HK1079555A1 - Sputtering apparatus and method for forming film - Google Patents

Sputtering apparatus and method for forming film

Info

Publication number
HK1079555A1
HK1079555A1 HK05111426A HK05111426A HK1079555A1 HK 1079555 A1 HK1079555 A1 HK 1079555A1 HK 05111426 A HK05111426 A HK 05111426A HK 05111426 A HK05111426 A HK 05111426A HK 1079555 A1 HK1079555 A1 HK 1079555A1
Authority
HK
Hong Kong
Prior art keywords
sputtering apparatus
forming film
film
forming
sputtering
Prior art date
Application number
HK05111426A
Inventor
Koki Chiba
Yizhou Song
Takeshi Sakurai
Original Assignee
Shincron Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shincron Co Ltd filed Critical Shincron Co Ltd
Publication of HK1079555A1 publication Critical patent/HK1079555A1/en

Links

HK05111426A 2004-03-19 2005-12-12 Sputtering apparatus and method for forming film HK1079555A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004079710A JP4491262B2 (en) 2004-03-19 2004-03-19 Sputtering apparatus and thin film forming method

Publications (1)

Publication Number Publication Date
HK1079555A1 true HK1079555A1 (en) 2006-04-07

Family

ID=35041671

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05111426A HK1079555A1 (en) 2004-03-19 2005-12-12 Sputtering apparatus and method for forming film

Country Status (3)

Country Link
JP (1) JP4491262B2 (en)
CN (1) CN100406612C (en)
HK (1) HK1079555A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050103267A1 (en) 2003-11-14 2005-05-19 Hur Gwang H. Flat panel display manufacturing apparatus
JP4728143B2 (en) * 2006-02-27 2011-07-20 株式会社シンクロン Thin film forming equipment
US20080257263A1 (en) * 2007-04-23 2008-10-23 Applied Materials, Inc. Cooling shield for substrate processing chamber
CN101820092B (en) * 2009-02-26 2012-10-31 信义汽车玻璃(深圳)有限公司 Double-faced film sticking device for antenna terminal
JP5374590B2 (en) * 2009-09-01 2013-12-25 東京エレクトロン株式会社 Sputtering equipment
TWI443211B (en) 2010-05-05 2014-07-01 Hon Hai Prec Ind Co Ltd Sputtering device
CN102234772B (en) * 2010-05-06 2014-03-26 鸿富锦精密工业（深圳）有限公司 Coating device
CN102324368A (en) * 2011-08-29 2012-01-18 安徽鑫昊等离子显示器件有限公司 Sputtering anode cap and sputtering device
CN103074587B (en) * 2013-02-01 2014-10-15 湘潭宏大真空技术股份有限公司 Adjusting device and adjusting method for large-area continuous magnetron sputtering coating uniformity
CN107723672A (en) * 2017-11-10 2018-02-23 苏州求是真空电子有限公司 A kind of columnar target butterfly with thickness debugging functions
US20200010948A1 (en) * 2018-07-05 2020-01-09 Beijing Apollo Ding Rong Solar Technology Co., Ltd. Shielded sputter deposition apparatus and method
CN109576667B (en) * 2018-12-18 2020-08-18 中国科学院力学研究所 Method for improving uniformity of PVD (physical vapor deposition) film layer of large-scale die
CN109881165A (en) * 2019-03-11 2019-06-14 信利光电股份有限公司 A kind of film coating correction plate
CN112522671B (en) * 2019-09-19 2023-05-02 中国科学院长春光学精密机械与物理研究所 Magnetron sputtering method, device, equipment and readable storage medium
JP7111380B2 (en) * 2020-04-01 2022-08-02 株式会社シンクロン Sputtering device and film forming method using the same
CN117488248B (en) * 2024-01-02 2024-03-12 上海米蜂激光科技有限公司 Correction plate design method, correction plate, coating device and coating method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61183464A (en) * 1985-02-07 1986-08-16 Nec Corp Sputtering device
JPS63103068A (en) * 1986-10-20 1988-05-07 Tokyo Electron Ltd Sputtering device
CA2164331C (en) * 1994-08-09 1999-03-30 Yasuo Ikeda Writing implement
JPH1075677A (en) * 1996-09-02 1998-03-24 Masaaki Edamoto Feces treating bag for pet
JPH10330933A (en) * 1997-05-29 1998-12-15 Toshiba Corp Sputtering device and production of thermal print head
JP3774353B2 (en) * 2000-02-25 2006-05-10 株式会社シンクロン Method and apparatus for forming metal compound thin film
JP2002146525A (en) * 2000-11-13 2002-05-22 Canon Inc Sputter deposition system
JP4296256B2 (en) * 2001-11-22 2009-07-15 独立行政法人情報通信研究機構 Manufacturing method of superconducting material

Also Published As

Publication number Publication date
JP4491262B2 (en) 2010-06-30
JP2005264250A (en) 2005-09-29
CN100406612C (en) 2008-07-30
CN1670238A (en) 2005-09-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20180709