HK117697A - Tin lead or tin/lead alloy electrolytes for high speed electroplating - Google Patents

Tin lead or tin/lead alloy electrolytes for high speed electroplating

Info

Publication number
HK117697A
HK117697A HK117697A HK117697A HK117697A HK 117697 A HK117697 A HK 117697A HK 117697 A HK117697 A HK 117697A HK 117697 A HK117697 A HK 117697A HK 117697 A HK117697 A HK 117697A
Authority
HK
Hong Kong
Prior art keywords
tin
lead
high speed
speed electroplating
alloy electrolytes
Prior art date
Application number
HK117697A
Other languages
English (en)
Inventor
Michael P Toben
Neil D Brown
David J Esterl
Robert A Schetty
Original Assignee
Learonal Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Learonal Inc filed Critical Learonal Inc
Publication of HK117697A publication Critical patent/HK117697A/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/34—Electroplating: Baths therefor from solutions of lead
    • C25D3/36—Electroplating: Baths therefor from solutions of lead characterised by the organic bath constituents used

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
HK117697A 1987-12-10 1997-06-26 Tin lead or tin/lead alloy electrolytes for high speed electroplating HK117697A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US13075987A 1987-12-10 1987-12-10
US07/282,851 US4880507A (en) 1987-12-10 1988-12-09 Tin, lead or tin/lead alloy electrolytes for high speed electroplating

Publications (1)

Publication Number Publication Date
HK117697A true HK117697A (en) 1997-09-05

Family

ID=26828774

Family Applications (2)

Application Number Title Priority Date Filing Date
HK117697A HK117697A (en) 1987-12-10 1997-06-26 Tin lead or tin/lead alloy electrolytes for high speed electroplating
HK98111017A HK1010400A1 (en) 1987-12-10 1998-09-28 Tin, lead or tin/lead alloy electrolytes for high-speed electroplating

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK98111017A HK1010400A1 (en) 1987-12-10 1998-09-28 Tin, lead or tin/lead alloy electrolytes for high-speed electroplating

Country Status (4)

Country Link
US (1) US4880507A (fr)
EP (2) EP0319997B1 (fr)
DE (2) DE3854551T2 (fr)
HK (2) HK117697A (fr)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5094726B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US5066367B1 (en) * 1981-09-11 1993-12-21 I. Nobel Fred Limiting tin sludge formation in tin or tin/lead electroplating solutions
US4994155A (en) * 1988-12-09 1991-02-19 Learonal, Inc. High speed tin, lead or tin/lead alloy electroplating
US5174887A (en) * 1987-12-10 1992-12-29 Learonal, Inc. High speed electroplating of tinplate
US5667659A (en) * 1996-04-04 1997-09-16 Handy & Harman Low friction solder electrodeposits
US6342148B1 (en) 1998-12-03 2002-01-29 Lucent Technologies Inc. Tin electroplating bath
US6773573B2 (en) 2001-10-02 2004-08-10 Shipley Company, L.L.C. Plating bath and method for depositing a metal layer on a substrate
TWI231831B (en) * 2001-10-11 2005-05-01 Shipley Co Llc Stripping solution
US6860981B2 (en) * 2002-04-30 2005-03-01 Technic, Inc. Minimizing whisker growth in tin electrodeposits
US20050085062A1 (en) * 2003-10-15 2005-04-21 Semitool, Inc. Processes and tools for forming lead-free alloy solder precursors
GB0507887D0 (en) * 2005-04-20 2005-05-25 Rohm & Haas Elect Mat Immersion method
US7615255B2 (en) * 2005-09-07 2009-11-10 Rohm And Haas Electronic Materials Llc Metal duplex method
EP2221396A1 (fr) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Compositions de dépôt électrique à l'alliage d'étain sans plomb et procédés
KR102233334B1 (ko) * 2014-04-28 2021-03-29 삼성전자주식회사 주석 도금액, 주석 도금 장치 및 상기 주석 도금액을 이용한 반도체 장치 제조 방법

Family Cites Families (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL124247C (fr) * 1963-08-28
GB1151460A (en) * 1967-10-09 1969-05-07 Motohiko Kanai Improvements in and relating to the Electroplating of Tin-Lead Alloy
US3577328A (en) * 1968-11-07 1971-05-04 Conversion Chem Corp Method and bath for electroplating tin
US3661730A (en) * 1969-09-22 1972-05-09 Kazuo Nishihara Process for the formation of a super-bright solder coating
US3785939A (en) * 1970-10-22 1974-01-15 Conversion Chem Corp Tin/lead plating bath and method
US3905878A (en) * 1970-11-16 1975-09-16 Hyogo Prefectural Government Electrolyte for and method of bright electroplating of tin-lead alloy
NL170027C (nl) * 1971-05-25 1982-09-16 Galentan Ag Verbetering van een om een vaste as draaibare elektrolyt-verdeelinrichting.
US3730853A (en) * 1971-06-18 1973-05-01 Schloetter M Electroplating bath for depositing tin-lead alloy plates
US3749649A (en) * 1971-12-16 1973-07-31 M & T Chemicals Inc Bright tin-lead alloy plating
US3926749A (en) * 1971-12-20 1975-12-16 M & T Chemicals Inc Tin-lead alloy plating
US4000047A (en) * 1972-11-17 1976-12-28 Lea-Ronal, Inc. Electrodeposition of tin, lead and tin-lead alloys
US3956123A (en) * 1974-02-19 1976-05-11 R. O. Hull & Company, Inc. Additive for electrodeposition of bright tin and tin-lead alloy
US3875029A (en) * 1974-02-19 1975-04-01 R O Hull & Company Inc Plating bath for electrodeposition of bright tin and tin-lead alloy
AR205914A1 (es) * 1974-03-25 1976-06-15 Uss Eng & Consult Bano para el recubrimiento electrolitico de substratos ferrosos y metodo para la preparacion de un acido sulfonico de naftol etoxilado utilizado en el misma
US3977949A (en) * 1975-07-07 1976-08-31 Columbia Chemical Corporation Acidic plating bath and additives for electrodeposition of bright tin
US4053372A (en) * 1975-10-09 1977-10-11 Amp Incorporated Tin-lead acidic plating bath
US4132610A (en) * 1976-05-18 1979-01-02 Hyogo Prefectural Government Method of bright electroplating of tin-lead alloy
US4139425A (en) * 1978-04-05 1979-02-13 R. O. Hull & Company, Inc. Composition, plating bath, and method for electroplating tin and/or lead
US4242182A (en) * 1978-07-21 1980-12-30 Francine Popescu Bright tin electroplating bath
US4270990A (en) * 1979-06-07 1981-06-02 Minnesota Mining And Manufacturing Company Acidic electroplating baths with novel surfactants
US4384930A (en) * 1981-08-21 1983-05-24 Mcgean-Rohco, Inc. Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4599149A (en) * 1981-09-11 1986-07-08 Learonal, Inc. Process for electroplating tin, lead and tin-lead alloys and baths therefor
JPS5967387A (ja) * 1982-10-08 1984-04-17 Hiyougoken すず、鉛及びすず―鉛合金メッキ浴
US4565610A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating lead and lead/tin alloys
US4717460A (en) * 1983-12-22 1988-01-05 Learonal, Inc. Tin lead electroplating solutions
US4701244A (en) * 1983-12-22 1987-10-20 Learonal, Inc. Bath and process for electroplating tin, lead and tin/alloys
US4565609A (en) * 1983-12-22 1986-01-21 Learonal, Inc. Bath and process for plating tin, lead and tin-lead alloys
US4617097A (en) * 1983-12-22 1986-10-14 Learonal, Inc. Process and electrolyte for electroplating tin, lead or tin-lead alloys
JPS61194194A (ja) * 1985-02-22 1986-08-28 Keigo Obata すず、鉛又ははんだメツキ浴
US4582576A (en) * 1985-03-26 1986-04-15 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead
US4662999A (en) * 1985-06-26 1987-05-05 Mcgean-Rohco, Inc. Plating bath and method for electroplating tin and/or lead

Also Published As

Publication number Publication date
DE3854551T2 (de) 1996-04-18
EP0319997A1 (fr) 1989-06-14
EP0652306A3 (fr) 1996-01-03
HK1010400A1 (en) 1999-06-17
DE3856429D1 (de) 2000-11-02
DE3856429T2 (de) 2001-03-08
DE3854551D1 (de) 1995-11-09
US4880507A (en) 1989-11-14
EP0652306A2 (fr) 1995-05-10
EP0652306B1 (fr) 2000-09-27
EP0319997B1 (fr) 1995-10-04

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Legal Events

Date Code Title Description
PF Patent in force
PE Patent expired

Effective date: 20081208