HK1169081A1 - 用於打印頭進給槽的保護塗層 - Google Patents

用於打印頭進給槽的保護塗層

Info

Publication number
HK1169081A1
HK1169081A1 HK12109996.1A HK12109996A HK1169081A1 HK 1169081 A1 HK1169081 A1 HK 1169081A1 HK 12109996 A HK12109996 A HK 12109996A HK 1169081 A1 HK1169081 A1 HK 1169081A1
Authority
HK
Hong Kong
Prior art keywords
print head
protective coating
head feed
feed slots
slots
Prior art date
Application number
HK12109996.1A
Other languages
English (en)
Inventor
Siddhartha Bhowmik
Rio Rivas
Gerald R Wonnacott
Original Assignee
Hewlett Packard Development Co Lp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Development Co Lp filed Critical Hewlett Packard Development Co Lp
Publication of HK1169081A1 publication Critical patent/HK1169081A1/zh

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14145Structure of the manifold
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14016Structure of bubble jet print heads
    • B41J2/14032Structure of the pressure chamber
    • B41J2/1404Geometrical characteristics
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1601Production of bubble jet print heads
    • B41J2/1603Production of bubble jet print heads of the front shooter type
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1623Manufacturing processes bonding and adhesion
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1628Manufacturing processes etching dry etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1626Manufacturing processes etching
    • B41J2/1629Manufacturing processes etching wet etching
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/1631Manufacturing processes photolithography
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/16Production of nozzles
    • B41J2/1621Manufacturing processes
    • B41J2/164Manufacturing processes thin film formation
    • B41J2/1646Manufacturing processes thin film formation thin film formation by sputtering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/17Ink jet characterised by ink handling
    • B41J2/175Ink supply systems ; Circuit parts therefor
    • B41J2/17563Ink filters

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
HK12109996.1A 2009-10-28 2012-10-10 用於打印頭進給槽的保護塗層 HK1169081A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2009/062406 WO2011053288A1 (en) 2009-10-28 2009-10-28 Protective coating for print head feed slots

Publications (1)

Publication Number Publication Date
HK1169081A1 true HK1169081A1 (zh) 2013-01-18

Family

ID=43922382

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12109996.1A HK1169081A1 (zh) 2009-10-28 2012-10-10 用於打印頭進給槽的保護塗層

Country Status (5)

Country Link
US (1) US8585180B2 (zh)
EP (1) EP2493695B1 (zh)
CN (1) CN102574399B (zh)
HK (1) HK1169081A1 (zh)
WO (1) WO2011053288A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120274707A1 (en) * 2011-04-29 2012-11-01 Xiaorong Cai Ejection devices for inkjet printers and method for fabricating ejection devices
EP2817154A4 (en) * 2012-04-24 2016-11-16 Hewlett Packard Development Co FLUID EJECTION DEVICE
US9597873B2 (en) 2012-09-12 2017-03-21 Hewlett-Packard Development Company, L.P. Printhead protective coating
BR112015019393B1 (pt) 2013-02-13 2021-11-30 Hewlett-Packard Development Company, L.P. Dispositivo de ejeção de fluido
KR102161692B1 (ko) 2013-12-06 2020-10-07 삼성디스플레이 주식회사 잉크젯 프린트 헤드 및 이의 제조 방법
US10276468B2 (en) 2015-03-27 2019-04-30 Hewlett-Packard Development Company, L.P. Circuit package
WO2020162927A1 (en) 2019-02-06 2020-08-13 Hewlett-Packard Development Company, L.P. Fluid feed path wettability coating
US11731426B2 (en) 2019-06-18 2023-08-22 Hewlett-Packard Development Company L.P. Fluid feed hole corrosion detection
EP3999346A4 (en) * 2019-09-06 2023-04-05 Hewlett-Packard Development Company, L.P. FLUID EJECTION FACE SELECTIVE COATING
US11666918B2 (en) 2020-03-06 2023-06-06 Funai Electric Co., Ltd. Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic component

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5980682A (en) * 1998-05-14 1999-11-09 Lexmark International, Inc. Thermal printhead manufacture
US6497802B2 (en) 1999-02-12 2002-12-24 Applied Materials, Inc. Self ionized plasma sputtering
US6398929B1 (en) 1999-10-08 2002-06-04 Applied Materials, Inc. Plasma reactor and shields generating self-ionized plasma for sputtering
US20020064592A1 (en) 2000-11-29 2002-05-30 Madhav Datta Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects
JP2002264332A (ja) * 2001-03-08 2002-09-18 Ricoh Co Ltd 静電アクチュエータ及びその製造方法及びインクジェット記録ヘッド及びインクジェット記録装置
US6596643B2 (en) 2001-05-07 2003-07-22 Applied Materials, Inc. CVD TiSiN barrier for copper integration
US6664633B1 (en) 2001-09-10 2003-12-16 Lsi Logic Corporation Alkaline copper plating
US7025894B2 (en) 2001-10-16 2006-04-11 Hewlett-Packard Development Company, L.P. Fluid-ejection devices and a deposition method for layers thereof
US6797620B2 (en) 2002-04-16 2004-09-28 Applied Materials, Inc. Method and apparatus for improved electroplating fill of an aperture
US6942318B2 (en) 2002-05-31 2005-09-13 Hewlett-Packard Development Company, L.P. Chamber having a protective layer
US6902872B2 (en) 2002-07-29 2005-06-07 Hewlett-Packard Development Company, L.P. Method of forming a through-substrate interconnect
JP2004090279A (ja) * 2002-08-29 2004-03-25 Seiko Epson Corp 液体噴射ヘッド及び液体噴射装置
JPWO2004025745A1 (ja) * 2002-09-13 2006-01-12 松下電器産業株式会社 磁気抵抗効果素子およびこの製造方法並びに使用方法
US20040112735A1 (en) 2002-12-17 2004-06-17 Applied Materials, Inc. Pulsed magnetron for sputter deposition
WO2005041286A1 (en) * 2003-10-28 2005-05-06 Semiconductor Energy Laboratory Co., Ltd. Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method
US7041226B2 (en) * 2003-11-04 2006-05-09 Lexmark International, Inc. Methods for improving flow through fluidic channels
JP2008108860A (ja) 2006-10-25 2008-05-08 Elpida Memory Inc 半導体装置の製造方法

Also Published As

Publication number Publication date
EP2493695A1 (en) 2012-09-05
US8585180B2 (en) 2013-11-19
CN102574399B (zh) 2015-08-12
WO2011053288A1 (en) 2011-05-05
CN102574399A (zh) 2012-07-11
EP2493695B1 (en) 2019-10-16
US20120139997A1 (en) 2012-06-07
EP2493695A4 (en) 2014-08-13

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20211027