HK1207208A1 - The substrate having metal layer and its manufacturing method - Google Patents
The substrate having metal layer and its manufacturing methodInfo
- Publication number
- HK1207208A1 HK1207208A1 HK15107808.0A HK15107808A HK1207208A1 HK 1207208 A1 HK1207208 A1 HK 1207208A1 HK 15107808 A HK15107808 A HK 15107808A HK 1207208 A1 HK1207208 A1 HK 1207208A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- substrate
- manufacturing
- metal layer
- metal
- layer
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 239000002184 metal Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510130826.4A CN104733590B (en) | 2015-03-23 | 2015-03-23 | A kind of substrate and manufacture method thereof with metal level |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| HK1207208A1 true HK1207208A1 (en) | 2016-01-22 |
Family
ID=53457285
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| HK15107808.0A HK1207208A1 (en) | 2015-03-23 | 2015-08-12 | The substrate having metal layer and its manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104733590B (en) |
| HK (1) | HK1207208A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104968156A (en) * | 2015-06-26 | 2015-10-07 | 深圳市峻泽科技有限公司 | Substrate having metal layer and manufacture method for the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102183851A (en) * | 2011-04-26 | 2011-09-14 | 中国科学院上海光学精密机械研究所 | Reflection type strength tunable electric control diffraction grating and manufacture method thereof |
| CN102832295A (en) * | 2011-06-14 | 2012-12-19 | 展晶科技(深圳)有限公司 | Method for fabricating package structure of light-emitting diode |
| CN102881779A (en) * | 2011-07-15 | 2013-01-16 | 展晶科技(深圳)有限公司 | Method for manufacturing light emitting diode packaging structure |
-
2015
- 2015-03-23 CN CN201510130826.4A patent/CN104733590B/en active Active
- 2015-08-12 HK HK15107808.0A patent/HK1207208A1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| CN104733590A (en) | 2015-06-24 |
| CN104733590B (en) | 2016-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20200318 |