HK1121873A1 - Method and apparatus for communication in single device and method for communication in device - Google Patents

Method and apparatus for communication in single device and method for communication in device

Info

Publication number
HK1121873A1
HK1121873A1 HK08113014.7A HK08113014A HK1121873A1 HK 1121873 A1 HK1121873 A1 HK 1121873A1 HK 08113014 A HK08113014 A HK 08113014A HK 1121873 A1 HK1121873 A1 HK 1121873A1
Authority
HK
Hong Kong
Prior art keywords
communication
single device
Prior art date
Application number
HK08113014.7A
Other languages
English (en)
Inventor
Ahmadreza Rofougaran
Original Assignee
Broadcom Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Broadcom Corp filed Critical Broadcom Corp
Publication of HK1121873A1 publication Critical patent/HK1121873A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W28/00—Network traffic management; Network resource management
    • H04W28/02—Traffic management, e.g. flow control or congestion control
    • H04W28/10—Flow control between communication endpoints
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L12/00—Data switching networks
    • H04L12/28—Data switching networks characterised by path configuration, e.g. LAN [Local Area Networks] or WAN [Wide Area Networks]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W84/00—Network topologies
    • H04W84/18—Self-organising networks, e.g. ad-hoc networks or sensor networks

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Transceivers (AREA)
  • Transmitters (AREA)
HK08113014.7A 2006-12-30 2008-11-28 Method and apparatus for communication in single device and method for communication in device HK1121873A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11/648,755 US8149818B2 (en) 2006-12-30 2006-12-30 Mesh network within a device

Publications (1)

Publication Number Publication Date
HK1121873A1 true HK1121873A1 (en) 2009-04-30

Family

ID=39310325

Family Applications (1)

Application Number Title Priority Date Filing Date
HK08113014.7A HK1121873A1 (en) 2006-12-30 2008-11-28 Method and apparatus for communication in single device and method for communication in device

Country Status (6)

Country Link
US (1) US8149818B2 (fr)
EP (1) EP1940087B1 (fr)
KR (1) KR100931899B1 (fr)
CN (1) CN101212231B (fr)
HK (1) HK1121873A1 (fr)
TW (1) TWI371175B (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8724623B2 (en) * 2008-11-25 2014-05-13 Broadcom Corporation Switch fabric with wireless intra-connectivity
US8923765B2 (en) * 2010-01-27 2014-12-30 Broadcom Corporation Establishing a wireless communications bus and applications thereof
US8971806B2 (en) 2010-01-27 2015-03-03 Broadcom Corporation Wireless bus for intra-chip and inter-chip communication, including scalable wireless bus embodiments
US8655299B2 (en) * 2010-06-03 2014-02-18 Broadcom Corporation Saw-less receiver with RF frequency translated BPF
US8761710B2 (en) * 2010-06-03 2014-06-24 Broadcom Corporation Portable computing device with a saw-less transceiver
TWI485995B (zh) * 2010-06-03 2015-05-21 Broadcom Corp 可攜式計算裝置
CN103684508A (zh) * 2012-09-12 2014-03-26 苏佳宁 运用于复杂环境下的低功耗无线传输模块架构
TWI548247B (zh) * 2014-09-18 2016-09-01 緯創資通股份有限公司 無線通訊裝置
CN105552501A (zh) * 2016-02-17 2016-05-04 北京艾达方武器装备技术研究所 一种电磁波互联器件和方法及其应用
CN114238189B (zh) * 2021-11-30 2024-01-30 浙江灵鹿智能科技有限公司 一种自动分配地址的方法、装置和系统

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US20030010998A1 (en) * 2001-07-10 2003-01-16 Motorola, Inc. Apparatus and techniques for implementing wireless communication between integrated transmitters and integrated receivers
US6624787B2 (en) * 2001-10-01 2003-09-23 Raytheon Company Slot coupled, polarized, egg-crate radiator
CA2488865A1 (fr) * 2002-07-15 2004-01-22 Integra5 Communications Inc Procede de gestion de transmission au courant du contexte
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US7420952B2 (en) * 2002-10-28 2008-09-02 Mesh Dynamics, Inc. High performance wireless networks using distributed control
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US20050075080A1 (en) * 2003-10-03 2005-04-07 Nanyang Technological University Inter-chip and intra-chip wireless communications systems
US9813152B2 (en) * 2004-01-14 2017-11-07 Luxtera, Inc. Method and system for optoelectronics transceivers integrated on a CMOS chip
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KR20050121878A (ko) * 2004-06-23 2005-12-28 주식회사 팬택앤큐리텔 이동 통신 단말기에서 보드간 통신 장치
US20060095539A1 (en) * 2004-10-29 2006-05-04 Martin Renkis Wireless video surveillance system and method for mesh networking
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CN102348293B (zh) * 2005-02-01 2014-06-25 Exs有限公司 用于无线接入的分层网格网络
US7466660B2 (en) * 2005-02-11 2008-12-16 Interdigital Technology Corporation Method and apparatus for processing packets originating from local and neighboring basic service sets
US7586888B2 (en) * 2005-02-17 2009-09-08 Mobitrum Corporation Method and system for mesh network embedded devices
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US8599822B2 (en) * 2005-03-23 2013-12-03 Cisco Technology, Inc. Slot-based transmission synchronization mechanism in wireless mesh networks
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Also Published As

Publication number Publication date
KR20080063221A (ko) 2008-07-03
CN101212231B (zh) 2011-05-18
EP1940087B1 (fr) 2015-12-30
US20080160926A1 (en) 2008-07-03
EP1940087A2 (fr) 2008-07-02
CN101212231A (zh) 2008-07-02
KR100931899B1 (ko) 2009-12-15
TW200843375A (en) 2008-11-01
EP1940087A3 (fr) 2010-01-06
TWI371175B (en) 2012-08-21
US8149818B2 (en) 2012-04-03

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