HK1169081A1 - 用於打印頭進給槽的保護塗層 - Google Patents
用於打印頭進給槽的保護塗層Info
- Publication number
- HK1169081A1 HK1169081A1 HK12109996.1A HK12109996A HK1169081A1 HK 1169081 A1 HK1169081 A1 HK 1169081A1 HK 12109996 A HK12109996 A HK 12109996A HK 1169081 A1 HK1169081 A1 HK 1169081A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- print head
- protective coating
- head feed
- feed slots
- slots
- Prior art date
Links
- 239000011253 protective coating Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14145—Structure of the manifold
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14032—Structure of the pressure chamber
- B41J2/1404—Geometrical characteristics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/164—Manufacturing processes thin film formation
- B41J2/1646—Manufacturing processes thin film formation thin film formation by sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
- B41J2/17563—Ink filters
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Geometry (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2009/062406 WO2011053288A1 (en) | 2009-10-28 | 2009-10-28 | Protective coating for print head feed slots |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1169081A1 true HK1169081A1 (zh) | 2013-01-18 |
Family
ID=43922382
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK12109996.1A HK1169081A1 (zh) | 2009-10-28 | 2012-10-10 | 用於打印頭進給槽的保護塗層 |
Country Status (5)
Country | Link |
---|---|
US (1) | US8585180B2 (zh) |
EP (1) | EP2493695B1 (zh) |
CN (1) | CN102574399B (zh) |
HK (1) | HK1169081A1 (zh) |
WO (1) | WO2011053288A1 (zh) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120274707A1 (en) * | 2011-04-29 | 2012-11-01 | Xiaorong Cai | Ejection devices for inkjet printers and method for fabricating ejection devices |
EP2817154A4 (en) * | 2012-04-24 | 2016-11-16 | Hewlett Packard Development Co | FLUID EJECTION DEVICE |
US9597873B2 (en) | 2012-09-12 | 2017-03-21 | Hewlett-Packard Development Company, L.P. | Printhead protective coating |
BR112015019393B1 (pt) | 2013-02-13 | 2021-11-30 | Hewlett-Packard Development Company, L.P. | Dispositivo de ejeção de fluido |
KR102161692B1 (ko) | 2013-12-06 | 2020-10-07 | 삼성디스플레이 주식회사 | 잉크젯 프린트 헤드 및 이의 제조 방법 |
US10276468B2 (en) | 2015-03-27 | 2019-04-30 | Hewlett-Packard Development Company, L.P. | Circuit package |
WO2020162927A1 (en) | 2019-02-06 | 2020-08-13 | Hewlett-Packard Development Company, L.P. | Fluid feed path wettability coating |
US11731426B2 (en) | 2019-06-18 | 2023-08-22 | Hewlett-Packard Development Company L.P. | Fluid feed hole corrosion detection |
EP3999346A4 (en) * | 2019-09-06 | 2023-04-05 | Hewlett-Packard Development Company, L.P. | FLUID EJECTION FACE SELECTIVE COATING |
US11666918B2 (en) | 2020-03-06 | 2023-06-06 | Funai Electric Co., Ltd. | Microfluidic chip, head, and dispensing device for dispensing fluids containing an acidic component |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5980682A (en) * | 1998-05-14 | 1999-11-09 | Lexmark International, Inc. | Thermal printhead manufacture |
US6497802B2 (en) | 1999-02-12 | 2002-12-24 | Applied Materials, Inc. | Self ionized plasma sputtering |
US6398929B1 (en) | 1999-10-08 | 2002-06-04 | Applied Materials, Inc. | Plasma reactor and shields generating self-ionized plasma for sputtering |
US20020064592A1 (en) | 2000-11-29 | 2002-05-30 | Madhav Datta | Electroless method of seed layer depostion, repair, and fabrication of Cu interconnects |
JP2002264332A (ja) * | 2001-03-08 | 2002-09-18 | Ricoh Co Ltd | 静電アクチュエータ及びその製造方法及びインクジェット記録ヘッド及びインクジェット記録装置 |
US6596643B2 (en) | 2001-05-07 | 2003-07-22 | Applied Materials, Inc. | CVD TiSiN barrier for copper integration |
US6664633B1 (en) | 2001-09-10 | 2003-12-16 | Lsi Logic Corporation | Alkaline copper plating |
US7025894B2 (en) | 2001-10-16 | 2006-04-11 | Hewlett-Packard Development Company, L.P. | Fluid-ejection devices and a deposition method for layers thereof |
US6797620B2 (en) | 2002-04-16 | 2004-09-28 | Applied Materials, Inc. | Method and apparatus for improved electroplating fill of an aperture |
US6942318B2 (en) | 2002-05-31 | 2005-09-13 | Hewlett-Packard Development Company, L.P. | Chamber having a protective layer |
US6902872B2 (en) | 2002-07-29 | 2005-06-07 | Hewlett-Packard Development Company, L.P. | Method of forming a through-substrate interconnect |
JP2004090279A (ja) * | 2002-08-29 | 2004-03-25 | Seiko Epson Corp | 液体噴射ヘッド及び液体噴射装置 |
JPWO2004025745A1 (ja) * | 2002-09-13 | 2006-01-12 | 松下電器産業株式会社 | 磁気抵抗効果素子およびこの製造方法並びに使用方法 |
US20040112735A1 (en) | 2002-12-17 | 2004-06-17 | Applied Materials, Inc. | Pulsed magnetron for sputter deposition |
WO2005041286A1 (en) * | 2003-10-28 | 2005-05-06 | Semiconductor Energy Laboratory Co., Ltd. | Method for forming wiring, method for manufacturing thin film transistor and droplet discharging method |
US7041226B2 (en) * | 2003-11-04 | 2006-05-09 | Lexmark International, Inc. | Methods for improving flow through fluidic channels |
JP2008108860A (ja) | 2006-10-25 | 2008-05-08 | Elpida Memory Inc | 半導体装置の製造方法 |
-
2009
- 2009-10-28 EP EP09850958.1A patent/EP2493695B1/en not_active Not-in-force
- 2009-10-28 WO PCT/US2009/062406 patent/WO2011053288A1/en active Application Filing
- 2009-10-28 US US13/389,709 patent/US8585180B2/en active Active
- 2009-10-28 CN CN200980162196.1A patent/CN102574399B/zh not_active Expired - Fee Related
-
2012
- 2012-10-10 HK HK12109996.1A patent/HK1169081A1/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
EP2493695A1 (en) | 2012-09-05 |
US8585180B2 (en) | 2013-11-19 |
CN102574399B (zh) | 2015-08-12 |
WO2011053288A1 (en) | 2011-05-05 |
CN102574399A (zh) | 2012-07-11 |
EP2493695B1 (en) | 2019-10-16 |
US20120139997A1 (en) | 2012-06-07 |
EP2493695A4 (en) | 2014-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20211027 |