GB959373A - Improvements in or relating to transistors - Google Patents
Improvements in or relating to transistorsInfo
- Publication number
- GB959373A GB959373A GB15943/60A GB1594360A GB959373A GB 959373 A GB959373 A GB 959373A GB 15943/60 A GB15943/60 A GB 15943/60A GB 1594360 A GB1594360 A GB 1594360A GB 959373 A GB959373 A GB 959373A
- Authority
- GB
- United Kingdom
- Prior art keywords
- cup
- copper
- disc
- housing
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/041—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction having no base used as a mounting for the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
959,373. Transistors. GENERAL ELECTRIC CO. Ltd. May 2, 1961 [May 5, 1960], No. 15943/60. Heading H1K. Good thermal contact between a relatively massive metallic member and a metallic part of an envelope enclosing a transistor, comprising a semi-conductor body mounted on the member which also acts as a base electrode, is obtained by deforming the envelope after assembly. Semi-conductor wafer 1 is mounted in a dished portion 7 of a metallic member 6, of tinned nickel, which is welded at one end to an upstanding tag 10 of a copper cup 9, and at the other end to wire 20 welded to a tag 11 on the cup. The cup 9 rests on a glass disc 17 sealed into a lower housing part 15, also of copper, and wire 20, and collector and emitter wires 19 and 18 are sealed through disc 17. The copper upper housing part 22 is placed over the assembly and flanges 16, 23 are cold pressure welded together in a dry air atmosphere, the inward flow of metal during welding deforming the housing into good contact with cup 9 and securing the latter in position. In a modification (Fig. 4, not shown), cup 9 is replaced by a copper disc spaced from the glass disc 17 by a wire ring so that on deformation of the housing the copper disc bites into the wall of the housing.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB15943/60A GB959373A (en) | 1960-05-05 | 1960-05-05 | Improvements in or relating to transistors |
FR860983A FR1288600A (en) | 1960-05-05 | 1961-05-05 | Improvements concerning transistors |
GB24102/61A GB1002144A (en) | 1960-05-05 | 1961-07-04 | Improvements in or relating to transistors |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB15943/60A GB959373A (en) | 1960-05-05 | 1960-05-05 | Improvements in or relating to transistors |
GB24102/61A GB1002144A (en) | 1960-05-05 | 1961-07-04 | Improvements in or relating to transistors |
Publications (1)
Publication Number | Publication Date |
---|---|
GB959373A true GB959373A (en) | 1964-06-03 |
Family
ID=62527902
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB15943/60A Expired GB959373A (en) | 1960-05-05 | 1960-05-05 | Improvements in or relating to transistors |
GB24102/61A Expired GB1002144A (en) | 1960-05-05 | 1961-07-04 | Improvements in or relating to transistors |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB24102/61A Expired GB1002144A (en) | 1960-05-05 | 1961-07-04 | Improvements in or relating to transistors |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB959373A (en) |
-
1960
- 1960-05-05 GB GB15943/60A patent/GB959373A/en not_active Expired
-
1961
- 1961-07-04 GB GB24102/61A patent/GB1002144A/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB1002144A (en) | 1965-08-25 |
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