GB945575A - Improvements in and relating to printed circuits - Google Patents

Improvements in and relating to printed circuits

Info

Publication number
GB945575A
GB945575A GB4092361A GB4092361A GB945575A GB 945575 A GB945575 A GB 945575A GB 4092361 A GB4092361 A GB 4092361A GB 4092361 A GB4092361 A GB 4092361A GB 945575 A GB945575 A GB 945575A
Authority
GB
United Kingdom
Prior art keywords
solder
patterns
insulating sheet
supports
insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4092361A
Inventor
John Bryan Walker
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BTR Industries Ltd
Original Assignee
BTR Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BTR Industries Ltd filed Critical BTR Industries Ltd
Priority to GB4092361A priority Critical patent/GB945575A/en
Publication of GB945575A publication Critical patent/GB945575A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/4617—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar single-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/063—Lamination of preperforated insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

945,575. Printed circuits. BTR INDUSTRIES Ltd. Nov. 15, 1962 [Nov. 15, 1961], No. 40923/61. Heading H1R. A double-sided printed circuit is made by producing two circuit patterns 14, 18, Fig. 4, on separate insulating supports 10, 12, e.g. by etching, providing upstanding spots of solder E at locations on the patterns which are to be interconnected, bringing the patterns together with an insulating sheet 20, apertured in correspondence with the said locations, between them, and heating at least the metal parts of the assembly so that registering spots of solder, which contact one another within the apertures in the insulating sheet, are fused together. The supports 10, 12 are retained to seal and protect the circuit patterns. Preferably, insulating sheet 20 is of partially cured epoxy resin and the solder is of Pb-Sn (60 : 40) composition, the curing of the resin and the fusing of the solder being effected simultaneously in an oven at 240‹ C.; alternatively, the assembly is heated under pressure. Terminal parts of the circuit patterns may be formed on a margin of one of the insulating supports which is not overlaid by the other support or the insulating sheet. Small holes 26 passing through the solder spots E allow the escape of gases generated during heating. External connections to the circuits may be formed through apertures 26, 26a in the insulating supports 10, 12, as shown in Fig. 6; a wire 28 is fused to the circuit 14 by solder E, and aperture 26a in support 12 is made larger to accommodate the end of the wire.
GB4092361A 1961-11-15 1961-11-15 Improvements in and relating to printed circuits Expired GB945575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4092361A GB945575A (en) 1961-11-15 1961-11-15 Improvements in and relating to printed circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4092361A GB945575A (en) 1961-11-15 1961-11-15 Improvements in and relating to printed circuits

Publications (1)

Publication Number Publication Date
GB945575A true GB945575A (en) 1964-01-02

Family

ID=10417272

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4092361A Expired GB945575A (en) 1961-11-15 1961-11-15 Improvements in and relating to printed circuits

Country Status (1)

Country Link
GB (1) GB945575A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021055015A1 (en) * 2019-09-20 2021-03-25 Raytheon Company Additive manufacturing technology (amt) inverted pad interface

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021055015A1 (en) * 2019-09-20 2021-03-25 Raytheon Company Additive manufacturing technology (amt) inverted pad interface

Similar Documents

Publication Publication Date Title
GB1412363A (en) Attachment of circuit devices to a substrate
GB1342832A (en) Printed circuit boards
GB1229362A (en)
US4675629A (en) Noise filter
GB1470007A (en) Electrical contact pin
GB906194A (en) Electromagnetic switches
GB954506A (en) Electrically insulating spacer for spacing an electrical component from its mountingsurface
GB649254A (en) Improvements in or relating to the manufacture of wiring circuits such as for radio receivers
GB945575A (en) Improvements in and relating to printed circuits
GB1185857A (en) Improvements in or relating to Integrated Circuit Assemblies
GB1269180A (en) Improvements in methods of assembling semiconductor components
GB1041204A (en) Improvements in or relating to electrical terminal connectors
JPS57181144A (en) Semiconductor device
GB1142160A (en) Connections to printed circuit boards
GB1353855A (en) Printed circuit board having connecting members
GB943002A (en) Improvements in and relating to the manufacture of electrical component mounting panels
JPS5749581A (en) Connection between thermal head and heating-energizing circuit
GB854593A (en) Improvements in electrical connecting arrangements
GB2004695A (en) Improvements in or relating to electrical components sheathed with insulating material and methods of making such components
GB1021320A (en) Microminiature electrical connection
GB986824A (en) Improvements in or relating to printed electric circuits
GB1030676A (en) Assemblies of components on printed circuit boards
ES270790A1 (en) Improvements introduced in the manufacture of strips carrying parts small identical electrical components (Machine-translation by Google Translate, not legally binding)
GB1129620A (en) Improvements in and relating to storage matrixes
Harmon Method of Making a Photosensitive Solder Maskant