HK1123924A1 - Cooling method, cooling system and cooling apparatus - Google Patents

Cooling method, cooling system and cooling apparatus

Info

Publication number
HK1123924A1
HK1123924A1 HK09101605.6A HK09101605A HK1123924A1 HK 1123924 A1 HK1123924 A1 HK 1123924A1 HK 09101605 A HK09101605 A HK 09101605A HK 1123924 A1 HK1123924 A1 HK 1123924A1
Authority
HK
Hong Kong
Prior art keywords
cooling
cooling system
cooling apparatus
cooling method
Prior art date
Application number
HK09101605.6A
Other languages
English (en)
Inventor
Wen Zhang
Original Assignee
Wen Zhang
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wen Zhang filed Critical Wen Zhang
Publication of HK1123924A1 publication Critical patent/HK1123924A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
HK09101605.6A 2007-10-12 2009-02-19 Cooling method, cooling system and cooling apparatus HK1123924A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2007101822408A CN101252821B (zh) 2007-10-12 2007-10-12 一种散热方法、散热系统及散热装置

Publications (1)

Publication Number Publication Date
HK1123924A1 true HK1123924A1 (en) 2009-06-26

Family

ID=39955960

Family Applications (1)

Application Number Title Priority Date Filing Date
HK09101605.6A HK1123924A1 (en) 2007-10-12 2009-02-19 Cooling method, cooling system and cooling apparatus

Country Status (4)

Country Link
US (1) US8488318B2 (xx)
CN (1) CN101252821B (xx)
HK (1) HK1123924A1 (xx)
WO (1) WO2009046647A1 (xx)

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CN101252821B (zh) * 2007-10-12 2010-09-08 张文 一种散热方法、散热系统及散热装置
CN102196714A (zh) * 2011-03-22 2011-09-21 网拓(上海)通信技术有限公司 一种散热装置
US9310860B2 (en) 2011-06-15 2016-04-12 Hewlett-Packard Development Company, L.P. Thermal chamber partition and fan unit for computer system
US20130115869A1 (en) * 2011-11-04 2013-05-09 International Business Machines Corporation Directed server rack air flow
CN202533862U (zh) * 2012-02-23 2012-11-14 周哲明 一种低噪音的电脑散热设备
CN105593988B (zh) * 2013-10-02 2019-02-22 日产自动车株式会社 散热系统
CN103997839B (zh) * 2014-06-06 2018-03-30 同方威视技术股份有限公司 一种准直可调制的x射线发生器
CN105929919A (zh) * 2016-06-07 2016-09-07 浪潮电子信息产业股份有限公司 一种基于无叶静音风扇的服务器及降噪的方法
WO2018053823A1 (zh) * 2016-09-26 2018-03-29 深圳市大疆创新科技有限公司 散热结构及具有该散热结构的无人机
WO2018107353A1 (zh) * 2016-12-13 2018-06-21 华为技术有限公司 监测设备的散热状态的设备、装置和方法
JP2018182243A (ja) * 2017-04-21 2018-11-15 日本電気株式会社 設置金具及び屋外設置装置
CN109240459B (zh) * 2018-08-16 2021-08-10 郑州云海信息技术有限公司 一种散热装置
CN109288523B (zh) * 2018-10-12 2022-06-28 上海联影医疗科技股份有限公司 一种发射线圈的散热结构及发射线圈
FR3087618B1 (fr) 2018-10-23 2020-10-02 Valeo Systemes Thermiques Dispositif de dissipation thermique, notamment pour dispositif de generation d’un flux d’air
CN109656337B (zh) * 2018-11-10 2022-05-24 钦州学院 嵌入式计算机散热装置
CN109358720A (zh) * 2018-11-27 2019-02-19 华研科技（大连）有限公司 一种用于电脑冷却系统的防尘过滤装置及方法
CN209879238U (zh) * 2019-04-29 2019-12-31 中强光电股份有限公司 散热装置及投影机
US10645832B1 (en) * 2019-05-02 2020-05-05 Apple Inc. Computer tower architecture
JP7222880B2 (ja) * 2019-12-26 2023-02-15 キヤノン電子管デバイス株式会社 Ｘ線管梱包装置
CN111208873B (zh) * 2020-01-07 2023-06-13 广州集韵信息科技有限公司 一种电子计算机软硬件一体机
CN111459257B (zh) * 2020-06-22 2020-09-18 北京中航科电测控技术股份有限公司 一种具有热保护结构的加固计算机板卡及其使用方法
CN112068680A (zh) * 2020-09-11 2020-12-11 南阳理工学院 一种辐流主机散热器及计算机
CN113284708B (zh) * 2021-04-09 2022-10-18 国网四川省电力公司电力科学研究院 具有三维离散扩展表面的电力变压器油散热系统
CN113391686B (zh) * 2021-07-04 2024-05-03 上海极算信息技术有限公司 一种信息系统集成用智能散热的计算机
CN114047805B (zh) * 2021-11-01 2022-06-14 广东上品电子科技有限公司 一种环保型主板用固定散热一体化装置
CN115085511B (zh) * 2022-05-31 2024-08-30 郑州枫伙电力科技有限公司 一种风电机组变流器风冷系统
CN114793301A (zh) * 2022-06-13 2022-07-26 成都迅翼卫通科技有限公司 一种地面网卫星网智能调度装置
CN118466722A (zh) * 2024-07-11 2024-08-09 沈阳宸骏鑫科技有限公司 一种计算机的主机设备

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US5297005A (en) * 1992-09-28 1994-03-22 Energy Innovations, Inc. Apparatus and method for cooling heat generating electronic components in a cabinet
TW265430B (en) * 1994-06-30 1995-12-11 Intel Corp Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system
US6113485A (en) * 1997-11-26 2000-09-05 Advanced Micro Devices, Inc. Duct processor cooling for personal computer
DE19804904C1 (de) * 1998-02-07 1999-11-11 Loh Kg Rittal Werk Schaltschrank mit Einrichtungen zum Kühlen der Innenraum-Warmluft
CN2425381Y (zh) * 2000-05-18 2001-03-28 祯儒工业有限公司 一种散热装置
US6940716B1 (en) * 2000-07-13 2005-09-06 Intel Corporation Method and apparatus for dissipating heat from an electronic device
TW588932U (en) * 2000-12-20 2004-05-21 Foxconn Prec Components Co Ltd Heat sink module
KR200279417Y1 (ko) * 2002-03-11 2002-06-24 김휘철 Ｐｃ용 전기소자의 냉각구조
US6690577B2 (en) * 2002-07-02 2004-02-10 Hewlett-Packard Development Company, L.P. Air guide
TW582582U (en) * 2002-11-22 2004-04-01 Hon Hai Prec Ind Co Ltd Ventilation device for computer system
US6920044B2 (en) * 2003-10-03 2005-07-19 Chuan-Hung Lin Extendible and flexible heat-dissipation air conduit base as computer heat dissipation device
US7133284B2 (en) * 2003-10-16 2006-11-07 Etasis Electronics Corporation Power supply without cooling fan
KR100624092B1 (ko) * 2004-09-16 2006-09-18 잘만테크 주식회사 컴퓨터
CN2757219Y (zh) * 2004-12-09 2006-02-08 协禧电机股份有限公司 显示卡散热器
CN2763888Y (zh) * 2004-12-24 2006-03-08 富准精密工业(深圳)有限公司 导风装置
TW200801900A (en) * 2006-06-30 2008-01-01 Aopen Inc Airflow guide device and computer chassis with airflow guide device
CN1946277A (zh) * 2006-10-30 2007-04-11 陈鸿文 高效无风扇散热装置
CN101252821B (zh) * 2007-10-12 2010-09-08 张文 一种散热方法、散热系统及散热装置

Also Published As

Publication number Publication date
US8488318B2 (en) 2013-07-16
CN101252821B (zh) 2010-09-08
WO2009046647A1 (en) 2009-04-16
CN101252821A (zh) 2008-08-27
US20100214736A1 (en) 2010-08-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20141012