HK1076425A1 - A synthetic resin molded article and a method of manufacturing thereof - Google Patents

A synthetic resin molded article and a method of manufacturing thereof

Info

Publication number
HK1076425A1
HK1076425A1 HK05108404.8A HK05108404A HK1076425A1 HK 1076425 A1 HK1076425 A1 HK 1076425A1 HK 05108404 A HK05108404 A HK 05108404A HK 1076425 A1 HK1076425 A1 HK 1076425A1
Authority
HK
Hong Kong
Prior art keywords
manufacturing
synthetic resin
molded article
resin molded
article
Prior art date
Application number
HK05108404.8A
Other languages
English (en)
Inventor
Hiroyuki Nakamura
Akio Matsuda
Original Assignee
Kabushikikaisha Sakaiya
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kabushikikaisha Sakaiya filed Critical Kabushikikaisha Sakaiya
Publication of HK1076425A1 publication Critical patent/HK1076425A1/xx

Links

Classifications

    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/14—Fastening of cover or lid to box
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V33/00—Structural combinations of lighting devices with other articles, not otherwise provided for
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02B—BOARDS, SUBSTATIONS OR SWITCHING ARRANGEMENTS FOR THE SUPPLY OR DISTRIBUTION OF ELECTRIC POWER
    • H02B1/00—Frameworks, boards, panels, desks, casings; Details of substations or switching arrangements
    • H02B1/26—Casings; Parts thereof or accessories therefor
    • H02B1/40—Wall-mounted casings; Parts thereof or accessories therefor
    • H02B1/42—Mounting of devices therein
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/02—Details
    • H02G3/08—Distribution boxes; Connection or junction boxes
    • H02G3/12—Distribution boxes; Connection or junction boxes for flush mounting
    • H02G3/121—Distribution boxes; Connection or junction boxes for flush mounting in plain walls
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02G—INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINED OPTICAL AND ELECTRIC CABLES OR LINES
    • H02G3/00—Installations of electric cables or lines or protective tubing therefor in or on buildings, equivalent structures or vehicles
    • H02G3/36—Installations of cables or lines in walls, floors or ceilings
    • H02G3/38—Installations of cables or lines in walls, floors or ceilings the cables or lines being installed in preestablished conduits or ducts
    • H02G3/381—Installations of cables or lines in walls, floors or ceilings the cables or lines being installed in preestablished conduits or ducts in ceilings

Landscapes

  • Engineering & Computer Science (AREA)
  • Architecture (AREA)
  • Civil Engineering (AREA)
  • Structural Engineering (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
HK05108404.8A 2004-02-12 2005-09-23 A synthetic resin molded article and a method of manufacturing thereof HK1076425A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004035368A JP3988082B2 (ja) 2004-02-12 2004-02-12 合成樹脂成形品及びその製造方法

Publications (1)

Publication Number Publication Date
HK1076425A1 true HK1076425A1 (en) 2006-01-20

Family

ID=34908341

Family Applications (1)

Application Number Title Priority Date Filing Date
HK05108404.8A HK1076425A1 (en) 2004-02-12 2005-09-23 A synthetic resin molded article and a method of manufacturing thereof

Country Status (4)

Country Link
JP (1) JP3988082B2 (xx)
KR (1) KR100620279B1 (xx)
CN (1) CN100427287C (xx)
HK (1) HK1076425A1 (xx)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4742341B2 (ja) * 2005-11-07 2011-08-10 株式会社サカイヤ リング一体式表示盤の製造方法
JP4946275B2 (ja) * 2006-08-31 2012-06-06 カシオ計算機株式会社 文字板および時計
FR2916380B1 (fr) * 2007-05-21 2009-07-31 Saint Gobain Procede et dispositif de surmoulage d'un element vitre par une portion de joint comportant un insert, vitrage et insert notamment pour ce procede.
JP5244426B2 (ja) * 2008-03-12 2013-07-24 カルソニックカンセイ株式会社 表皮材インサート成形装置および成形方法
JP5542718B2 (ja) * 2010-06-07 2014-07-09 パナソニック株式会社 樹脂成形方法および金型装置
JP5187426B2 (ja) * 2011-10-28 2013-04-24 カシオ計算機株式会社 文字板、成形用金型および時計
JP7231402B2 (ja) * 2018-12-21 2023-03-01 花王株式会社 加飾用シート

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06106562A (ja) * 1992-09-29 1994-04-19 Nissha Printing Co Ltd インサート成形品の製造方法
US5804117A (en) * 1994-04-05 1998-09-08 Toyoda Gosei Co., Ltd. Molding method for resin articles
JP3740558B2 (ja) * 2000-12-13 2006-02-01 サカイヤ銘版株式会社 合成樹脂成形品及びその製造方法

Also Published As

Publication number Publication date
JP3988082B2 (ja) 2007-10-10
KR100620279B1 (ko) 2006-09-14
CN1654184A (zh) 2005-08-17
KR20050081142A (ko) 2005-08-18
CN100427287C (zh) 2008-10-22
JP2005225050A (ja) 2005-08-25

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20160512