GB9610969D0 - Thin film forming apparatus - Google Patents

Thin film forming apparatus

Info

Publication number
GB9610969D0
GB9610969D0 GBGB9610969.9A GB9610969A GB9610969D0 GB 9610969 D0 GB9610969 D0 GB 9610969D0 GB 9610969 A GB9610969 A GB 9610969A GB 9610969 D0 GB9610969 D0 GB 9610969D0
Authority
GB
United Kingdom
Prior art keywords
thin film
forming apparatus
film forming
thin
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GBGB9610969.9A
Other versions
GB2300000A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP34558492A external-priority patent/JP3255469B2/en
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9610969D0 publication Critical patent/GB9610969D0/en
Publication of GB2300000A publication Critical patent/GB2300000A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/08—Oxides
    • C23C14/087—Oxides of copper or solid solutions thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/0021—Reactive sputtering or evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/021—Cleaning or etching treatments
    • C23C14/022—Cleaning or etching treatments by means of bombardment with energetic particles or radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3471—Introduction of auxiliary energy into the plasma
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/541—Heating or cooling of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process
    • C23C14/542—Controlling the film thickness or evaporation rate
    • C23C14/545—Controlling the film thickness or evaporation rate using measurement on deposited material
    • C23C14/547—Controlling the film thickness or evaporation rate using measurement on deposited material using optical methods
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/564—Means for minimising impurities in the coating chamber such as dust, moisture, residual gases
GB9610969A 1992-11-30 1993-11-29 Thin film forming using laser and activated oxidising gas Withdrawn GB2300000A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP34558492A JP3255469B2 (en) 1992-11-30 1992-11-30 Laser thin film forming equipment
GB9324498A GB2272912B (en) 1992-11-30 1993-11-29 Thin Film forming apparatus using laser

Publications (2)

Publication Number Publication Date
GB9610969D0 true GB9610969D0 (en) 1996-07-31
GB2300000A GB2300000A (en) 1996-10-23

Family

ID=26303932

Family Applications (4)

Application Number Title Priority Date Filing Date
GB9611008A Expired - Fee Related GB2300001B (en) 1992-11-30 1993-11-29 Thin film forming apparatus using laser
GB9610953A Expired - Fee Related GB2303379B (en) 1992-11-30 1993-11-29 Thin film forming apparatus using laser
GB9611007A Expired - Fee Related GB2300426B (en) 1992-11-30 1993-11-29 Thin film forming apparatus using laser
GB9610969A Withdrawn GB2300000A (en) 1992-11-30 1993-11-29 Thin film forming using laser and activated oxidising gas

Family Applications Before (3)

Application Number Title Priority Date Filing Date
GB9611008A Expired - Fee Related GB2300001B (en) 1992-11-30 1993-11-29 Thin film forming apparatus using laser
GB9610953A Expired - Fee Related GB2303379B (en) 1992-11-30 1993-11-29 Thin film forming apparatus using laser
GB9611007A Expired - Fee Related GB2300426B (en) 1992-11-30 1993-11-29 Thin film forming apparatus using laser

Country Status (1)

Country Link
GB (4) GB2300001B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3255469B2 (en) * 1992-11-30 2002-02-12 三菱電機株式会社 Laser thin film forming equipment
ES2325894B1 (en) * 2006-02-24 2010-10-28 Universidad De Cadiz METHOD AND APPARATUS FOR THE MANUFACTURE OF DIFFACTIVE OPTICAL ELEMENTS.
ES2299335B2 (en) * 2006-03-09 2010-10-13 Universidad De Cadiz METHOD FOR THE MANUFACTURE OF OPTICAL STRUCTURES WITH PURELY REFRACTIVE FUNCTIONALITY.
CN103774097B (en) * 2014-01-23 2015-07-01 中国科学院合肥物质科学研究院 High-intensity magnetic field assisted pulsed laser deposition system
CN107884918A (en) * 2017-11-13 2018-04-06 中国科学院合肥物质科学研究院 High energy ultraviolet laser gatherer under a kind of high-intensity magnetic field

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1553582A (en) * 1977-04-14 1979-09-26 Boc Ltd Laser beam splitting apparatus
US4664769A (en) * 1985-10-28 1987-05-12 International Business Machines Corporation Photoelectric enhanced plasma glow discharge system and method including radiation means
US4857699A (en) * 1987-01-30 1989-08-15 Duley Walter W Means of enhancing laser processing efficiency of metals
JPH01219155A (en) * 1988-02-25 1989-09-01 Mitsubishi Electric Corp Laser vapor deposition apparatus
EP0431160B1 (en) * 1988-03-16 1995-05-17 Kabushiki Kaisha Toshiba Process for producing thin-film oxide superconductor
US4987007A (en) * 1988-04-18 1991-01-22 Board Of Regents, The University Of Texas System Method and apparatus for producing a layer of material from a laser ion source
DE3816192A1 (en) * 1988-05-11 1989-11-23 Siemens Ag METHOD FOR PRODUCING A LAYER FROM A METAL-OXIDIC SUPRAL-CONDUCTOR MATERIAL BY LASER EVAPORATION
JPH02104660A (en) * 1988-06-21 1990-04-17 Furukawa Electric Co Ltd:The Laser-beam sputtering method
JPH08970B2 (en) * 1988-10-31 1996-01-10 日本電信電話株式会社 Method for forming multi-element compound thin film
DE3914476C1 (en) * 1989-05-02 1990-06-21 Forschungszentrum Juelich Gmbh, 5170 Juelich, De
DE69032824T2 (en) * 1989-07-06 1999-06-10 Toyota Motor Co Ltd Laser vapor deposition process
JPH0354104A (en) * 1989-07-21 1991-03-08 Chiyoudendou Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai Laser type vapor deposition apparatus for production of oxide superconductor
JPH0375362A (en) * 1989-08-18 1991-03-29 Furukawa Electric Co Ltd:The Production of thin oxide superconductor film
DE4000690A1 (en) * 1990-01-12 1991-07-18 Philips Patentverwaltung PROCESS FOR PRODUCING ULTRAFINE PARTICLES AND THEIR USE
JP2581255B2 (en) * 1990-04-02 1997-02-12 富士電機株式会社 Plasma processing method
GB2250751B (en) * 1990-08-24 1995-04-12 Kawasaki Heavy Ind Ltd Process for the production of dielectric thin films
JPH04114904A (en) * 1990-08-31 1992-04-15 Sumitomo Electric Ind Ltd Preparation of high-quality thin superconducting film of oxide
JPH05331632A (en) * 1992-06-01 1993-12-14 Matsushita Electric Ind Co Ltd Laser abrasion device and formation of thin film
JPH06272022A (en) * 1993-03-19 1994-09-27 Chodendo Hatsuden Kanren Kiki Zairyo Gijutsu Kenkyu Kumiai Laser assisted deposition system and formation of polycrystal thin film using the same
JPH07331422A (en) * 1994-06-09 1995-12-19 Toshiba Corp Laser abrasion device

Also Published As

Publication number Publication date
GB2303379A (en) 1997-02-19
GB2300426A (en) 1996-11-06
GB9611007D0 (en) 1996-07-31
GB2300001A (en) 1996-10-23
GB2300001B (en) 1997-05-28
GB2300426B (en) 1997-05-28
GB2303379B (en) 1997-05-28
GB2300000A (en) 1996-10-23
GB9611008D0 (en) 1996-07-31
GB9610953D0 (en) 1996-07-31

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)