HK1042774A1 - 真空電弧蒸髮源及其使用的薄膜成型裝置 - Google Patents

真空電弧蒸髮源及其使用的薄膜成型裝置

Info

Publication number
HK1042774A1
HK1042774A1 HK02104518.3A HK02104518A HK1042774A1 HK 1042774 A1 HK1042774 A1 HK 1042774A1 HK 02104518 A HK02104518 A HK 02104518A HK 1042774 A1 HK1042774 A1 HK 1042774A1
Authority
HK
Hong Kong
Prior art keywords
same
film formation
evaporation source
formation apparatus
vacuum arc
Prior art date
Application number
HK02104518.3A
Other languages
English (en)
Inventor
Murakami Hiroshi
Original Assignee
Nissin Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissin Electric Co Ltd filed Critical Nissin Electric Co Ltd
Publication of HK1042774A1 publication Critical patent/HK1042774A1/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32055—Arc discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32614—Consumable cathodes for arc discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
HK02104518.3A 2000-07-06 2002-06-18 真空電弧蒸髮源及其使用的薄膜成型裝置 HK1042774A1 (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000204961A JP2002020860A (ja) 2000-07-06 2000-07-06 真空アーク蒸発源およびそれを用いた膜形成装置

Publications (1)

Publication Number Publication Date
HK1042774A1 true HK1042774A1 (zh) 2002-08-23

Family

ID=18702130

Family Applications (1)

Application Number Title Priority Date Filing Date
HK02104518.3A HK1042774A1 (zh) 2000-07-06 2002-06-18 真空電弧蒸髮源及其使用的薄膜成型裝置

Country Status (7)

Country Link
US (1) US20020020356A1 (zh)
EP (1) EP1170776A3 (zh)
JP (1) JP2002020860A (zh)
KR (1) KR20020005449A (zh)
CN (1) CN1332266A (zh)
HK (1) HK1042774A1 (zh)
TW (1) TW499493B (zh)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4199062B2 (ja) * 2003-07-07 2008-12-17 株式会社神戸製鋼所 真空蒸着装置
JP2005029855A (ja) * 2003-07-08 2005-02-03 Fuji Electric Device Technology Co Ltd 真空アーク蒸着装置、真空アーク蒸着法、および磁気記録媒体
CN100338255C (zh) * 2003-10-13 2007-09-19 沈阳黎明航空发动机(集团)有限责任公司 一种铝硅钇扩散合金化涂层的制备方法
US7872244B2 (en) * 2007-08-08 2011-01-18 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
CN102244971A (zh) * 2010-05-13 2011-11-16 贵州翔明科技有限责任公司 一种大气压直流弧放电等离子体发生装置及阴极制作方法
RU2449513C1 (ru) * 2010-11-30 2012-04-27 Государственное образовательное учреждение высшего профессионального образования "Санкт-Петербургский государственный электротехнический университет "ЛЭТИ" им. В.И. Ульянова (Ленина)" Вакуумно-дуговое устройство
JP2015063721A (ja) * 2013-09-24 2015-04-09 日本アイ・ティ・エフ株式会社 真空アーク蒸着法、真空アーク蒸着装置および真空アーク蒸着法を用いて製造された薄膜ならびに物品
CN103668061B (zh) * 2013-12-25 2018-12-14 湖南中航超强金刚石膜高科技有限公司 一种高附着力高硬度低摩擦系数类金刚石膜的涂层设备
TWI639719B (zh) * 2016-11-21 2018-11-01 行政院原子能委員會核能研究所 直流磁控電弧鍍膜裝置及其方法
KR101902778B1 (ko) * 2016-12-08 2018-10-02 한국생산기술연구원 네스트유닛을 포함하는 아크이온플레이팅장치
CN107177822B (zh) * 2017-05-02 2019-10-01 上海理工大学 纳米涂层设备的电磁过滤装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4673477A (en) * 1984-03-02 1987-06-16 Regents Of The University Of Minnesota Controlled vacuum arc material deposition, method and apparatus
DE4126040C1 (en) * 1991-08-06 1992-05-07 Multi-Arc Oberflaechentechnik Gmbh, 5060 Bergisch Gladbach, De Segmented cathodes for plasma surface-coating process - comprise rectangular section frame internally divided into 3 segments of titanium@, zirconium@ and chromium@ respectively and insulating projections
US5677003A (en) * 1995-10-30 1997-10-14 Sam Shin Precision, Co., Ltd. Method for coating diamond-like carbon on head drums of a video cassette recorder

Also Published As

Publication number Publication date
KR20020005449A (ko) 2002-01-17
TW499493B (en) 2002-08-21
CN1332266A (zh) 2002-01-23
EP1170776A2 (en) 2002-01-09
US20020020356A1 (en) 2002-02-21
EP1170776A3 (en) 2005-03-23
JP2002020860A (ja) 2002-01-23

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