HK1067796A1 - Bending a tab flex circuit via cantilevered leads. - Google Patents

Bending a tab flex circuit via cantilevered leads.

Info

Publication number
HK1067796A1
HK1067796A1 HK04109776A HK04109776A HK1067796A1 HK 1067796 A1 HK1067796 A1 HK 1067796A1 HK 04109776 A HK04109776 A HK 04109776A HK 04109776 A HK04109776 A HK 04109776A HK 1067796 A1 HK1067796 A1 HK 1067796A1
Authority
HK
Hong Kong
Prior art keywords
bending
circuit via
flex circuit
cantilevered leads
tab flex
Prior art date
Application number
HK04109776A
Other languages
English (en)
Inventor
Si-Lam Choy
Original Assignee
Hewlett Packard Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hewlett Packard Co filed Critical Hewlett Packard Co
Publication of HK1067796A1 publication Critical patent/HK1067796A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/17—Ink jet characterised by ink handling
    • B41J2/175—Ink supply systems ; Circuit parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Ink Jet (AREA)
  • Wire Bonding (AREA)
HK04109776A 2001-10-25 2004-12-09 Bending a tab flex circuit via cantilevered leads. HK1067796A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/003,876 US6626518B2 (en) 2001-10-25 2001-10-25 Bending a tab flex circuit via cantilevered leads
PCT/US2002/034092 WO2003036763A2 (en) 2001-10-25 2002-10-24 Bending a tab flex circuit via cantilevered leads

Publications (1)

Publication Number Publication Date
HK1067796A1 true HK1067796A1 (en) 2005-04-15

Family

ID=21708024

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04109776A HK1067796A1 (en) 2001-10-25 2004-12-09 Bending a tab flex circuit via cantilevered leads.

Country Status (8)

Country Link
US (1) US6626518B2 (de)
EP (1) EP1440493B1 (de)
JP (1) JP4146798B2 (de)
KR (1) KR100962889B1 (de)
AU (1) AU2002348404A1 (de)
DE (1) DE60206407T2 (de)
HK (1) HK1067796A1 (de)
WO (1) WO2003036763A2 (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7475964B2 (en) * 2004-08-06 2009-01-13 Hewlett-Packard Development Company, L.P. Electrical contact encapsulation
US20060221140A1 (en) * 2005-04-01 2006-10-05 Lexmark International, Inc. Low profile printhead
JP5273984B2 (ja) * 2006-12-19 2013-08-28 キヤノン株式会社 インクジェット記録ヘッド
JP5008451B2 (ja) * 2007-05-08 2012-08-22 キヤノン株式会社 液体吐出ヘッド及び液体吐出ヘッドの製造方法
JP4994967B2 (ja) * 2007-06-21 2012-08-08 キヤノン株式会社 インクジェット記録ヘッドの製造方法
JP5341497B2 (ja) * 2008-12-19 2013-11-13 キヤノン株式会社 液体吐出ヘッドおよびそれを用いた記録装置
WO2012023939A1 (en) * 2010-08-19 2012-02-23 Hewlett-Packard Development Company, L.P. Wide-array inkjet printhead assembly with a shroud

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5459500A (en) 1992-03-25 1995-10-17 Scitex Digital Printing, Inc. Charge plate connectors and method of making
US5442386A (en) * 1992-10-13 1995-08-15 Hewlett-Packard Company Structure and method for preventing ink shorting of conductors connected to printhead
US5883759A (en) 1996-02-22 1999-03-16 Seagate Technology, Inc. Flex circuit head interconnect for improved electrical performance and ease of assembly
US5742484A (en) 1997-02-18 1998-04-21 Motorola, Inc. Flexible connector for circuit boards
US5831788A (en) 1997-06-27 1998-11-03 Quantum Corporation Circuit connector
US6227651B1 (en) * 1998-09-25 2001-05-08 Hewlett-Packard Company Lead frame-mounted ink jet print head module
US6402299B1 (en) * 1999-10-22 2002-06-11 Lexmark International, Inc. Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer

Also Published As

Publication number Publication date
US6626518B2 (en) 2003-09-30
KR20040048977A (ko) 2004-06-10
KR100962889B1 (ko) 2010-06-10
AU2002348404A1 (en) 2003-05-06
JP4146798B2 (ja) 2008-09-10
EP1440493B1 (de) 2005-09-28
DE60206407T2 (de) 2006-07-20
WO2003036763A2 (en) 2003-05-01
EP1440493A2 (de) 2004-07-28
US20030081066A1 (en) 2003-05-01
JP2005506917A (ja) 2005-03-10
DE60206407D1 (de) 2005-11-03
WO2003036763A3 (en) 2003-10-16

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20161024