HK1000549A1 - Film circuit metal system for use with bumped ic packages - Google Patents

Film circuit metal system for use with bumped ic packages Download PDF

Info

Publication number
HK1000549A1
HK1000549A1 HK97102144A HK97102144A HK1000549A1 HK 1000549 A1 HK1000549 A1 HK 1000549A1 HK 97102144 A HK97102144 A HK 97102144A HK 97102144 A HK97102144 A HK 97102144A HK 1000549 A1 HK1000549 A1 HK 1000549A1
Authority
HK
Hong Kong
Prior art keywords
layer
gold
nickel
thick
copper
Prior art date
Application number
HK97102144A
Other languages
German (de)
English (en)
French (fr)
Chinese (zh)
Other versions
HK1000549B (en
Inventor
Paul Debiec Richard
D. Evans Michael
J. Pendergast Warren
Original Assignee
At&T Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by At&T Corp. filed Critical At&T Corp.
Publication of HK1000549A1 publication Critical patent/HK1000549A1/en
Publication of HK1000549B publication Critical patent/HK1000549B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/66—Conductive materials thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0315—Oxidising metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Multi-Conductor Connections (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
HK97102144.5A 1994-04-01 1997-11-10 Film circuit metal system for use with bumped ic packages HK1000549B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/221,731 US5449955A (en) 1994-04-01 1994-04-01 Film circuit metal system for use with bumped IC packages
US221731 1994-04-01

Publications (2)

Publication Number Publication Date
HK1000549A1 true HK1000549A1 (en) 1998-04-03
HK1000549B HK1000549B (en) 1998-04-03

Family

ID=

Also Published As

Publication number Publication date
KR950034675A (ko) 1995-12-28
US5449955A (en) 1995-09-12
KR100304993B1 (ko) 2001-11-30
EP0675674B1 (en) 1997-07-02
TW278223B (enExample) 1996-06-11
EP0675674A1 (en) 1995-10-04
JPH07297540A (ja) 1995-11-10
JP3373324B2 (ja) 2003-02-04
DE69500388T2 (de) 1997-10-23
DE69500388D1 (de) 1997-08-07

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)