HK1083622A1 - Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substr ate - Google Patents

Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substr ate

Info

Publication number
HK1083622A1
HK1083622A1 HK06103707A HK06103707A HK1083622A1 HK 1083622 A1 HK1083622 A1 HK 1083622A1 HK 06103707 A HK06103707 A HK 06103707A HK 06103707 A HK06103707 A HK 06103707A HK 1083622 A1 HK1083622 A1 HK 1083622A1
Authority
HK
Hong Kong
Prior art keywords
metal
ceramic
ceramic composite
production
produced according
Prior art date
Application number
HK06103707A
Other languages
English (en)
Inventor
Juergen Schulz-Harder
Original Assignee
Electrovac Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=7701089&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=HK1083622(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Electrovac Ag filed Critical Electrovac Ag
Publication of HK1083622A1 publication Critical patent/HK1083622A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/021—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles in a direct manner, e.g. direct copper bonding [DCB]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2315/00—Other materials containing non-metallic inorganic compounds not provided for in groups B32B2311/00 - B32B2313/04
    • B32B2315/02—Ceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6583—Oxygen containing atmosphere, e.g. with changing oxygen pressures
    • C04B2235/6584—Oxygen containing atmosphere, e.g. with changing oxygen pressures at an oxygen percentage below that of air
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/343—Alumina or aluminates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
    • C04B2237/54—Oxidising the surface before joining
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Products (AREA)
  • Manufacture And Refinement Of Metals (AREA)
HK06103707A 2001-10-01 2006-03-24 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substr ate HK1083622A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10148550A DE10148550B4 (de) 2001-10-01 2001-10-01 Verfahren zum Herstellen von Metall-Keramik-Verbundmaterialien, insbesondere Metall-Keramik-Substraten
PCT/DE2002/003275 WO2003031372A2 (de) 2001-10-01 2002-09-05 Verfahren zum herstellen von metall-keramik-verbundmaterialien, insbesondere metall-keramik-substraten sowie nach diesem verfahren hergestelltes keramik-verbundmaterial, insbesondere metall-keramik-substrat

Publications (1)

Publication Number Publication Date
HK1083622A1 true HK1083622A1 (en) 2006-07-07

Family

ID=7701089

Family Applications (1)

Application Number Title Priority Date Filing Date
HK06103707A HK1083622A1 (en) 2001-10-01 2006-03-24 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates and ceramic composite material produced according to said method, especially a metal-ceramic substr ate

Country Status (8)

Country Link
US (1) US7036711B2 (xx)
EP (1) EP1412307B1 (xx)
JP (1) JP4435567B2 (xx)
CN (1) CN100347134C (xx)
AU (1) AU2002340725A1 (xx)
DE (2) DE10148550B4 (xx)
HK (1) HK1083622A1 (xx)
WO (1) WO2003031372A2 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004033933B4 (de) * 2004-07-08 2009-11-05 Electrovac Ag Verfahren zum Herstellen eines Metall-Keramik-Substrates
DE102004056879B4 (de) * 2004-10-27 2008-12-04 Curamik Electronics Gmbh Verfahren zum Herstellen eines Metall-Keramik-Substrates
EP2389368B1 (en) 2009-01-23 2015-06-17 Merck Sharp & Dohme Corp. Bridged and fused antidiabetic compounds
DE102010007919B4 (de) 2010-02-12 2022-03-03 Rogers Germany Gmbh Verfahren zum Herstellen von Metall-Keramik-Substraten sowie nach diesem Verfahren hergestelltes Metall-Keramik-Substrat
JP6236753B2 (ja) * 2012-06-28 2017-11-29 株式会社豊田自動織機 半導体基板の製造方法
CN104276837B (zh) * 2013-07-12 2016-09-07 中国科学院上海硅酸盐研究所 金属玻璃化的封接方法
DE102016118784A1 (de) 2016-10-04 2018-04-05 Infineon Technologies Ag Chipträger, konfiguriert zur delaminierungsfreien Kapselung und stabilen Sinterung

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2011681A1 (de) 1970-03-12 1971-09-30 Menges, Heinz Georg, 6078 Neu-Isenburg Kreiselhub Rotor
US3766634A (en) * 1972-04-20 1973-10-23 Gen Electric Method of direct bonding metals to non-metallic substrates
US3994430A (en) 1975-07-30 1976-11-30 General Electric Company Direct bonding of metals to ceramics and metals
US4129243A (en) * 1975-07-30 1978-12-12 General Electric Company Double side cooled, pressure mounted semiconductor package and process for the manufacture thereof
US4278195A (en) * 1978-12-01 1981-07-14 Honeywell Inc. Method for low temperature bonding of silicon and silicon on sapphire and spinel to nickel and nickel steel and apparatus using such _a bonding technique
DE3036128C2 (de) * 1980-09-25 1983-08-18 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten Verbinden von Kupferfolien mit Oxidkeramiksubstraten
DE3204167A1 (de) 1982-02-06 1983-08-11 Brown, Boveri & Cie Ag, 6800 Mannheim Verfahren zum direkten verbinden von metallstuecken mit oxidkeramiksubstraten
US5340655A (en) * 1986-05-08 1994-08-23 Lanxide Technology Company, Lp Method of making shaped ceramic composites with the use of a barrier and articles produced thereby
JPH07502B2 (ja) * 1989-03-01 1995-01-11 同和鉱業株式会社 非酸化物系セラミックスのメタライズ方法
US5108026A (en) * 1991-05-14 1992-04-28 Motorola Inc. Eutectic bonding of metal to ceramic
AT408345B (de) * 1999-11-17 2001-10-25 Electrovac Verfahren zur festlegung eines aus metall-matrix- composite-(mmc-) materiales gebildeten körpers auf einem keramischen körper
DE20116816U1 (de) * 2001-10-17 2002-04-04 Schulz Harder Juergen Kapsel zum Herstellen von Metall-Keramik-Verbundmaterialien, insbesondere Metall-Keramik-Substraten

Also Published As

Publication number Publication date
DE50205049D1 (de) 2005-12-29
JP2005504713A (ja) 2005-02-17
US20040026482A1 (en) 2004-02-12
DE10148550A1 (de) 2003-04-17
JP4435567B2 (ja) 2010-03-17
WO2003031372A3 (de) 2003-08-28
EP1412307B1 (de) 2005-11-23
US7036711B2 (en) 2006-05-02
CN1692090A (zh) 2005-11-02
CN100347134C (zh) 2007-11-07
EP1412307A2 (de) 2004-04-28
DE10148550B4 (de) 2007-03-29
AU2002340725A1 (en) 2003-04-22
WO2003031372A2 (de) 2003-04-17

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180905