HK1162742A1 - Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires
- Google Patents
Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2010134419Aexternal-prioritypatent/JP2011258896A/en
Priority claimed from JP2011112969Aexternal-prioritypatent/JP5252027B2/en
Application filed by 卡西歐計算機株式會社filedCritical卡西歐計算機株式會社
Publication of HK1162742A1publicationCriticalpatent/HK1162742A1/en
HK12102400.6A2010-06-112012-03-09Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires
HK1162742A1
(en)