HK1011630A1 - Solder paste formulations for use in the electronics industry - Google Patents
Solder paste formulations for use in the electronics industryInfo
- Publication number
- HK1011630A1 HK1011630A1 HK98112881A HK98112881A HK1011630A1 HK 1011630 A1 HK1011630 A1 HK 1011630A1 HK 98112881 A HK98112881 A HK 98112881A HK 98112881 A HK98112881 A HK 98112881A HK 1011630 A1 HK1011630 A1 HK 1011630A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- solder paste
- electronics industry
- paste formulations
- formulations
- electronics
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Bulkheads Adapted To Foundation Construction (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB919126498A GB9126498D0 (en) | 1991-12-13 | 1991-12-13 | Paste formulations for use in the electronics industry |
PCT/GB1992/002214 WO1993011905A1 (en) | 1991-12-13 | 1992-11-30 | Solder paste formulations for use in the electronics industry |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1011630A1 true HK1011630A1 (en) | 1999-07-16 |
Family
ID=10706215
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK98112881A HK1011630A1 (en) | 1991-12-13 | 1998-12-07 | Solder paste formulations for use in the electronics industry |
Country Status (8)
Country | Link |
---|---|
EP (1) | EP0616562B1 (xx) |
JP (1) | JP3217064B2 (xx) |
CA (1) | CA2125688C (xx) |
DE (1) | DE69230042T2 (xx) |
GB (1) | GB9126498D0 (xx) |
HK (1) | HK1011630A1 (xx) |
MX (1) | MX9207211A (xx) |
WO (1) | WO1993011905A1 (xx) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR3078497B1 (fr) * | 2018-03-05 | 2020-03-13 | Irt Saint Exupery | Creme a braser, procede de preparation d’une telle creme a braser et procede de brasage la mettant en œuvre |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1521132A (en) * | 1975-07-10 | 1978-08-16 | Radiatorae Si Cabluri Brasov F | Method for soldering the fins and pipes forming the cooler assembly of automobile radiators |
US4342607A (en) * | 1981-01-05 | 1982-08-03 | Western Electric Company, Inc. | Solder flux |
EP0140344A3 (en) * | 1983-10-31 | 1986-10-08 | Scm Corporation | Paste vehicle for fusible powdered metal paste |
GB8628916D0 (en) * | 1986-12-03 | 1987-01-07 | Multicore Solders Ltd | Solder composition |
AU5919890A (en) * | 1989-08-14 | 1991-02-14 | Multicore Solders Limited | Manufacture of printed circuit board assemblies |
-
1991
- 1991-12-13 GB GB919126498A patent/GB9126498D0/en active Pending
-
1992
- 1992-11-30 WO PCT/GB1992/002214 patent/WO1993011905A1/en active IP Right Grant
- 1992-11-30 EP EP92924767A patent/EP0616562B1/en not_active Expired - Lifetime
- 1992-11-30 CA CA 2125688 patent/CA2125688C/en not_active Expired - Fee Related
- 1992-11-30 DE DE69230042T patent/DE69230042T2/de not_active Expired - Fee Related
- 1992-11-30 JP JP51069093A patent/JP3217064B2/ja not_active Expired - Fee Related
- 1992-12-11 MX MX9207211A patent/MX9207211A/es unknown
-
1998
- 1998-12-07 HK HK98112881A patent/HK1011630A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
MX9207211A (es) | 1993-06-01 |
DE69230042D1 (de) | 1999-10-28 |
WO1993011905A1 (en) | 1993-06-24 |
EP0616562B1 (en) | 1999-09-22 |
CA2125688C (en) | 1998-07-14 |
DE69230042T2 (de) | 2000-05-25 |
GB9126498D0 (en) | 1992-02-12 |
CA2125688A1 (en) | 1993-06-24 |
JPH07501984A (ja) | 1995-03-02 |
JP3217064B2 (ja) | 2001-10-09 |
EP0616562A1 (en) | 1994-09-28 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PF | Patent in force | ||
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20081130 |