HK1011630A1 - Solder paste formulations for use in the electronics industry - Google Patents

Solder paste formulations for use in the electronics industry

Info

Publication number
HK1011630A1
HK1011630A1 HK98112881A HK98112881A HK1011630A1 HK 1011630 A1 HK1011630 A1 HK 1011630A1 HK 98112881 A HK98112881 A HK 98112881A HK 98112881 A HK98112881 A HK 98112881A HK 1011630 A1 HK1011630 A1 HK 1011630A1
Authority
HK
Hong Kong
Prior art keywords
solder paste
electronics industry
paste formulations
formulations
electronics
Prior art date
Application number
HK98112881A
Other languages
English (en)
Inventor
Geoffrey Andrew Paterson
Charles Edmund King
Christopher Andrew Mackie
Original Assignee
Cookson Group Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cookson Group Plc filed Critical Cookson Group Plc
Publication of HK1011630A1 publication Critical patent/HK1011630A1/xx

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/3612Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Adhesives Or Adhesive Processes (AREA)
HK98112881A 1991-12-13 1998-12-07 Solder paste formulations for use in the electronics industry HK1011630A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB919126498A GB9126498D0 (en) 1991-12-13 1991-12-13 Paste formulations for use in the electronics industry
PCT/GB1992/002214 WO1993011905A1 (fr) 1991-12-13 1992-11-30 Formulations de pate a braser destinees a l'industrie electronique

Publications (1)

Publication Number Publication Date
HK1011630A1 true HK1011630A1 (en) 1999-07-16

Family

ID=10706215

Family Applications (1)

Application Number Title Priority Date Filing Date
HK98112881A HK1011630A1 (en) 1991-12-13 1998-12-07 Solder paste formulations for use in the electronics industry

Country Status (8)

Country Link
EP (1) EP0616562B1 (fr)
JP (1) JP3217064B2 (fr)
CA (1) CA2125688C (fr)
DE (1) DE69230042T2 (fr)
GB (1) GB9126498D0 (fr)
HK (1) HK1011630A1 (fr)
MX (1) MX9207211A (fr)
WO (1) WO1993011905A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3078497B1 (fr) * 2018-03-05 2020-03-13 Irt Saint Exupery Creme a braser, procede de preparation d’une telle creme a braser et procede de brasage la mettant en œuvre

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1521132A (en) * 1975-07-10 1978-08-16 Radiatorae Si Cabluri Brasov F Method for soldering the fins and pipes forming the cooler assembly of automobile radiators
US4342607A (en) * 1981-01-05 1982-08-03 Western Electric Company, Inc. Solder flux
EP0140344A3 (fr) * 1983-10-31 1986-10-08 Scm Corporation Véhicule pour une pâte de poudre de métaux fusibles
GB8628916D0 (en) * 1986-12-03 1987-01-07 Multicore Solders Ltd Solder composition
AU5919890A (en) * 1989-08-14 1991-02-14 Multicore Solders Limited Manufacture of printed circuit board assemblies

Also Published As

Publication number Publication date
WO1993011905A1 (fr) 1993-06-24
GB9126498D0 (en) 1992-02-12
EP0616562A1 (fr) 1994-09-28
EP0616562B1 (fr) 1999-09-22
DE69230042T2 (de) 2000-05-25
JP3217064B2 (ja) 2001-10-09
MX9207211A (es) 1993-06-01
CA2125688A1 (fr) 1993-06-24
JPH07501984A (ja) 1995-03-02
DE69230042D1 (de) 1999-10-28
CA2125688C (fr) 1998-07-14

Similar Documents

Publication Publication Date Title
AP9200438A0 (en) Water-soluble package
EP0503628A3 (en) Multiplier and squaring circuit to be used for the same
GB9207832D0 (en) Formulations
EP0512489A3 (en) Aluminium brazing paste
GB9121003D0 (en) Soldering
EP0501827A3 (en) Multiplying circuit
GB9103824D0 (en) Formulation
EP0483763A3 (en) Water-soluble soldering paste
EP0497481A3 (en) Water-soluble soldering paste
EP0499134A3 (en) Fluxless solder
GB9109899D0 (en) Solder leveller
GB2261849B (en) Ink-metering components
GB9124573D0 (en) Soldering
HK1011630A1 (en) Solder paste formulations for use in the electronics industry
GB9126497D0 (en) Paste,ink or cream formulations for use in the electronics industry
GB9109947D0 (en) Solder paste compositions
GB9122883D0 (en) Fluxless soldering
GB2256932B (en) Protractor square
CS112790A2 (en) Soldering paste
GB9110475D0 (en) 1-fluorocyclopropane carbonyl fluoride
GB9205793D0 (en) Solder paste compositions
GB9119243D0 (en) Binders for solder paste formulations
GB9110686D0 (en) Improvements in devices for use in assembly work
GB9104946D0 (en) Formulation
GB9108281D0 (en) Formulation

Legal Events

Date Code Title Description
PF Patent in force
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20081130