HK1000381A1 - Electroplated alloy coatings having stable alloy composition - Google Patents

Electroplated alloy coatings having stable alloy composition

Info

Publication number
HK1000381A1
HK1000381A1 HK97101974A HK97101974A HK1000381A1 HK 1000381 A1 HK1000381 A1 HK 1000381A1 HK 97101974 A HK97101974 A HK 97101974A HK 97101974 A HK97101974 A HK 97101974A HK 1000381 A1 HK1000381 A1 HK 1000381A1
Authority
HK
Hong Kong
Prior art keywords
alloy
electroplated
stable
coatings
composition
Prior art date
Application number
HK97101974A
Other languages
English (en)
Inventor
Graham Arthur Hughes
Keating Kenneth Bernard
Original Assignee
Connector Systems Technology
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US07/176,805 external-priority patent/US4846941A/en
Priority claimed from US07/188,557 external-priority patent/US4849303A/en
Application filed by Connector Systems Technology filed Critical Connector Systems Technology
Publication of HK1000381A1 publication Critical patent/HK1000381A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacture Of Switches (AREA)
  • Contacts (AREA)
HK97101974A 1988-04-01 1997-10-21 Electroplated alloy coatings having stable alloy composition HK1000381A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/176,805 US4846941A (en) 1986-07-01 1988-04-01 Electroplating bath and process for maintaining plated alloy composition stable
US07/188,557 US4849303A (en) 1986-07-01 1988-04-29 Alloy coatings for electrical contacts

Publications (1)

Publication Number Publication Date
HK1000381A1 true HK1000381A1 (en) 1998-03-13

Family

ID=26872613

Family Applications (1)

Application Number Title Priority Date Filing Date
HK97101974A HK1000381A1 (en) 1988-04-01 1997-10-21 Electroplated alloy coatings having stable alloy composition

Country Status (6)

Country Link
EP (1) EP0335683B1 (de)
JP (1) JPH0277595A (de)
KR (1) KR960015548B1 (de)
AU (1) AU612808B2 (de)
DE (1) DE68909984T2 (de)
HK (1) HK1000381A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU602558B2 (en) * 1988-03-01 1990-10-18 E.I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plating alloy composition stable
TWI403004B (en) * 2009-09-04 2013-07-21 Led package structure for increasing heat-dissipating effect and light-emitting efficiency and method for making the same
CN102409374A (zh) * 2011-11-28 2012-04-11 上海应用技术学院 一种镍-钼镀层的制备方法
KR101953970B1 (ko) * 2016-06-29 2019-03-05 동국대학교 경주캠퍼스 산학협력단 미세분무용 다공성 필터의 제조방법 및 이를 이용하여 제조된 다공성 필터
JP6766282B1 (ja) * 2020-02-26 2020-10-07 松田産業株式会社 パラジウム−ニッケル合金めっき膜及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3206383A (en) * 1964-03-26 1965-09-14 Kappel Mario Electrolyte for use in the galvanic deposition of bright leveling nickel coatings
US3467584A (en) * 1966-10-24 1969-09-16 Ernest H Lyons Jr Plating platinum metals on chromium
US3726768A (en) * 1971-04-23 1973-04-10 Atomic Energy Commission Nickel plating baths containing aromatic sulfonic acids
US4358352A (en) * 1981-06-22 1982-11-09 Mpd Technology Corporation Electrodeposition of platinum from a cis-diamminedihaloplatinum (II) electrolyte
US4463060A (en) * 1983-11-15 1984-07-31 E. I. Du Pont De Nemours And Company Solderable palladium-nickel coatings and method of making said coatings
US4743346A (en) * 1986-07-01 1988-05-10 E. I. Du Pont De Nemours And Company Electroplating bath and process for maintaining plated alloy composition stable
ATE89337T1 (de) * 1988-02-25 1993-05-15 Du Pont Elektroplattierungsbad und verfahren zum stabilhalten der zusammensetzung der plattierten legierung.

Also Published As

Publication number Publication date
AU3222989A (en) 1989-10-05
JPH0317915B2 (de) 1991-03-11
EP0335683A3 (en) 1990-01-17
EP0335683A2 (de) 1989-10-04
KR890016216A (ko) 1989-11-28
JPH0277595A (ja) 1990-03-16
KR960015548B1 (ko) 1996-11-18
EP0335683B1 (de) 1993-10-20
DE68909984D1 (de) 1993-11-25
AU612808B2 (en) 1991-07-18
DE68909984T2 (de) 1994-04-21

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)