GB9714116D0 - Organic material etching method - Google Patents
Organic material etching methodInfo
- Publication number
- GB9714116D0 GB9714116D0 GBGB9714116.2A GB9714116A GB9714116D0 GB 9714116 D0 GB9714116 D0 GB 9714116D0 GB 9714116 A GB9714116 A GB 9714116A GB 9714116 D0 GB9714116 D0 GB 9714116D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- organic material
- etching method
- material etching
- organic
- etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000005530 etching Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 239000011368 organic material Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/311—Etching the insulating layers by chemical or physical means
- H01L21/31144—Etching the insulating layers by chemical or physical means using masks
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133345—Insulating layers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Drying Of Semiconductors (AREA)
- Liquid Crystal (AREA)
- Thin Film Transistor (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960028525A KR100237005B1 (en) | 1996-07-15 | 1996-07-15 | Etching method of insulating film in liquid crystal display device |
KR1019960028527A KR100237003B1 (en) | 1996-07-15 | 1996-07-15 | Etching method of structure in liquid crystal display device |
Publications (2)
Publication Number | Publication Date |
---|---|
GB9714116D0 true GB9714116D0 (en) | 1997-09-10 |
GB2315245A GB2315245A (en) | 1998-01-28 |
Family
ID=26632019
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9714116A Withdrawn GB2315245A (en) | 1996-07-15 | 1997-07-03 | Etching a hole in an organic passivation layer for an LCD |
Country Status (4)
Country | Link |
---|---|
JP (1) | JPH1096960A (en) |
DE (1) | DE19730322A1 (en) |
FR (1) | FR2751468A1 (en) |
GB (1) | GB2315245A (en) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100255592B1 (en) * | 1997-03-19 | 2000-05-01 | 구본준 | The structure and manufacturing method of lcd |
DE19956904C2 (en) * | 1999-11-26 | 2003-08-07 | United Monolithic Semiconduct | Integrated amplitude limiter or limiter and method for producing an integrated limiter |
JP4677654B2 (en) * | 2000-04-19 | 2011-04-27 | 日本電気株式会社 | Transmission type liquid crystal display device and manufacturing method thereof |
KR100586240B1 (en) * | 2000-05-18 | 2006-06-02 | 엘지.필립스 엘시디 주식회사 | Method for fabricating the array substrate for LCD and the same |
JP2004172389A (en) | 2002-11-20 | 2004-06-17 | Renesas Technology Corp | Semiconductor device and method for manufacturing the same |
JP3879751B2 (en) | 2004-07-27 | 2007-02-14 | セイコーエプソン株式会社 | Contact hole forming method, circuit board manufacturing method, and electro-optical device manufacturing method |
JP2006126255A (en) * | 2004-10-26 | 2006-05-18 | Mitsubishi Electric Corp | Electrooptical device, liquid crystal display device, and method for manufacturing them |
DE102004063036A1 (en) * | 2004-12-28 | 2006-07-06 | Advanced Micro Devices, Inc., Sunnyvale | Method for forming contact spots |
KR102282866B1 (en) | 2012-07-20 | 2021-07-27 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | Display device and electronic device including the display device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4507331A (en) * | 1983-12-12 | 1985-03-26 | International Business Machines Corporation | Dry process for forming positive tone micro patterns |
US4661204A (en) * | 1985-10-25 | 1987-04-28 | Tandem Computers Inc. | Method for forming vertical interconnects in polyimide insulating layers |
US4687543A (en) * | 1986-02-21 | 1987-08-18 | Tegal Corporation | Selective plasma etching during formation of integrated circuitry |
US5453157A (en) * | 1994-05-16 | 1995-09-26 | Texas Instruments Incorporated | Low temperature anisotropic ashing of resist for semiconductor fabrication |
-
1997
- 1997-06-24 FR FR9707833A patent/FR2751468A1/en not_active Withdrawn
- 1997-07-03 GB GB9714116A patent/GB2315245A/en not_active Withdrawn
- 1997-07-10 JP JP20091797A patent/JPH1096960A/en not_active Withdrawn
- 1997-07-15 DE DE19730322A patent/DE19730322A1/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
DE19730322A1 (en) | 1998-01-29 |
GB2315245A (en) | 1998-01-28 |
JPH1096960A (en) | 1998-04-14 |
FR2751468A1 (en) | 1998-01-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |