HK1141058A1 - Application of insoluble anode in electroplating - Google Patents
Application of insoluble anode in electroplatingInfo
- Publication number
- HK1141058A1 HK1141058A1 HK10107321.3A HK10107321A HK1141058A1 HK 1141058 A1 HK1141058 A1 HK 1141058A1 HK 10107321 A HK10107321 A HK 10107321A HK 1141058 A1 HK1141058 A1 HK 1141058A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- electroplating
- application
- insoluble anode
- insoluble
- anode
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK10107321.3A HK1141058A1 (en) | 2008-10-31 | 2010-07-31 | Application of insoluble anode in electroplating |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
HK08112027A HK1130396A2 (en) | 2008-10-31 | 2008-10-31 | Application of insoluble anode in electroplating |
HK10107321.3A HK1141058A1 (en) | 2008-10-31 | 2010-07-31 | Application of insoluble anode in electroplating |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1141058A1 true HK1141058A1 (en) | 2010-10-29 |
Family
ID=41502200
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08112027A HK1130396A2 (en) | 2008-10-31 | 2008-10-31 | Application of insoluble anode in electroplating |
HK10107321.3A HK1141058A1 (en) | 2008-10-31 | 2010-07-31 | Application of insoluble anode in electroplating |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK08112027A HK1130396A2 (en) | 2008-10-31 | 2008-10-31 | Application of insoluble anode in electroplating |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN101724881B (en) |
HK (2) | HK1130396A2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104005077B (en) * | 2014-05-14 | 2016-11-09 | 上海交通大学 | The electroplanting device of optimized temperature field distribution and electro-plating method thereof |
CN109853007A (en) * | 2019-04-01 | 2019-06-07 | 东莞市合航精密科技有限公司 | A kind of high speed light plate silver plating solution and preparation method thereof and electroplating technology |
CN114438563A (en) * | 2022-02-18 | 2022-05-06 | 崇辉半导体有限公司 | System for automatically supplementing silver ions, silver spraying and plating system and silver spraying and plating process |
-
2008
- 2008-10-31 HK HK08112027A patent/HK1130396A2/en unknown
-
2009
- 2009-10-27 CN CN2009102066676A patent/CN101724881B/en not_active Expired - Fee Related
-
2010
- 2010-07-31 HK HK10107321.3A patent/HK1141058A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
CN101724881A (en) | 2010-06-09 |
CN101724881B (en) | 2011-08-17 |
HK1130396A2 (en) | 2009-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20181031 |