HK1147597A1 - Die bonder for providing a large bonding force - Google Patents

Die bonder for providing a large bonding force

Info

Publication number
HK1147597A1
HK1147597A1 HK11101599.0A HK11101599A HK1147597A1 HK 1147597 A1 HK1147597 A1 HK 1147597A1 HK 11101599 A HK11101599 A HK 11101599A HK 1147597 A1 HK1147597 A1 HK 1147597A1
Authority
HK
Hong Kong
Prior art keywords
providing
bonding force
die bonder
large bonding
bonder
Prior art date
Application number
HK11101599.0A
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of HK1147597A1 publication Critical patent/HK1147597A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Die Bonding (AREA)
HK11101599.0A 2009-06-12 2011-02-18 Die bonder for providing a large bonding force HK1147597A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/483,529 US8651159B2 (en) 2009-06-12 2009-06-12 Die bonder providing a large bonding force

Publications (1)

Publication Number Publication Date
HK1147597A1 true HK1147597A1 (en) 2011-08-12

Family

ID=43305379

Family Applications (1)

Application Number Title Priority Date Filing Date
HK11101599.0A HK1147597A1 (en) 2009-06-12 2011-02-18 Die bonder for providing a large bonding force

Country Status (5)

Country Link
US (1) US8651159B2 (xx)
KR (1) KR101214832B1 (xx)
CN (1) CN101924050B (xx)
HK (1) HK1147597A1 (xx)
TW (1) TWI480968B (xx)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9105760B2 (en) * 2011-11-07 2015-08-11 Taiwan Semiconductor Manufacturing Company, Ltd. Pick-and-place tool for packaging process
US8387851B1 (en) * 2012-05-04 2013-03-05 Asm Technology Singapore Pte. Ltd. Apparatus for aligning a bonding tool of a die bonder
CH714351A1 (de) * 2017-11-17 2019-05-31 Besi Switzerland Ag Bondkopf für die Montage von Bauelementen.
KR101972742B1 (ko) * 2018-07-31 2019-04-25 위재우 멀티 본딩 동작을 수행하는 다이본더의 디스펜서 장치
KR101972741B1 (ko) * 2018-07-31 2019-04-25 위재우 반도체 칩 패키지용 다이 어태치장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01168033A (ja) * 1987-12-23 1989-07-03 Shinkawa Ltd ダイボンデイング装置
JP2501946B2 (ja) * 1990-09-26 1996-05-29 三菱電機株式会社 ダイボンド装置およびその制御方法
US6651866B2 (en) * 2001-10-17 2003-11-25 Lilogix, Inc. Precision bond head for mounting semiconductor chips
JP2003243527A (ja) * 2002-02-15 2003-08-29 Hitachi Ltd 半導体装置の製造方法
JP2004200379A (ja) * 2002-12-18 2004-07-15 Renesas Technology Corp ダイボンディング装置及びそれを用いたダイボンディング方法
JP4166620B2 (ja) * 2003-05-13 2008-10-15 オリンパス株式会社 半導体接合装置
US7303111B2 (en) * 2005-10-14 2007-12-04 Asm Technology Singapore Pte. Ltd. Lightweight bondhead assembly
US20090289098A1 (en) * 2005-12-06 2009-11-26 Katsumi Terada Chip Mounting Apparatus and Chip Mounting Method
US7727800B2 (en) * 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. High precision die bonding apparatus

Also Published As

Publication number Publication date
US8651159B2 (en) 2014-02-18
KR20100133896A (ko) 2010-12-22
CN101924050A (zh) 2010-12-22
US20100314050A1 (en) 2010-12-16
KR101214832B1 (ko) 2012-12-24
TW201103096A (en) 2011-01-16
CN101924050B (zh) 2012-02-29
TWI480968B (zh) 2015-04-11

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