DE60206407D1 - Biegen eines flachbandkabels mit freiragenden anschlüssen - Google Patents
Biegen eines flachbandkabels mit freiragenden anschlüssenInfo
- Publication number
- DE60206407D1 DE60206407D1 DE60206407T DE60206407T DE60206407D1 DE 60206407 D1 DE60206407 D1 DE 60206407D1 DE 60206407 T DE60206407 T DE 60206407T DE 60206407 T DE60206407 T DE 60206407T DE 60206407 D1 DE60206407 D1 DE 60206407D1
- Authority
- DE
- Germany
- Prior art keywords
- freelanding
- connections
- bending
- flatband
- cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/17—Ink jet characterised by ink handling
- B41J2/175—Ink supply systems ; Circuit parts therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0388—Other aspects of conductors
- H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ink Jet (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/003,876 US6626518B2 (en) | 2001-10-25 | 2001-10-25 | Bending a tab flex circuit via cantilevered leads |
US3876 | 2001-10-25 | ||
PCT/US2002/034092 WO2003036763A2 (en) | 2001-10-25 | 2002-10-24 | Bending a tab flex circuit via cantilevered leads |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60206407D1 true DE60206407D1 (de) | 2005-11-03 |
DE60206407T2 DE60206407T2 (de) | 2006-07-20 |
Family
ID=21708024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60206407T Expired - Lifetime DE60206407T2 (de) | 2001-10-25 | 2002-10-24 | Biegen eines flachbandkabels mit freiragenden anschlüssen |
Country Status (8)
Country | Link |
---|---|
US (1) | US6626518B2 (de) |
EP (1) | EP1440493B1 (de) |
JP (1) | JP4146798B2 (de) |
KR (1) | KR100962889B1 (de) |
AU (1) | AU2002348404A1 (de) |
DE (1) | DE60206407T2 (de) |
HK (1) | HK1067796A1 (de) |
WO (1) | WO2003036763A2 (de) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7475964B2 (en) * | 2004-08-06 | 2009-01-13 | Hewlett-Packard Development Company, L.P. | Electrical contact encapsulation |
US20060221140A1 (en) * | 2005-04-01 | 2006-10-05 | Lexmark International, Inc. | Low profile printhead |
JP5273984B2 (ja) * | 2006-12-19 | 2013-08-28 | キヤノン株式会社 | インクジェット記録ヘッド |
JP5008451B2 (ja) * | 2007-05-08 | 2012-08-22 | キヤノン株式会社 | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 |
JP4994967B2 (ja) | 2007-06-21 | 2012-08-08 | キヤノン株式会社 | インクジェット記録ヘッドの製造方法 |
JP5341497B2 (ja) * | 2008-12-19 | 2013-11-13 | キヤノン株式会社 | 液体吐出ヘッドおよびそれを用いた記録装置 |
WO2012023939A1 (en) * | 2010-08-19 | 2012-02-23 | Hewlett-Packard Development Company, L.P. | Wide-array inkjet printhead assembly with a shroud |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5459500A (en) | 1992-03-25 | 1995-10-17 | Scitex Digital Printing, Inc. | Charge plate connectors and method of making |
US5442386A (en) * | 1992-10-13 | 1995-08-15 | Hewlett-Packard Company | Structure and method for preventing ink shorting of conductors connected to printhead |
US5883759A (en) | 1996-02-22 | 1999-03-16 | Seagate Technology, Inc. | Flex circuit head interconnect for improved electrical performance and ease of assembly |
US5742484A (en) | 1997-02-18 | 1998-04-21 | Motorola, Inc. | Flexible connector for circuit boards |
US5831788A (en) | 1997-06-27 | 1998-11-03 | Quantum Corporation | Circuit connector |
US6227651B1 (en) * | 1998-09-25 | 2001-05-08 | Hewlett-Packard Company | Lead frame-mounted ink jet print head module |
US6402299B1 (en) * | 1999-10-22 | 2002-06-11 | Lexmark International, Inc. | Tape automated bonding circuit for use with an ink jet cartridge assembly in an ink jet printer |
-
2001
- 2001-10-25 US US10/003,876 patent/US6626518B2/en not_active Expired - Lifetime
-
2002
- 2002-10-24 KR KR1020047005932A patent/KR100962889B1/ko not_active IP Right Cessation
- 2002-10-24 EP EP02782226A patent/EP1440493B1/de not_active Expired - Fee Related
- 2002-10-24 DE DE60206407T patent/DE60206407T2/de not_active Expired - Lifetime
- 2002-10-24 AU AU2002348404A patent/AU2002348404A1/en not_active Abandoned
- 2002-10-24 WO PCT/US2002/034092 patent/WO2003036763A2/en active IP Right Grant
- 2002-10-24 JP JP2003539138A patent/JP4146798B2/ja not_active Expired - Fee Related
-
2004
- 2004-12-09 HK HK04109776A patent/HK1067796A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
WO2003036763A3 (en) | 2003-10-16 |
AU2002348404A1 (en) | 2003-05-06 |
EP1440493B1 (de) | 2005-09-28 |
JP4146798B2 (ja) | 2008-09-10 |
DE60206407T2 (de) | 2006-07-20 |
EP1440493A2 (de) | 2004-07-28 |
HK1067796A1 (en) | 2005-04-15 |
WO2003036763A2 (en) | 2003-05-01 |
KR20040048977A (ko) | 2004-06-10 |
KR100962889B1 (ko) | 2010-06-10 |
US20030081066A1 (en) | 2003-05-01 |
JP2005506917A (ja) | 2005-03-10 |
US6626518B2 (en) | 2003-09-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8327 | Change in the person/name/address of the patent owner |
Owner name: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P., HOUSTON |
|
8364 | No opposition during term of opposition |