GB9714587D0 - Wire breaking detection equipment for wire saw - Google Patents

Wire breaking detection equipment for wire saw

Info

Publication number
GB9714587D0
GB9714587D0 GBGB9714587.4A GB9714587A GB9714587D0 GB 9714587 D0 GB9714587 D0 GB 9714587D0 GB 9714587 A GB9714587 A GB 9714587A GB 9714587 D0 GB9714587 D0 GB 9714587D0
Authority
GB
United Kingdom
Prior art keywords
wire
detection equipment
breaking detection
saw
wire saw
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB9714587.4A
Other versions
GB2315556A (en
GB2315556B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Seimitsu Co Ltd
Original Assignee
Tokyo Seimitsu Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Seimitsu Co Ltd filed Critical Tokyo Seimitsu Co Ltd
Publication of GB9714587D0 publication Critical patent/GB9714587D0/en
Publication of GB2315556A publication Critical patent/GB2315556A/en
Application granted granted Critical
Publication of GB2315556B publication Critical patent/GB2315556B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/06—Grinders for cutting-off
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
    • B23D57/0007—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00 using saw wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D59/00—Accessories specially designed for sawing machines or sawing devices
    • B23D59/001—Measuring or control devices, e.g. for automatic control of work feed pressure on band saw blade

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
GB9714587A 1996-07-23 1997-07-10 Wire saw having wire breaking detection equipment Expired - Fee Related GB2315556B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08193674A JP3106294B2 (en) 1996-07-23 1996-07-23 Wire saw wire disconnection detector

Publications (3)

Publication Number Publication Date
GB9714587D0 true GB9714587D0 (en) 1997-09-17
GB2315556A GB2315556A (en) 1998-02-04
GB2315556B GB2315556B (en) 2000-08-23

Family

ID=16311907

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9714587A Expired - Fee Related GB2315556B (en) 1996-07-23 1997-07-10 Wire saw having wire breaking detection equipment

Country Status (6)

Country Link
US (1) US5874678A (en)
JP (1) JP3106294B2 (en)
KR (1) KR100258439B1 (en)
CH (1) CH693785A5 (en)
DE (1) DE19728975A1 (en)
GB (1) GB2315556B (en)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1110509A (en) * 1997-06-24 1999-01-19 Nippei Toyama Corp Mechanism for applying tension to wire saw
US6024080A (en) * 1997-07-07 2000-02-15 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US7090560B2 (en) * 2004-07-28 2006-08-15 3M Innovative Properties Company System and method for detecting abrasive article orientation
US20060025047A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Grading system and method for abrasive article
US20060025048A1 (en) * 2004-07-28 2006-02-02 3M Innovative Properties Company Abrasive article detection system and method
EP1738886A1 (en) * 2005-06-27 2007-01-03 HCT Shaping Systems S.A. Method of detecting dysfunctions in a wire sawing device and device for carrying out said method
JP2008183806A (en) * 2007-01-30 2008-08-14 Toyo Advanced Technologies Co Ltd Wire saw
DE102007008123A1 (en) * 2007-02-19 2008-08-21 Cedima Diamantwerkzeug- Und Maschinenbaugesellschaft Mbh Sawing cable tear determining device, has cable tear-sensor arranged in connecting element that connects cable ends of sawing cable with each other and emitting electric current through sawing cable and producing cable tear-signal
JP2010222088A (en) 2009-03-23 2010-10-07 Kobe Steel Ltd Welding wire rewinding method
JP5470593B2 (en) * 2010-01-14 2014-04-16 株式会社タカトリ Wire saw break detection device
JP5045765B2 (en) * 2010-01-20 2012-10-10 信越半導体株式会社 Ingot cutting method and wire saw
WO2011151022A1 (en) * 2010-06-04 2011-12-08 Meyer Burger Ag Wire saw having wire-break monitoring
MY156158A (en) * 2010-09-27 2016-01-15 Komatsu Ntc Ltd Method and apparatus for detecting a wire break in a wire saw
KR101038182B1 (en) * 2011-01-21 2011-06-01 오성엘에스티(주) Apparatus of wire saw
KR101084966B1 (en) * 2011-01-31 2011-11-23 오성엘에스티(주) The sensing method of wire disconnection for the wire saw device
CN102756433B (en) * 2011-04-29 2015-07-15 苏州协鑫光伏科技有限公司 Method for rescuing broken wire during silicon wafer linear cutting
DE102011075747A1 (en) 2011-05-12 2012-11-15 Matthias Vogel Wire saw for use in manufacture of wafers in semiconductor and photovoltaic industries, includes a wire-break monitoring device which is comprised of two electromagnetically acting coils, for monitoring brakeage of saw wire
JP5875277B2 (en) * 2011-08-04 2016-03-02 トーヨーエイテック株式会社 Wire saw
US20130144421A1 (en) * 2011-12-01 2013-06-06 Memc Electronic Materials, Spa Systems For Controlling Temperature Of Bearings In A Wire Saw
WO2014174350A1 (en) * 2013-04-24 2014-10-30 Meyer Burger Ag Wire saw
CN104227858B (en) * 2014-08-21 2015-10-14 浙江辉弘光电能源有限公司 A kind of multi-line cutting machine broken wire protecting equipment
CN104859064B (en) * 2015-05-26 2017-03-22 苏州晶樱光电科技有限公司 Broken wire monitoring device for silicon rod slicer
CN105415511A (en) * 2015-11-24 2016-03-23 英利能源（中国）有限公司 Steel wire sand-carrying amount detection equipment and silicon slice cutting system with same
CN106495044B (en) * 2016-12-29 2019-05-17 三一海洋重工有限公司 Groove skipping of steel rope while detection method and detection device
US11511381B2 (en) 2018-08-29 2022-11-29 Illinois Tool Works Inc. Movement control of material removal systems

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3841297A (en) * 1971-12-01 1974-10-15 Motorola Inc Machine for cutting brittle materials

Also Published As

Publication number Publication date
US5874678A (en) 1999-02-23
GB2315556A (en) 1998-02-04
DE19728975A1 (en) 1998-01-29
JP3106294B2 (en) 2000-11-06
JPH1034515A (en) 1998-02-10
GB2315556B (en) 2000-08-23
KR980008455A (en) 1998-04-30
CH693785A5 (en) 2004-02-13
KR100258439B1 (en) 2000-12-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20050710