HK1184274A1 - 用於晶片級相機的晶片間隔片及其製造方法 - Google Patents

用於晶片級相機的晶片間隔片及其製造方法

Info

Publication number
HK1184274A1
HK1184274A1 HK13111795.9A HK13111795A HK1184274A1 HK 1184274 A1 HK1184274 A1 HK 1184274A1 HK 13111795 A HK13111795 A HK 13111795A HK 1184274 A1 HK1184274 A1 HK 1184274A1
Authority
HK
Hong Kong
Prior art keywords
wafer
manufacturing same
level camera
spacer
spacer wafer
Prior art date
Application number
HK13111795.9A
Other languages
English (en)
Inventor
喬治．巴恩斯
戈蘭．勞克
Original Assignee
豪威科技股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 豪威科技股份有限公司 filed Critical 豪威科技股份有限公司
Publication of HK1184274A1 publication Critical patent/HK1184274A1/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00278—Lenticular sheets
    • B29D11/00307—Producing lens wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00009—Production of simple or compound lenses
    • B29D11/00432—Auxiliary operations, e.g. machines for filling the moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y80/00—Products made by additive manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4998—Combined manufacture including applying or shaping of fluent material
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
    • Y10T428/24612—Composite web or sheet

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
HK13111795.9A 2011-11-15 2013-10-21 用於晶片級相機的晶片間隔片及其製造方法 HK1184274A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13/296,901 US8826511B2 (en) 2011-11-15 2011-11-15 Spacer wafer for wafer-level camera and method of manufacturing same

Publications (1)

Publication Number Publication Date
HK1184274A1 true HK1184274A1 (zh) 2014-01-17

Family

ID=48280922

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13111795.9A HK1184274A1 (zh) 2011-11-15 2013-10-21 用於晶片級相機的晶片間隔片及其製造方法

Country Status (4)

Country Link
US (1) US8826511B2 (zh)
CN (1) CN103107177B (zh)
HK (1) HK1184274A1 (zh)
TW (1) TWI543347B (zh)

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US8521526B1 (en) * 2010-07-28 2013-08-27 Google Inc. Disambiguation of a spoken query term
US9919959B2 (en) * 2012-05-31 2018-03-20 Guardian Glass, LLC Window with UV-treated low-E coating and method of making same
US20150048209A1 (en) * 2013-08-16 2015-02-19 Robert Hoyt Structures with Internal Microstructures to Provide Multifunctional Capabilities
US20150115129A1 (en) * 2013-10-29 2015-04-30 Omnivision Technologies, Inc. Coated Diamond-Turned Replication Master And Associated Process
CN104778288B (zh) * 2014-01-13 2018-02-06 中芯国际集成电路制造(上海)有限公司 一种虚拟图案多层堆栈单元的自我双图型分解方法
US9798114B2 (en) 2014-06-17 2017-10-24 Omnivision Technologies, Inc. Concave spacer-wafer apertures and wafer-level optical elements formed therein
NL2013093B1 (en) 2014-06-30 2016-07-11 Anteryon Wafer Optics B V Method for manufacturing a lens structure.
US9952415B2 (en) 2015-04-22 2018-04-24 Omnivision Technologies, Inc. Trenched-substrate based lens manufacturing methods, and associated systems
US9915763B2 (en) * 2015-11-13 2018-03-13 Omnivision Technologies, Inc. Stacked-lens assembly and fabrication method for same
US10459189B2 (en) 2016-10-05 2019-10-29 Omnivision Technologies, Inc. Lens barrel, lens-barrel wafer, and associated method
EP3427947B1 (en) 2017-07-10 2023-09-06 Meta Platforms Technologies, LLC Method for printing a three-dimensional structure
US10822270B2 (en) 2018-08-01 2020-11-03 Guardian Glass, LLC Coated article including ultra-fast laser treated silver-inclusive layer in low-emissivity thin film coating, and/or method of making the same
US11167375B2 (en) 2018-08-10 2021-11-09 The Research Foundation For The State University Of New York Additive manufacturing processes and additively manufactured products
GB2588160B (en) * 2019-10-10 2022-09-21 Univ Brunel Adaptive precision chuck
US20220295171A1 (en) * 2021-03-09 2022-09-15 Baker Hughes Oilfield Operations Llc Acoustic transducers, methods of designing acoustic transducers, and methods of forming acoustic transducers

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6635941B2 (en) * 2001-03-21 2003-10-21 Canon Kabushiki Kaisha Structure of semiconductor device with improved reliability
KR20070089889A (ko) 2002-09-17 2007-09-03 앤터온 비.브이. 카메라 디바이스, 카메라 디바이스 제조 방법, 웨이퍼스케일 패키지 및 광학 어셈블리
EP2296041A3 (en) 2003-05-30 2013-01-23 Omnivision Technologies, Inc. Lithographic systems and methods with extended depth of focus
US7378724B2 (en) * 2005-03-24 2008-05-27 Taiwan Semiconductor Manufacturing Company, Ltd. Cavity structure for semiconductor structures
EP2016620A2 (en) 2006-04-17 2009-01-21 Omnivision Cdm Optics, Inc. Arrayed imaging systems and associated methods
CN100410058C (zh) * 2006-05-24 2008-08-13 太原理工大学 一种树脂基复合材料零件的快速成型方法
US8575513B2 (en) * 2006-07-06 2013-11-05 Siemens Energy, Inc. Rapid prototyping of ceramic articles
CN101606243B (zh) 2006-11-17 2015-11-25 南昌欧菲光电技术有限公司 在利用光学堆栈的相机系统中减小内部噪声的结构及方法
US7710667B2 (en) 2008-06-25 2010-05-04 Aptina Imaging Corp. Imaging module with symmetrical lens system and method of manufacture
US8885257B2 (en) 2009-10-20 2014-11-11 Flir Systems Trading Belgium Bvba Focus compensation for optical elements and applications thereof
US20110292271A1 (en) 2010-05-27 2011-12-01 Tzy-Ying Lin Camera module and fabrication method thereof
CN102012633B (zh) * 2010-09-25 2012-11-21 合肥工业大学 基于su-8光刻胶的纳米流体系统自支撑结构的制作方法

Also Published As

Publication number Publication date
CN103107177B (zh) 2016-05-18
TWI543347B (zh) 2016-07-21
US8826511B2 (en) 2014-09-09
US20130122261A1 (en) 2013-05-16
CN103107177A (zh) 2013-05-15
TW201320318A (zh) 2013-05-16

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