HK1121904A1 - Imaging apparatus for fully automatic screen printer - Google Patents

Imaging apparatus for fully automatic screen printer

Info

Publication number
HK1121904A1
HK1121904A1 HK08111680.4A HK08111680A HK1121904A1 HK 1121904 A1 HK1121904 A1 HK 1121904A1 HK 08111680 A HK08111680 A HK 08111680A HK 1121904 A1 HK1121904 A1 HK 1121904A1
Authority
HK
Hong Kong
Prior art keywords
imaging apparatus
fully automatic
screen printer
automatic screen
printer
Prior art date
Application number
HK08111680.4A
Other languages
English (en)
Inventor
Xianmin Zhang
Yongcong Kuang
Yuequan Tang
Original Assignee
Univ South China Tech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CNB2006101238934A external-priority patent/CN100421453C/zh
Priority claimed from CNB2006101238949A external-priority patent/CN100440929C/zh
Application filed by Univ South China Tech filed Critical Univ South China Tech
Publication of HK1121904A1 publication Critical patent/HK1121904A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing

Landscapes

  • Immunology (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Cameras In General (AREA)
  • Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
HK08111680.4A 2006-11-30 2008-10-23 Imaging apparatus for fully automatic screen printer HK1121904A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CNB2006101238934A CN100421453C (zh) 2006-11-30 2006-11-30 用于锡膏印刷的l型双镜头图像采集装置
CNB2006101238949A CN100440929C (zh) 2006-11-30 2006-11-30 一种用于全自动锡膏印刷机的t型双镜头图像采集装置

Publications (1)

Publication Number Publication Date
HK1121904A1 true HK1121904A1 (en) 2009-04-30

Family

ID=38776346

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08111680.4A HK1121904A1 (en) 2006-11-30 2008-10-23 Imaging apparatus for fully automatic screen printer

Country Status (5)

Country Link
US (3) US8115973B2 (xx)
EP (1) EP1928219B1 (xx)
CA (1) CA2594884C (xx)
DE (1) DE602007011382D1 (xx)
HK (1) HK1121904A1 (xx)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5775439B2 (ja) * 2011-12-06 2015-09-09 新電子株式会社 スクリーン印刷用製版の検査装置
CN208386734U (zh) * 2018-06-14 2019-01-15 Oppo广东移动通信有限公司 摄像头模组和电子装置
CN109927401A (zh) * 2019-01-31 2019-06-25 中国科学院西安光学精密机械研究所 一种高精度印刷机双光路机器视觉装置
US11947094B1 (en) * 2023-03-23 2024-04-02 Illinois Tool Works Inc. Dual camera prism assembly for stencil printer

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2775921B2 (ja) * 1989-11-10 1998-07-16 松下電器産業株式会社 スクリーンマスクのパターン孔の検査方法
JPH07198335A (ja) * 1993-12-28 1995-08-01 Omron Corp Ｉｃチップのパッケージまたはプリント・パターンの外接位置検出装置および方法
JPH07311025A (ja) * 1994-05-17 1995-11-28 Komatsu Ltd ３次元形状検査装置
JPH08156224A (ja) * 1994-12-01 1996-06-18 Matsushita Electric Ind Co Ltd スクリーン印刷装置
US6123024A (en) * 1998-01-15 2000-09-26 Alpha Metals, Inc. Stencil incorporating electronic tag
JPH11245369A (ja) * 1998-02-27 1999-09-14 Tenryu Seiki Kk 画像認識装置及びクリームはんだ印刷装置
US20070102477A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Imaging system and method for a stencil printer
US20070102478A1 (en) * 2005-11-10 2007-05-10 Speedline Technologies, Inc. Optimal imaging system and method for a stencil printer
JP4696861B2 (ja) * 2005-11-11 2011-06-08 パナソニック株式会社 スクリーン印刷装置

Also Published As

Publication number Publication date
EP1928219B1 (en) 2010-12-22
US8115973B2 (en) 2012-02-14
DE602007011382D1 (de) 2011-02-03
US20080130068A1 (en) 2008-06-05
US20110234870A1 (en) 2011-09-29
EP1928219A2 (en) 2008-06-04
EP1928219A3 (en) 2009-12-30
CA2594884A1 (en) 2008-05-30
CA2594884C (en) 2011-12-06
US20120098956A1 (en) 2012-04-26

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20190924