HK1036347B - Chip card equipped with a loop antenna, and associated micromodule - Google Patents

Description

Chip card with loop antenna and associated micromodule

The invention relates to a chip card equipped with an open loop antenna, in particular a chip card of the so-called "hybrid connection" type. Such a card will be defined later.

In the present invention, the term "card" should be understood in the broadest sense: cards with memory (CAM), "chip" cards, etc.

From the perspective of communication with the outside world, there are two main classes of chip cards: contact connection chip cards and contactless connection chip cards. In the second case, different approaches can be used, in particular optical coupling or electromagnetic coupling by means of a helical loop antenna. In the present invention, the second coupling mode is of interest.

Most chip cards are of the first type, i.e. contact type. These chip cards are made of "micromodules", that is to say, integers comprising printed circuits or metal grids, which have contacts, glued and connected to components of the integrated circuit type: the memory, microprocessor, microcontroller, etc. are connected and then these components are encapsulated with resin to form a micro module that can be used for the final insertion operation. The final insertion operation is to attach each micromodule to a plastic substrate having a cavity for receiving the micromodule.

The second type of chip card, known as contactless, is coupled to the outside world by electromagnetic induction. The frequencies used are divided into two bands: a low frequency band, typically 125KHz for the nominal frequency; the other is the high frequency band, with a typical value of 13.56MHz for the nominal frequency. For this purpose, an antenna is provided, usually in the form of a helical loop, the ends of which are connected to the micromodule. In order to obtain a sufficiently high sensitivity, for example for operation at low frequencies, the antenna is mounted with several hundred turns; if operating at high frequencies, the antenna will have 2 to 3 turns.

The technology of manufacturing chip cards now enables the above-mentioned antenna to be integrated in the material of the chip card, more precisely between two layers of plastic. In practice, the turns are placed on plastic layers of the "PVC" or "PET" type, all the metal layers being printed on the plastic (for example screen-printed) or deposited with metal wires, hot-melted directly on the plastic layer.

Finally, there are chip cards known as "hybrid" cards, which constitute the ideal field of application of the invention, of the type which have the advantage of being able to be accessed at times by means of "traditional" contact connections, and which can be used in standard readers or by passing alongside suitable transmitting-receiving mechanisms, micromodules with high-frequency interfaces. The term "reader" is to be understood in a broad sense, i.e. a device capable of reading and/or writing digital information in a chip card.

The following is the case in this preferred application, namely a chip card of the "hybrid" type.

In general, all chip cards are standardized, both from an electrical and mechanical point of view, complying with some criteria, in particular the following:

ISO 7816 for various contact chip cards,

ISO 14443 is directed to various contactless, proximity chip cards.

In the latter case the frequency used is usually equal to 13.56MHz, which reduces the size of the antenna by only two or three turns.

The layout of the components for a "hybrid" chip card leads to a new assembly method. The aim of mass production of such products is to make them as low cost as possible. Also, good reliability is required, as is the case in conventional contact chip cards.

For all these reasons, it is desirable to make use of known and proven assembly methods and techniques as much as possible, among which some, but not all of the following may be mentioned:

-mounting the semiconductor micromodule on a base plate of the printed circuit type, on which the plated tabs are mounted;

-manufacturing a plastic board base of a so-called chip card by compression molding a set of plastic layers;

-inserting the micromodule into the cavity of the plastic substrate by means of gluing.

What remains then is to attach the semiconductor component, or "ic chip", to the antenna, more precisely to the end of the antenna, which presents a particular problem; this connection is made by means of a contact strip which should be attached to the aforementioned terminal.

In the known art, it has been proposed to make this connection by means of double-sided printed circuits, i.e. circuits with metallic copper deposits, for example made of copper, on both the side and the side of the insulating substrate. The backplane is then a double-sided printed circuit. This solution has the drawback of being expensive. This solution therefore does not satisfy at least the above-mentioned requirements.

In addition, even when high frequencies (typically 13.56MHz) are used, the antenna is formed by an open loop, typically at least two and three turns. This requires that two conductive circuits are crossed perpendicularly to one another at the location or locations of the chip card surface. It follows that there should be an insulating region and a conductive "bridge" between the two sections of the antenna.

The main object of the invention is thus to enable an optimum connection between the conductive contact pads of the micromodule of the chip card and the terminals of the antenna. This connection, which is preferably used on "hybrid" chip cards, particularly minimizes the number of layers of metal at the microcircuit or also at the antenna.

To this end, according to an important feature of the invention, the active face of the base plate supporting the integrated semiconductor component, i.e. the face with the contact pads, is used to establish the electrical connection between the input and output of the component and the terminals of the antenna.

In the second embodiment, the electrical connection between the parts of the antenna is also established by means of contact pads on the active side of the chassis.

The object of the invention is therefore a chip card in which a base body is formed from electrically insulating layers, on which base body there is an open loop antenna with two ends, on which base body there is a cavity, in which a micromodule is accommodated, which is connected to the open loop antenna by means of two contacts, and in which micromodule there is an electrically insulating base plate, on the first side of which the semiconductor component is supported, and on the second side of which there are a plurality of electrical contacts, characterized in that both contacts are arranged in a strip which passes through the centre of the base plate, and that the two ends are connected through the base plate and the two contacts, respectively, which are connected to the two ends of the antenna, respectively.

The invention also relates to a micromodule for connection to an open loop antenna via its two terminals. The antenna is outside the micromodule and has two ends. The micromodule comprises an electrically insulating substrate, on a first side of which a semiconductor component is supported, and on a second side of which a plurality of electrical contacts are provided, characterized in that the contacts are arranged in a strip extending through a central region of the substrate, and in that two ends of the contacts are connected to the contacts extending through the substrate, the contacts being intended to be connected to two ends of an antenna.

Finally, the invention also relates to a method for producing a chip card comprising an antenna and a micromodule, starting from at least two layers of electrically insulating material, the antenna having two ends, and the micromodule comprising an electrically insulating base plate, a semiconductor component being provided in a central region of a first side of the base plate and two contact webs being provided in the peripheral region of the first or second side for connecting the semiconductor component to input/output connections of the antenna. The arrangement of the two tabs is such that once the micromodule is applied to the card, both tabs are aligned with the terminals of the antenna. The steps of this method are as follows:

-making a first layer, which layer supports the antenna on one surface;

-making a second layer having two holes therethrough, the holes being positioned so as to be opposite the ends of the antennas once the second layer is applied to the face of the first layer carrying the antennas;

-affixing the second layer to the face of the first layer bearing the antenna;

-attaching the micromodule to the card so that the semiconductor component on it is housed in a central recess already made in the card and its peripheral area is housed in a peripheral recess made around this central recess;

-connecting the tab of the micromodule to the end of the antenna.

The invention will be better understood and additional features and advantages thereof will become apparent upon reading the following description, which makes reference to the accompanying drawings, in which:

figure 1 schematically shows an embodiment of a micromodule. Shown is the side on which the components are located.

FIGS. 2A to 2C each show a chip card equipped with an antenna connected to a micromodule, a bottom view of a micromodule of the type shown in FIG. 1, and a side view of this same chip card taken along AA in FIG. 2A;

FIGS. 3A and 3B show a side view of a chip card equipped with an antenna connected to a micromodule according to a complementary variant and of the same chip card along AA in FIG. 3A,

FIGS. 4A and 4B show a side view of a chip card equipped with an antenna connected to a micromodule and of the same chip card, taken along line AA in FIG. 4A, according to a second complementary variant;

FIGS. 5A and 5B show, respectively, a side view of a chip card equipped with an antenna connected to a micromodule according to a third complementary variant of embodiment, and of the same chip card, taken along line AA in FIG. 5C;

fig. 5C shows a top view of a modified micromodule adapted to a third, complementary implementation variant; while

Fig. 6 shows a modified tabbed side of the micromodule.

FIG. 1 schematically illustrates one embodiment of a micromodule that can be used within the scope of the invention. In fact, this micromodule has two main parts, the micromodule 1 being seen from the bottom, i.e. the side opposite to the side with the electrical contacts.

The first of these is constituted by an electronic "smart" 3 or integrated semiconductor component, such as a microprocessor or equivalent, generally rectangular parallelepiped with a small thickness. The microprocessor 3 has pins or input-output terminals 30 located around it, the layout, function and number of which will of course depend on the specific implementation of the component 3. The microprocessor 3 has in particular two special input-output terminals 31 and 32, which are generally adjacent and which are connected to an interface (not shown) called "HF".

The second part is a base plate 2, which is formed by a single-sided printed circuit 20, on the central area of which a semiconductor component 3 is applied, on which two rows of conductor strips 21 are arranged peripherally (drawn with dashed lines, since they are arranged on the upper surface), one of these two rows being spaced from the other by a distance, separated by a strip-shaped zone passing through the central area of the base plate, each row having 5 conductor strips 21 arranged in a row, the number and layout of which comply with the aforementioned ISO standard. The required connection between the contact 30 and the conductive plate 21 is conventionally achieved with a thin wire 300. More precisely, openings 210 are made in the insulating layer of the base plate 2 to reach the conductive sheet 21 and connect the two faces of the base plate 2.

Once the connection between the input-output terminals of the semiconductor component 3 and the conducting strips 21 is realised, the rear face of the base plate 2 is coated with a layer of resin to ensure a good mechanical form and also to ensure electrical insulation, the extent of coverage being indicated by reference numeral 4.

The operations described up to now are conventional and, as in the prior art, in order to connect the two ends (600 and 610 in fig. 2A) of the loop of the antenna 6, two additional conductive plates 22 and 23 are respectively housed in the two aforementioned strips of the base plate 2, which are easily arranged symmetrically on and on the side of the semiconductor assembly 3, together with two holes 220 and 230 through the base plate to reach the opposite faces of the conductive plates. One of the conductive sheets 22 and 23 is electrically insulated from the other and the other conductive sheet 21.

According to an important feature of this embodiment of the invention, at least one tab (tab 22 in the example shown in fig. 1) extends from one edge of the base 2 to another edge of the base, passing over the semiconductor component 3 to one edge of the footprint 4. According to fig. 1, both conducting strips 22, 23 are L-shaped, with a small branch extending up to near the outer edge of the footprint 4, parallel to the edge of the base plate 2, and a large branch extending towards the opposite edge of the base plate. In one embodiment variant, the tabs 23 may extend close to the edges of the semiconductor component 3 without passing through from above the semiconductor component.

Tab 22 has a hole 220 'opposite hole 220 in footprint 4, hole 220' acting as hole 210 for input-output terminal 31. Likewise, the additional tab 23 has an aperture 230' inside the footprint 4, but on the same side of the aperture 230. Thus, one input-output terminal, terminal 31, may be attached to sheet metal 22-22' via line 310, while another connector 32 may be attached to sheet metal 23 via line 320.

An embodiment of a chip card according to the invention will now be described with reference to fig. 2A to 2C, this chip card 5 being a hybrid card, which is an implementation of the micromodule 1 shown in fig. 1.

The mentioned micromodule shown in fig. 2B is a top view, that is to say the side of the electrical connector. As already indicated, in addition to the "conventional" tag used to carry out the dialogue between the mechanisms of the conventional "reader" (not shown), there are two additional tags 22 and 23 for connecting the two ends 600 and 610 of the loop antenna 6 (fig. 2A).

Assuming that the frequency used is selected in the high frequency band (13.56MHz), the antenna has at least one turn, such as the aforementioned frequencies, more typically two to three turns. Assume that the antenna, designated by reference numeral 6, has three turns: 61 to 63, the antenna 6 is substantially planar, the turns 61 to 63 being concentric and conveniently surrounding the area in which the micromodule 1 is located, so as to occupy as large a surface as possible and thus to have as high a sensitivity as possible. In the example shown, the turns 61 to 63 are substantially rectangular, i.e. identical in shape to the chip card 5.

The position of the microcircuit chip 1 is initially determined by the criteria mentioned above, i.e. in an area in the upper left quarter of the chip card (see top view in figure 2A).

An open cavity 51 is formed in the card body 50 of the chip card 5, in which cavity the module 1 is accommodated. More specifically, as shown in FIG. 2C (a side view taken along line AA of FIG. 2A), the chamber 51 has two regions: a central recess 510 for receiving the semiconductor element 3 and the resin cover layer 4 thereof; while the peripheral shallow narrow groove 511, at the bottom of which the outer edge of the bottom plate 2 is placed, has two holes 220 and 230 at the bottom of the peripheral narrow groove 511.

Finally, according to a feature of the invention, the two terminals 600 and 610 open at the bottom of the slot 511, so that the shape of the conductive strip is relatively wide.

This makes it easy to achieve a connection between the two end pieces 600 and 610 of the antenna and the two tabs 22 and 23 of the chassis 2. The layout adopted by the invention enables a large latitude in manufacturing. It can also be seen that there is only one metallization layer in the central region.

Establishing electrical continuity between the terminal of the antenna 6 and the micromodule 1 can be obtained in a conventional manner, in particular by conductor adhesion between the base plate 2 and the tabs 600 and 610, by conductive elastomer, by deformation welding of metal and by thermal welding.

The chip card 5 in the implementation variant just described with reference to fig. 2A to 2C enables the object of the invention to be achieved.

However, there is still a drawback. In practice, the antenna 6 will generally have at least two or more turns. Whatever the design used, there must be one or more crossings of conductor tracks at this or that place on the face of the chip card 5. In fig. 2A it is seen that the last part of the turn 63 intersects the turns 61, 62 in the reference zone ZC. To avoid short circuits, it is necessary to insulate between the different conductive tracks, which can be achieved with multiple metallization layers, such as an insulating layer and a conductor "bridge". However, this solution is not always satisfactory.

Thus, according to another idea of the invention, the connecting segment of each turn of the antenna 6 is made to pass through the middle of its ends 600 and 610, i.e. from the central zone where the cavity 51 is located.

A first modification of the second embodiment of the present invention is described below with reference to fig. 3A and 3B. Fig. 3A schematically shows a chip card, here indicated with reference numeral 5a, which is a top view. While figure 3B shows this same chip card 5a, the micromodule 1 is integral, as a side view along AA in figure 3A.

Elements that are the same or at least similar to those in the previous figures are identified by the same reference numerals and need not be described again. It is possible to attach a letter "a" if there is a structural modification.

According to a main feature of this embodiment, the sections of the antenna 6a, which establish the connection between two successive turns 61a to 63a, for example 64 and 65, pass between the ends 600a and 610a of the antenna, in more detail (fig. 3B), the metal layer of the antenna being laid down at 513 in the middle between the bottom of the peripheral slot 511 of the groove 51 and the bottom of the central groove 510 of this groove. The two ends 600a and 610a of the antenna are in the form of plates, which establish contact with the additional tabs 22 and 23, respectively, at the bottom of the peripheral narrow groove 511. The loops 61a to 63a themselves also pass at this level, which corresponds to the upper surface of the plastic layer of the chip card 5 a.

Two holes 5110 and 5111 are made in the bottom of the peripheral narrow groove 511, just above the additional conductive strips 22 and 23, respectively, corresponding to the ports 220a and 230 a. The physical approach between tabs 22 and 23 and antenna end tabs 600a and 610a is to use conductor contacts 221a and 231a, respectively. This is achieved by the contact method as in fig. 2A to 2C, but the method may be different and another method may be used instead. In a variant not shown, the web is deformed in the direction of the antenna end or, conversely, the antenna end is raised towards the web.

This operation does not need to be particularly precise. In fact, the insulating layer protrudes 513, on which the metallisation layer of the antenna is applied, and it is possible to previously perforate the insulating layer, that is to say to make the holes 5110 and 5111 on it before applying it to the antenna, which completely avoids the destruction of the patches 600a and 610 a. This risk exists if the perforations are drilled out again after the insulation has been applied. The applied metal layer is very thin, typically about 800 μm thick for a card, about several tens of microns thick, and about 150 μm deep for a diameter of about several millimeters for the holes 5110 and 5111.

It is assumed that the metallization region 513 at the bottom of the peripheral narrow groove 511 has a sufficient width to allow at least one additional conductive trace to pass between the inner edge of the central groove 510 and the aforementioned patches 600a and 600 b.

In the example depicted, the conductive track segment 64 is between the antenna end 600a and the semiconductor component 3, while the conductive track segment 65 is between the antenna end 610a and the same semiconductor component 3. In other words, the two conductive segments 64 and 65 are located on the side and on the side of the semiconductor component 3. In another variant, not shown, the two conductive segments 64 and 65 can be located on the same side of the semiconductor component 3, leaving only a sufficiently large space.

It is clear that all the metallic coatings constituting the antenna are exactly in the same plane, i.e. at the bottom of the peripheral narrow groove 511, preferably in the middle of this plane in terms of the thickness of the card, which makes it easy to obtain a fairly flat card.

The use of conductive vias with a metallization layer as just described is particularly suitable when the dimensions of the semiconductor component 3 are relatively small, while in the opposite case it is preferable to use a complementary implementation variant as will now be described.

A first additional implementation variant will now be described with reference to fig. 4A and 4B.

Fig. 4A schematically shows this chip card, indicated with 5b, in a top view. Fig. 4B shows the same chip card 5a, a side view along AA in fig. 4A. Wherein the micromodules are a whole.

All elements that are the same or at least similar to those shown in the previous figures are identified by the same reference numerals and need not be described again. If there is a structural change, a letter "b" may be appended.

The connecting line segments 64b and 65b between the turns 61b to 63b of the antenna 6b pass under the bottom of the cavity 51 at the level of the platform marked 514, while these turns 61b to 63b themselves are at such a level as to correspond to the upper surface of the plastic layer of the chip card 5 b. Each tab 221B and 231B is longer than the corresponding end 221a and 231a (fig. 3B), which does not constitute a significant defect.

Obviously, this layout allows a larger range of wiring, since the entire bottom face of the cavity 51 can be used regardless of the size of the semiconductor assembly. As before, the metallization of the antenna 6b is realized at a single height (514).

However, there is still a small aesthetic disadvantage. In fact, this layout does not leave a place for the "crystalline PVC" material, i.e. the transparent material on the outside of the chip card, unless the turns of the antenna are to be made visible.

A second embodiment variant, which allows to eliminate this drawback, is now described with reference to figures 5A to 5C. Fig. 5A schematically shows this chip card, indicated with 5c, in a top view; and 5B shows a side view of the chip card taken along AA on fig. 5A. The microcircuit is a whole and is indicated with 1 c. Fig. 5C shows a plan view, i.e. the conductor connection area, of a micromodule 1C modified to suit this particular implementation variant.

Elements that are the same as, or at least similar to, elements shown in previous figures are identified by the same reference numeral and need not be described again. If there is a modification in the structure, a letter "C" may be attached.

In the example described, the antenna is indicated with 6c, assuming two turns 66 and 67. The two loops are broken so that their ends can be attached to the tabs of the base plate 2C.

In fact, according to a second complementary variant of embodiment, the connection between the turns 66 and 67 is made by means of a metallized sheet 26 made directly on the base plate 2 c.

The tracks of the applied metal layer constituting the turns 66 and 67 of the antenna 6C can be realised in a straightforward manner (see figure 3B), while being situated at an intermediate height between the bottom of the central recess 510 of the cavity 51 and the bottom of the peripheral slot 511 of this same cavity, i.e. on the surface of the plastic layer constituting the body 50C of the chip card 5C.

The connection of one 660 or 671 of the ends of the turns 66 or 67 of the antenna 6c to the micromodule 1c is carried out in a similar or even identical way to that already described in the variant described with reference to fig. 3B: through both tabs 22c and 23c and the corresponding opening 220c or 230 c.

In addition, a tab is implemented which comprises two wide regions 24, 25 connected by a narrow and long region 26. One of these two regions 24 and 25 is to the right of the antenna's tabs 22C and 23C (fig. 5C) and the other is to their left, between the tabs 21. In a variation not shown, a greater width of region 26 may be provided, while simultaneously reducing the size of tabs 22c and 23 c. The connection between the regions 24 and 25 and the ends 670 and 661 of the antenna is made by holes in the insulating layer directly above the metallization layer 515 (one of 5112 is seen in fig. 5B), the openings 240 and 250 and the conductive terminals (one of 241 is seen in fig. 5B).

It should be understood that although the conductive tracks 66 and 67 of the antenna 6c are realized at a first level (platform 515) and the areas 24-25-26 between the two turns are realized at a second level, an additional metallization level is not thus established. In fact, the height 24-25-26 of the intermediate connection and the height of the metallization already used for the tabs 21 to 23 (upper surface of the bottom sheet 2c) are the same.

It is also conceivable, in a variant not shown, to connect the loops of the additional connecting piece by a plurality 26 of connecting metallizations of the type shown. By this means, the middle of more than two successive turns can be joined. In practice, however, the number of intermediate connections that can be made between the connected turns 22 and 23 is too limited. This variant is however well suited for antennas with a two-and three-turn configuration, which is the general case for frequencies of 13.56 MHz.

From the foregoing it will be readily seen that this invention is one well adapted to attain all the ends and objects set forth herein.

It should be understood, however, that the present invention is not limited to only those embodiments described above in connection with fig. 1 through 5C.

The numerical values specifically identified are merely illustrative of such considerations and will depend primarily on the particular application. The possible materials used are those generally used in this respect, in the sense that the invention is compatible with the prior art, which is an additional advantage.

The invention is most suitably applied in hybrid chip cards, but is not limited to this application, but can also be applied in contactless chip cards, although with less advantages than in the first case.

The advantages of the invention are in fact numerous, in particular for chip cards of the "hybrid" type, now listed below:

-low cost;

-using a single-sided semiconductor component substrate (printed circuit);

direct access to the additional contacts and then to the high-frequency interface, so that electrical testing can be carried out via the contacts connected to the antenna, and also the input-output of this interface can be tested.

Fully compatible with the implementation methods of the known techniques of manufacturing and plugging micromodules;

the special cavity provided for the connection of the antenna terminal has a large tolerance for the volume of conductor material used for the strip.

In a further embodiment variant, the input/output terminals of the high-frequency interface of the semiconductor component are not arranged on the same side as this component, but are distributed on two opposite sides. According to this variant, the connection to the tabs is at the side or at the side of the semiconductor component. It is no longer necessary for the tabs 22 (fig. 1) to pass over the semiconductor assembly. In any case, the tabs 22, 23 can be placed substantially between one edge of the semiconductor component 3 and one edge of the base plate 2 facing it, however, the configuration of fig. 6 is preferably adopted: the tabs 22d and 23d extend from one edge of the base plate 2d toward the middle region of the semiconductor package 3d, respectively, so as to cover substantially the entire central region between the two rows of tabs 21 d. However, it is pointed out here that in order not to enlarge the width d of the region 4d of the applied protective layer too much, and thus also to apply the lateral edges of the base plate 2d with sufficient width, it is preferred to arrange the semiconductor component with a smaller width in fig. 6 than in fig. 1.

Naturally, this implementation variant can be applied to the embodiments described with reference to fig. 3A-3B, 4A-4B and 5A-5C.

Claims (10)

1. A chip card having a body formed of electrically insulating layers, on one of which there is an open loop antenna (6) with two terminals (600a, 610a), the body of the card having a cavity (51) between which a micromodule (1) is accommodated for connection to the open loop antenna via two contacts (31, 32), said micromodule having an electrically insulating base plate (2) on which a semiconductor component (3) is supported on a first side and on the second side of which there are a plurality of electrical contacts, characterized in that two contacts (22, 23) are arranged in a strip which passes through a central region of said second side of the base plate (2), the contacts (31, 32) being connected to the two contacts (22, 23) via the base plate, respectively, and the two contacts (22, 23) being connected to the two terminals (600a, 610a) and (4) connecting.

2. The chip card of claim 1, wherein the contacts (31, 32) are connected to the tabs (22, 23) through a first set of openings (220 ', 230') in the base (2), respectively, and the terminals (600a, 610a) of the antenna (6a) are connected to the tabs (22, 23) through holes (5110, 5111) in one layer of the card interposed between the antenna and the micromodule and through a second set of openings (220, 230) in the base (2).

3. The chip card of claim 1, characterized in that the antenna (6a) has at least two turns (61a-63a), successive turns (61 a-62 a) of the antenna (6a) being connected by an intermediate connecting conductor (64, 65) passing between the ends (600a, 610a) of the antenna (6 a).

4. The chip card of claim 3, characterized in that said cavity (51) has a central recess (510) for receiving the semiconductor component (3) and a peripheral narrow recess (511) which is slightly shallower and which is intended to receive the periphery of the body (2), said intermediate connecting conductor segment (64, 65) connecting two successive turns (61a-63a) being realized in a layer at an intermediate height (513) between the bottom of the peripheral narrow recess (511) and the bottom of the central recess (510) and passing between the two ends (600a, 610a) of the antenna (6a) and the edge of the central recess (510).

5. The chip card of claim 4, characterized in that the open loop antenna (6a) has 3 turns (61a-63a), a first section of the intermediate connection conductor (64) connecting the first turn (61a) with the second turn (62a) being arranged at the edge of the central recess (510) at a first side of the semiconductor component (3), and a second section of the intermediate connection conductor (65) being arranged at the edge of the central recess (510) at the opposite side of this semiconductor component (3).

6. The chip card of claim 3, characterized in that the cavity (51) has a central recess (510) for accommodating the semiconductor component (3) and a shallower peripheral narrow recess on the periphery of the upper side of the base (2), the intermediate connection conductors (64b, 65b) connecting two successive turns (61b-63b) passing between the two ends (600a, 610a) of the lower antenna (6a) of the semiconductor component (3).

7. Chip card according to claim 1, characterized in that the antenna (6c) has at least two open loops (66, 67) and in that the base (2c) has at least one additional tab (24, 25, 26) on the side of the base (2c) carrying the tabs and passing between the two tabs (22, 23), which additional tab connects the two respective ends of the loop.

8. The chip card of claim 1, wherein said micromodule has two rows of tabs (21) disposed on one or both sides of said strip, at least some of said rows being adapted to engage a card reader through electrical contacts.

9. A micromodule for connection to an open loop antenna (6) by means of two terminals (31, 32), said open loop antenna (6) being external to the micromodule and having two ends (600a, 610a), said micromodule having an electrically insulating base plate (2) carrying a semiconductor component (3) on a first face thereof and having a plurality of electrical contacts on a second face thereof, characterized in that two contacts (22, 23) are arranged in a strip passing through a central region of said second face of the base plate (2), said terminals (31, 32) being connected to the two contacts (22, 23) respectively by means of the base plate (2), the two contacts (22, 23) being connected to the two ends (600a, 610a) of the antenna respectively.

10. Micromodule according to claim 9, wherein there are two rows of tabs (21) distributed on the side and on the side of said strip, a certain number of tabs being provided in both rows for cooperating with a card reader by means of electrical connections.