GB986360A - Process for the fabrication of high definition apertured masks - Google Patents

Process for the fabrication of high definition apertured masks

Info

Publication number
GB986360A
GB986360A GB3726063A GB3726063A GB986360A GB 986360 A GB986360 A GB 986360A GB 3726063 A GB3726063 A GB 3726063A GB 3726063 A GB3726063 A GB 3726063A GB 986360 A GB986360 A GB 986360A
Authority
GB
United Kingdom
Prior art keywords
lamina
etchant
etching
acid
high definition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3726063A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCR Voyix Corp
National Cash Register Co
Original Assignee
NCR Corp
National Cash Register Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCR Corp, National Cash Register Co filed Critical NCR Corp
Publication of GB986360A publication Critical patent/GB986360A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/22Diffusion of impurity materials, e.g. doping materials, electrode materials, into or out of a semiconductor body, or between semiconductor regions; Interactions between two or more impurities; Redistribution of impurities
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/02Local etching
    • C23F1/04Chemical milling
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/20Masks or mask blanks for imaging by charged particle beam [CPB] radiation, e.g. by electron beam; Preparation thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • ing And Chemical Polishing (AREA)
  • Manufacture Or Reproduction Of Printing Formes (AREA)
GB3726063A 1962-11-02 1963-09-23 Process for the fabrication of high definition apertured masks Expired GB986360A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US23511262A 1962-11-02 1962-11-02

Publications (1)

Publication Number Publication Date
GB986360A true GB986360A (en) 1965-03-17

Family

ID=22884146

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3726063A Expired GB986360A (en) 1962-11-02 1963-09-23 Process for the fabrication of high definition apertured masks

Country Status (4)

Country Link
BE (1) BE638835A (enrdf_load_stackoverflow)
CH (1) CH418092A (enrdf_load_stackoverflow)
GB (1) GB986360A (enrdf_load_stackoverflow)
NL (1) NL299392A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2705044C1 (ru) * 2018-11-22 2019-11-01 Сергей Геннадьевич Каплунов Способ получения рельефного изображения на металлическом основании
RU2716919C1 (ru) * 2019-09-20 2020-03-17 Сергей Геннадьевич Каплунов Способ воспроизведения авторских рисунков на металлографской доске методом углубленной гравюры
RU2722799C1 (ru) * 2019-10-10 2020-06-03 Сергей Геннадьевич Каплунов Способ воспроизведения авторских рисунков на металлографской доске методом углубленной гравюры
RU2722966C1 (ru) * 2019-11-05 2020-06-05 Сергей Геннадьевич Каплунов Способ изготовления печатной формы для офорта
CN113140654A (zh) * 2021-03-31 2021-07-20 扬州工业职业技术学院 一种太阳能电池金属基的制备方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2705044C1 (ru) * 2018-11-22 2019-11-01 Сергей Геннадьевич Каплунов Способ получения рельефного изображения на металлическом основании
WO2020106176A1 (ru) * 2018-11-22 2020-05-28 Сергей Геннадьевич КАПЛУНОВ Способ получения рельефного изображения на металлическом основании
RU2716919C1 (ru) * 2019-09-20 2020-03-17 Сергей Геннадьевич Каплунов Способ воспроизведения авторских рисунков на металлографской доске методом углубленной гравюры
RU2722799C1 (ru) * 2019-10-10 2020-06-03 Сергей Геннадьевич Каплунов Способ воспроизведения авторских рисунков на металлографской доске методом углубленной гравюры
RU2722966C1 (ru) * 2019-11-05 2020-06-05 Сергей Геннадьевич Каплунов Способ изготовления печатной формы для офорта
CN113140654A (zh) * 2021-03-31 2021-07-20 扬州工业职业技术学院 一种太阳能电池金属基的制备方法

Also Published As

Publication number Publication date
NL299392A (enrdf_load_stackoverflow)
CH418092A (fr) 1966-07-31
BE638835A (enrdf_load_stackoverflow)

Similar Documents

Publication Publication Date Title
GB1249360A (en) Lead assembly and method of making the same
GB1332702A (en) Photomasks
GB986360A (en) Process for the fabrication of high definition apertured masks
GB1430044A (en) Etching palladium films
ES357158A1 (es) Metodo para la disolucion de cromo especialmente aplicable en la preparacion de una plantilla fotolitografica de perfi-les muy definidos.
GB1066366A (en) Process for the production of printing plates
GB1084003A (en) Improvements in forming apertures in an electrically insulating layer
GB1210140A (en) Improvements in or relating to contact exposure masks for photoresist layers
GB1139986A (en) Improvements in and relating to the selective removal of material
ES427463A1 (es) Procedimiento para corroer aluminio y aleaciones de alumi- nio.
GB1117994A (en) Aqueous alkali aluminum etchants
GB1240260A (en) Improvements in or relating to the production of shaped elements from metal plates by etching
ES376631A1 (es) Procedimiento para el mordentado de piezas metalicas.
GB928079A (en) Method of fabricating small elements of thin magnetic film
GB1297203A (enrdf_load_stackoverflow)
GB750868A (en) Metal printing plate and method of producing same
GB980715A (en) Improvements in or relating to the manufacture of deposited electrical circuits, electrical components, electrical circuit elements and the like
GB1341159A (en) Formation of relief images
JPS5692542A (en) Nesa film etching method
JPS56140353A (en) Suspended metallic mask screen plate
GB978793A (en) Improvements in and relating to printed circuits
JPS53105982A (en) Micropattern formation method
FR2101771A5 (enrdf_load_stackoverflow)
GB1113508A (en) Improvements in or relating to photolithographic printing plates
GB1038481A (en) Improvements in and relating to the production of thin metal apertured sheets