, Inc. | Additive manufacturing using variable temperature-controlled resins |
US20240051246A1 (en) | 2022-08-15 | 2024-02-15 | Align Technology, Inc. | Methods for selective post-curing of additively manufactured objects |
WO2024059749A2 (en) | 2022-09-15 | 2024-03-21 | Align Technology, Inc. | Systems and methods for modifying surfaces of additively manufactured objects |
US20240100775A1 (en) | 2022-09-22 | 2024-03-28 | Cubicure Gmbh | Modular build platforms for additive manufacturing |
WO2024086752A1 (en) | 2022-10-20 | 2024-04-25 | Align Technology, Inc. | Systems and methods for generating directly manufacturable dental appliances |
WO2024092007A1 (en) | 2022-10-26 | 2024-05-02 | Align Technology, Inc. | Materials and additively manufactured objects with mechanically interlocking elements |
WO2024092097A1 (en) | 2022-10-26 | 2024-05-02 | Align Technology, Inc. | Additive manufacturing systems with fixed substrates |
WO2024097181A1 (en) | 2022-11-01 | 2024-05-10 | Align Technology, Inc. | Prefabricated support structures and/or overlays for additive manufacturing |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4551416A (en) * | 1981-05-22 | 1985-11-05 | At&T Bell Laboratories | Process for preparing semiconductors using photosensitive bodies |
JPS6299753A (ja) * | 1985-10-25 | 1987-05-09 | Fujitsu Ltd | 立体形状の形成方法 |
US4752498A (en) | 1987-03-02 | 1988-06-21 | Fudim Efrem V | Method and apparatus for production of three-dimensional objects by photosolidification |
US5175077A (en) | 1990-07-05 | 1992-12-29 | E. I. Du Pont De Nemours And Company | Solid imaging system using photohardening inhibition |
JP2616660B2 (ja) * | 1993-06-21 | 1997-06-04 | 日本電気株式会社 | 厚膜配線パターンの露光装置および厚膜の成形方法 |
JP3720846B2 (ja) * | 1995-03-27 | 2005-11-30 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 複数の電子多層構成部品の製造方法 |
US6051179A (en) | 1997-03-19 | 2000-04-18 | Replicator Systems, Inc. | Apparatus and method for production of three-dimensional models by spatial light modulator |
US7049049B2 (en) * | 2001-06-27 | 2006-05-23 | University Of South Florida | Maskless photolithography for using photoreactive agents |
US20060066006A1 (en) * | 2002-07-19 | 2006-03-30 | Haraldsson K T | Fabrication of 3d photopolymeric devices |
JP2007503120A (ja) * | 2003-08-19 | 2007-02-15 | ナノオプト コーポレーション | サブミクロンスケールのパターニングの方法およびシステム |
MX2007016039A (es) * | 2005-06-17 | 2008-10-27 | Univ North Carolina | Metodos, sistemas y materiales de fabricacion de nanoparticulas. |
US20090015922A1 (en) * | 2007-06-29 | 2009-01-15 | Allview Research Llc | Writing a diffractive structure |
US8666142B2 (en) * | 2008-11-18 | 2014-03-04 | Global Filtration Systems | System and method for manufacturing |
-
2013
- 2013-03-22 JP JP2015501940A patent/JP2015514318A/ja not_active Ceased
- 2013-03-22 EP EP13763769.0A patent/EP2828709A4/en not_active Withdrawn
- 2013-03-22 WO PCT/US2013/033581 patent/WO2013142830A1/en active Application Filing
- 2013-03-22 CN CN201380027151.XA patent/CN104471483A/zh active Pending
- 2013-03-22 CA CA2867861A patent/CA2867861A1/en not_active Abandoned
- 2013-03-22 US US13/849,256 patent/US9034568B2/en active Active
- 2013-03-22 SG SG11201405876YA patent/SG11201405876YA/en unknown
-
2015
- 2015-05-15 US US14/713,748 patent/US10162264B2/en active Active
- 2015-09-11 HK HK15108928.3A patent/HK1208269A1/xx unknown
Also Published As
Publication number | Publication date |
---|---|
CA2867861A1 (en) | 2013-09-26 |
US9034568B2 (en) | 2015-05-19 |
US20150261091A1 (en) | 2015-09-17 |
WO2013142830A1 (en) | 2013-09-26 |
US10162264B2 (en) | 2018-12-25 |
EP2828709A4 (en) | 2015-11-04 |
JP2015514318A (ja) | 2015-05-18 |
SG11201405876YA (en) | 2014-10-30 |
EP2828709A1 (en) | 2015-01-28 |
CN104471483A (zh) | 2015-03-25 |
US20130252178A1 (en) | 2013-09-26 |
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