GB9726685D0 - Chemical mechanical polishing methods using low ph slurry mixtures - Google Patents

Chemical mechanical polishing methods using low ph slurry mixtures

Info

Publication number
GB9726685D0
GB9726685D0 GBGB9726685.2A GB9726685A GB9726685D0 GB 9726685 D0 GB9726685 D0 GB 9726685D0 GB 9726685 A GB9726685 A GB 9726685A GB 9726685 D0 GB9726685 D0 GB 9726685D0
Authority
GB
United Kingdom
Prior art keywords
low
mechanical polishing
chemical mechanical
polishing methods
slurry mixtures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9726685.2A
Other versions
GB2326523B (en
GB2326523A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
United Microelectronics Corp
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/976,605 external-priority patent/US6362101B2/en
Priority to US08/976,605 priority Critical patent/US6362101B2/en
Priority to JP9346644A priority patent/JPH11186200A/en
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to NL1007819A priority patent/NL1007819C2/en
Priority to GB9726685A priority patent/GB2326523B/en
Priority to DE19757119A priority patent/DE19757119A1/en
Priority to FR9716332A priority patent/FR2772986B1/en
Priority claimed from NL1007897A external-priority patent/NL1007897C1/en
Publication of GB9726685D0 publication Critical patent/GB9726685D0/en
Publication of GB2326523A publication Critical patent/GB2326523A/en
Publication of GB2326523B publication Critical patent/GB2326523B/en
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/14—Anti-slip materials; Abrasives
    • C09K3/1454—Abrasive powders, suspensions and pastes for polishing
    • C09K3/1463—Aqueous liquid suspensions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB9726685A 1997-11-24 1997-12-17 Chemical mechanical polishing methods using low ph slurry mixtures Expired - Fee Related GB2326523B (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US08/976,605 US6362101B2 (en) 1997-11-24 1997-11-24 Chemical mechanical polishing methods using low pH slurry mixtures
JP9346644A JPH11186200A (en) 1997-11-24 1997-12-16 Chemically/mechanically polishing method using slurry mixture of low ph value
NL1007819A NL1007819C2 (en) 1997-11-24 1997-12-17 Chemical mechanical polishing methods using low pH slurry mixtures.
GB9726685A GB2326523B (en) 1997-11-24 1997-12-17 Chemical mechanical polishing methods using low ph slurry mixtures
DE19757119A DE19757119A1 (en) 1997-11-24 1997-12-20 Chemical mechanical polishing of tungsten@ via plugs
FR9716332A FR2772986B1 (en) 1997-11-24 1997-12-23 CHEMICAL MECHANICAL POLISHING PROCESS USING LOW PH SUSPENSIONS

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US08/976,605 US6362101B2 (en) 1997-11-24 1997-11-24 Chemical mechanical polishing methods using low pH slurry mixtures
JP9346644A JPH11186200A (en) 1997-11-24 1997-12-16 Chemically/mechanically polishing method using slurry mixture of low ph value
GB9726685A GB2326523B (en) 1997-11-24 1997-12-17 Chemical mechanical polishing methods using low ph slurry mixtures
FR9716332A FR2772986B1 (en) 1997-11-24 1997-12-23 CHEMICAL MECHANICAL POLISHING PROCESS USING LOW PH SUSPENSIONS
NL1007897A NL1007897C1 (en) 1997-12-24 1997-12-24 Tensioning device for fabric cover on road vehicle

Publications (3)

Publication Number Publication Date
GB9726685D0 true GB9726685D0 (en) 1998-02-18
GB2326523A GB2326523A (en) 1998-12-23
GB2326523B GB2326523B (en) 1999-11-17

Family

ID=27515630

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9726685A Expired - Fee Related GB2326523B (en) 1997-11-24 1997-12-17 Chemical mechanical polishing methods using low ph slurry mixtures

Country Status (1)

Country Link
GB (1) GB2326523B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69903547T2 (en) * 1998-06-25 2003-07-10 Unova Uk Ltd METHOD AND DEVICE FOR BEVELING SEMICONDUCTOR DISCS
JP2000208454A (en) * 1999-01-18 2000-07-28 Tokyo Seimitsu Co Ltd Method of supplying abrasives to wafer polisher
US6555466B1 (en) * 1999-03-29 2003-04-29 Speedfam Corporation Two-step chemical-mechanical planarization for damascene structures on semiconductor wafers

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5340370A (en) * 1993-11-03 1994-08-23 Intel Corporation Slurries for chemical mechanical polishing

Also Published As

Publication number Publication date
GB2326523B (en) 1999-11-17
GB2326523A (en) 1998-12-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20091217