HK1183099A1 - Sensor device, production method and detection device - Google Patents

Sensor device, production method and detection device

Info

Publication number
HK1183099A1
HK1183099A1 HK13110428.6A HK13110428A HK1183099A1 HK 1183099 A1 HK1183099 A1 HK 1183099A1 HK 13110428 A HK13110428 A HK 13110428A HK 1183099 A1 HK1183099 A1 HK 1183099A1
Authority
HK
Hong Kong
Prior art keywords
production method
detection device
sensor device
sensor
detection
Prior art date
Application number
HK13110428.6A
Other languages
English (en)
Inventor
Coi Beat De
Martin Popp
Original Assignee
Espros Photonics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Espros Photonics Ag filed Critical Espros Photonics Ag
Publication of HK1183099A1 publication Critical patent/HK1183099A1/xx

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/02—Systems using the reflection of electromagnetic waves other than radio waves
    • G01S17/06—Systems determining position data of a target
    • G01S17/08—Systems determining position data of a target for measuring distance only
    • G01S17/32—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated
    • G01S17/36—Systems determining position data of a target for measuring distance only using transmission of continuous waves, whether amplitude-, frequency-, or phase-modulated, or unmodulated with phase comparison between the received signal and the contemporaneously transmitted signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S17/00—Systems using the reflection or reradiation of electromagnetic waves other than radio waves, e.g. lidar systems
    • G01S17/88—Lidar systems specially adapted for specific applications
    • G01S17/89—Lidar systems specially adapted for specific applications for mapping or imaging
    • G01S17/894—3D imaging with simultaneous measurement of time-of-flight at a 2D array of receiver pixels, e.g. time-of-flight cameras or flash lidar
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01S—RADIO DIRECTION-FINDING; RADIO NAVIGATION; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION OR RERADIATION OF RADIO WAVES; ANALOGOUS ARRANGEMENTS USING OTHER WAVES
    • G01S7/00—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00
    • G01S7/48—Details of systems according to groups G01S13/00, G01S15/00, G01S17/00 of systems according to group G01S17/00
    • G01S7/483—Details of pulse systems
    • G01S7/486—Receivers
    • G01S7/4861—Circuits for detection, sampling, integration or read-out
    • G01S7/4863—Detector arrays, e.g. charge-transfer gates

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Electromagnetism (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • General Physics & Mathematics (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
HK13110428.6A 2012-01-23 2013-09-09 Sensor device, production method and detection device HK1183099A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP12000403.1A EP2618180B1 (fr) 2012-01-23 2012-01-23 Dispositif de capteur, procédé de fabrication et dispositif de détection

Publications (1)

Publication Number Publication Date
HK1183099A1 true HK1183099A1 (en) 2013-12-13

Family

ID=48236837

Family Applications (1)

Application Number Title Priority Date Filing Date
HK13110428.6A HK1183099A1 (en) 2012-01-23 2013-09-09 Sensor device, production method and detection device

Country Status (9)

Country Link
US (1) US8836924B2 (fr)
EP (1) EP2618180B1 (fr)
KR (1) KR101638263B1 (fr)
CN (1) CN104126131B (fr)
DK (1) DK2618180T3 (fr)
ES (1) ES2465599T3 (fr)
HK (1) HK1183099A1 (fr)
IL (1) IL229741A (fr)
WO (1) WO2013110475A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6076068B2 (ja) * 2012-12-17 2017-02-08 ルネサスエレクトロニクス株式会社 半導体集積回路装置
US9354111B2 (en) * 2013-10-18 2016-05-31 Maxim Integrated Products, Inc. Wafer level lens in package
DE102016208343B4 (de) 2016-05-13 2020-02-27 Infineon Technologies Ag Optische Sensoreinrichtung und Verfahren zur Herstellung der optischen Sensoreinrichtung
CN108401092B (zh) * 2017-02-04 2024-03-15 宁波舜宇光电信息有限公司 摄像模组及其模制电路板组件、电路板以及应用
CN111433631B (zh) * 2017-12-29 2023-11-03 索尼半导体解决方案公司 成像装置和方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6879340B1 (en) 1998-08-19 2005-04-12 Micron Technology Inc. CMOS imager with integrated non-volatile memory
TW417165B (en) 1999-06-23 2001-01-01 Taiwan Semiconductor Mfg Manufacturing method for reducing the critical dimension of the wire and gap
US7265397B1 (en) 2000-08-30 2007-09-04 Sarnoff Corporation CCD imager constructed with CMOS fabrication techniques and back illuminated imager with improved light capture
US6998657B2 (en) 2003-10-21 2006-02-14 Micron Technology, Inc. Single poly CMOS imager
US7209392B2 (en) 2004-07-20 2007-04-24 Ememory Technology Inc. Single poly non-volatile memory
US7179676B2 (en) 2005-03-28 2007-02-20 Kenet, Inc. Manufacturing CCDs in a conventional CMOS process
JP2007024770A (ja) 2005-07-20 2007-02-01 Denso Corp 障害物検出装置
EP1777747B1 (fr) * 2005-10-19 2008-03-26 CSEM Centre Suisse d'Electronique et de Microtechnique SA Méthode et appareil pour la démodulation de champs d'ondes électromagnétiques modulées
JP4740203B2 (ja) * 2006-08-04 2011-08-03 北京京東方光電科技有限公司 薄膜トランジスタｌｃｄ画素ユニットおよびその製造方法
US7547622B2 (en) 2006-10-18 2009-06-16 Sarnoff Corporation Fabrication of CCD image sensors using single layer polysilicon
US7636150B1 (en) 2006-12-01 2009-12-22 Canesta, Inc. Method and system to enhance timing accuracy for time-of-flight systems
CN101447435B (zh) * 2008-12-10 2012-09-19 上海宏力半导体制造有限公司 分栅式闪存的制造方法
CN102054844B (zh) * 2009-11-10 2013-01-09 钜晶电子股份有限公司 非易失性存储器及其制造方法
CN102760737A (zh) * 2011-04-28 2012-10-31 上海华虹Nec电子有限公司 浮栅型eeprom器件及其制造方法
EP2562790A1 (fr) * 2011-08-26 2013-02-27 Espros Photonics AG Procédé de fabrication de composants semi-conducteurs sur un substrat et substrat doté de composants semi-conducteurs

Also Published As

Publication number Publication date
WO2013110475A8 (fr) 2014-02-06
EP2618180B1 (fr) 2014-03-19
US8836924B2 (en) 2014-09-16
EP2618180A1 (fr) 2013-07-24
CN104126131B (zh) 2016-11-09
IL229741A (en) 2017-01-31
KR20150097379A (ko) 2015-08-26
US20130187031A1 (en) 2013-07-25
IL229741A0 (en) 2014-01-30
KR101638263B1 (ko) 2016-07-08
WO2013110475A1 (fr) 2013-08-01
CN104126131A (zh) 2014-10-29
ES2465599T3 (es) 2014-06-06
DK2618180T3 (da) 2014-06-23

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