GB9618781D0 - An electromechanical sensor device and a method of manufacturing it - Google Patents

An electromechanical sensor device and a method of manufacturing it

Info

Publication number
GB9618781D0
GB9618781D0 GB9618781A GB9618781A GB9618781D0 GB 9618781 D0 GB9618781 D0 GB 9618781D0 GB 9618781 A GB9618781 A GB 9618781A GB 9618781 A GB9618781 A GB 9618781A GB 9618781 D0 GB9618781 D0 GB 9618781D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
sensor device
electromechanical sensor
electromechanical
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9618781A
Other versions
GB2304903A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sagem SA
Original Assignee
Sagem SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sagem SA filed Critical Sagem SA
Publication of GB9618781D0 publication Critical patent/GB9618781D0/en
Publication of GB2304903A publication Critical patent/GB2304903A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
    • G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
    • G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
    • G01C19/5783—Mountings or housings not specific to any of the devices covered by groups G01C19/5607 - G01C19/5719
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0072—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance
    • G01L9/0073—Transmitting or indicating the displacement of flexible diaphragms using variations in capacitance using a semiconductive diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
    • G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
    • G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
    • G01P2015/0814—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for translational movement of the mass, e.g. shuttle type
GB9618781A 1995-09-07 1996-09-09 An electromechanical sensor device and a method of manufacturing it Withdrawn GB2304903A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR9510479A FR2738705B1 (en) 1995-09-07 1995-09-07 ELECTROMECHANICAL SENSOR DEVICE AND METHOD FOR MANUFACTURING SUCH A DEVICE

Publications (2)

Publication Number Publication Date
GB9618781D0 true GB9618781D0 (en) 1996-10-23
GB2304903A GB2304903A (en) 1997-03-26

Family

ID=9482335

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9618781A Withdrawn GB2304903A (en) 1995-09-07 1996-09-09 An electromechanical sensor device and a method of manufacturing it

Country Status (4)

Country Link
DE (1) DE19636543A1 (en)
FR (1) FR2738705B1 (en)
GB (1) GB2304903A (en)
NO (1) NO963719L (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2320571B (en) * 1996-12-20 2000-09-27 Aisin Seiki Semiconductor micromachine and manufacturing method thereof
US6359333B1 (en) * 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
AU3517600A (en) 1999-03-17 2000-10-04 Input/Output, Inc. Calibration of sensors
FI108986B (en) 1999-07-01 2002-04-30 Emfitech Oy Process for producing a sensor element and a sensor element
JP4134853B2 (en) * 2003-09-05 2008-08-20 株式会社デンソー Capacitive mechanical sensor device
GB0421416D0 (en) * 2004-09-25 2004-10-27 Europ Technology For Business Gyroscopes and accelerometers
JP4380618B2 (en) * 2005-10-21 2009-12-09 株式会社デンソー Sensor device

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4277814A (en) * 1979-09-04 1981-07-07 Ford Motor Company Semiconductor variable capacitance pressure transducer assembly
JPS58154254A (en) * 1982-03-10 1983-09-13 Hitachi Ltd Semiconductor device
US4829818A (en) * 1983-12-27 1989-05-16 Honeywell Inc. Flow sensor housing
JPS60150660A (en) * 1984-01-17 1985-08-08 Mitsubishi Electric Corp Semiconductor device
IT1203535B (en) * 1986-02-10 1989-02-15 Marelli Autronica PROCEDURE FOR THE REALIZATION OF THE MECHANICAL AND ELECTRICAL CONNECTION BETWEEN TWO BODIES IN PARTICULAR BETWEEN THE MEMBRANE AND THE SUPPORT OF A THICK FILM PRESSURE SENSOR AND DEVICES REALIZED WITH SUCH PROCEDURE
JPH0736444B2 (en) * 1986-12-19 1995-04-19 工業技術院長 Tactile sensor
DE69013104T2 (en) * 1989-07-29 1995-03-23 Shimadzu Corp Semiconductor radiation image detector and its manufacturing method.
JPH0797056B2 (en) * 1990-03-02 1995-10-18 株式会社富士電機総合研究所 Distributed tactile sensor
US5164328A (en) * 1990-06-25 1992-11-17 Motorola, Inc. Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip
US5346857A (en) * 1992-09-28 1994-09-13 Motorola, Inc. Method for forming a flip-chip bond from a gold-tin eutectic

Also Published As

Publication number Publication date
NO963719L (en) 1997-03-10
DE19636543A1 (en) 1997-03-13
NO963719D0 (en) 1996-09-06
FR2738705B1 (en) 1997-11-07
GB2304903A (en) 1997-03-26
FR2738705A1 (en) 1997-03-14

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)