HK1162742A1 - Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires - Google Patents

Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires

Info

Publication number
HK1162742A1
HK1162742A1 HK12102400.6A HK12102400A HK1162742A1 HK 1162742 A1 HK1162742 A1 HK 1162742A1 HK 12102400 A HK12102400 A HK 12102400A HK 1162742 A1 HK1162742 A1 HK 1162742A1
Authority
HK
Hong Kong
Prior art keywords
semiconductor device
device equipped
bonding wires
manufacturing
wires
Prior art date
Application number
HK12102400.6A
Other languages
Chinese (zh)
Inventor
進藤禎司
太田伸司
Original Assignee
卡西歐計算機株式會社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010134419A external-priority patent/JP2011258896A/en
Priority claimed from JP2011112969A external-priority patent/JP5252027B2/en
Application filed by 卡西歐計算機株式會社 filed Critical 卡西歐計算機株式會社
Publication of HK1162742A1 publication Critical patent/HK1162742A1/en

Links

HK12102400.6A 2010-06-11 2012-03-09 Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires HK1162742A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2010134422 2010-06-11
JP2010134419A JP2011258896A (en) 2010-06-11 2010-06-11 Semiconductor chip and semiconductor device
JP2010134424 2010-06-11
JP2011112969A JP5252027B2 (en) 2010-06-11 2011-05-20 Manufacturing method of semiconductor device

Publications (1)

Publication Number Publication Date
HK1162742A1 true HK1162742A1 (en) 2012-08-31

Family

ID=51452917

Family Applications (1)

Application Number Title Priority Date Filing Date
HK12102400.6A HK1162742A1 (en) 2010-06-11 2012-03-09 Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires

Country Status (1)

Country Link
HK (1) HK1162742A1 (en)

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