GB938453A - Improvements in or relating to thermoelectric devices - Google Patents
Improvements in or relating to thermoelectric devicesInfo
- Publication number
- GB938453A GB938453A GB15000/62A GB1500062A GB938453A GB 938453 A GB938453 A GB 938453A GB 15000/62 A GB15000/62 A GB 15000/62A GB 1500062 A GB1500062 A GB 1500062A GB 938453 A GB938453 A GB 938453A
- Authority
- GB
- United Kingdom
- Prior art keywords
- layer
- elements
- bismuth
- tin
- group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910052782 aluminium Inorganic materials 0.000 abstract 7
- 229910052797 bismuth Inorganic materials 0.000 abstract 7
- 229910052802 copper Inorganic materials 0.000 abstract 7
- 239000010949 copper Substances 0.000 abstract 7
- 229910052718 tin Inorganic materials 0.000 abstract 7
- 229910052751 metal Inorganic materials 0.000 abstract 6
- 239000002184 metal Substances 0.000 abstract 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 5
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 4
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 abstract 4
- 239000011248 coating agent Substances 0.000 abstract 4
- 238000000576 coating method Methods 0.000 abstract 4
- 229910001245 Sb alloy Inorganic materials 0.000 abstract 3
- 239000004411 aluminium Substances 0.000 abstract 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 3
- 239000002140 antimony alloy Substances 0.000 abstract 3
- 229910052737 gold Inorganic materials 0.000 abstract 3
- 239000010931 gold Substances 0.000 abstract 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 abstract 3
- 238000005476 soldering Methods 0.000 abstract 3
- 229910001152 Bi alloy Inorganic materials 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 abstract 2
- 239000000956 alloy Substances 0.000 abstract 2
- 229910052787 antimony Inorganic materials 0.000 abstract 2
- 229910052790 beryllium Inorganic materials 0.000 abstract 2
- 230000008021 deposition Effects 0.000 abstract 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract 2
- 150000002739 metals Chemical class 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 229910000679 solder Inorganic materials 0.000 abstract 2
- 229910052725 zinc Inorganic materials 0.000 abstract 2
- 239000011701 zinc Substances 0.000 abstract 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 abstract 1
- 229910000861 Mg alloy Inorganic materials 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- 229910001128 Sn alloy Inorganic materials 0.000 abstract 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 abstract 1
- LESWRIKTQXPFLL-UHFFFAOYSA-N [Sb].[Sn].[Bi] Chemical compound [Sb].[Sn].[Bi] LESWRIKTQXPFLL-UHFFFAOYSA-N 0.000 abstract 1
- 238000007743 anodising Methods 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052804 chromium Inorganic materials 0.000 abstract 1
- 239000011651 chromium Substances 0.000 abstract 1
- 238000001816 cooling Methods 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 abstract 1
- 238000001704 evaporation Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 229910052745 lead Inorganic materials 0.000 abstract 1
- 229910052749 magnesium Inorganic materials 0.000 abstract 1
- 239000011777 magnesium Substances 0.000 abstract 1
- 229910052757 nitrogen Inorganic materials 0.000 abstract 1
- 229910052698 phosphorus Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910052715 tantalum Inorganic materials 0.000 abstract 1
- XSOKHXFFCGXDJZ-UHFFFAOYSA-N telluride(2-) Chemical compound [Te-2] XSOKHXFFCGXDJZ-UHFFFAOYSA-N 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
- H10N10/80—Constructional details
- H10N10/81—Structural details of the junction
- H10N10/817—Structural details of the junction the junction being non-separable, e.g. being cemented, sintered or soldered
Landscapes
- Photovoltaic Devices (AREA)
- Manufacture And Refinement Of Metals (AREA)
Abstract
938,453. Coating with metals; modifying metallic surfaces; alloys. WESTERN ELECTRIC CO. Inc. April 18, 1962 [April 26, 1961], No. 15000/62. Class 82. [Also in Group XXXVI] The ends of pairs of elements 25, 26 of a thermoelectric device are connected by jumper strips 23 made of a metal from either group A (Al, Cu, Ag, Ta and Be) or group B (Al, Cu, and Ag) and bonded to a metal isothermal plate 24 of a metal from group B or A respectively, the bond consisting of a first insulating layer 21 consisting of an oxide or fluoride of one of the metals of Group A and a second layer 22 of Ni, Au or Cu attached to the metal of group B. The elements 25 and 26 consist of N and P types of bismuth telluride and the bond provides a good heat conducting, electrically insulating layer between the elements and heat transfer plates 24 for use in Peltier heating and cooling applications. The bond may be formed by first forming an oxide coating 1 to 20 mils. thick on a jumper strip of Al, Ta or Be by anodising or a fluoride coating 1 to 10 thick on an aluminium or copper jumper strip 23 as described in Specification 938,453. A nickel layer 22 0.4 mil. thick is provided on the oxide or fluoride layer 21 by electroless plating and plate 24 is soldered to layer 22 using a tin, lead bismuth solder. Alternatively layer 22 may be provided by evaporating gold or copper on to a preformed layer of chromium sputtered on to the oxide or fluoride layer 21. In the case of a copper or silver jumper strip 23, elements 25 and 26 may be directly soldered thereto using a tin, bismuth, antimony solder. If strip 23 is aluminium, it may be coated with a zinc, aluminium, magnesium alloy and then soldered to the elements with a tin, bismuth, antimony alloy. Layer 27 of gold or copper may be provided to facilitate soldering of elements 25 and 26 with tin, bismuth and antimony alloy; the soldering may be performed by first coating the elements with the tin bismuth antimony alloy and then soldering with a tin, bismuth alloy. Other jumper strips and associated isothermal plates may be similarly attached to the thermoelectric element; in one embodiment a single plate having a plurality of jumper strips produced by a masked deposition or deposition and masked removal, is described. The following alloys are mentioned: 16% Sn, 32% Pb, 52% Bi; 43% Sn, 57% Bi; 71.5% Sn, 22.8% Bi, 5.7% Sb; 96% Zn, 4% Al, 0.05% Mg.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10569961A | 1961-04-26 | 1961-04-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB938453A true GB938453A (en) | 1963-10-02 |
Family
ID=22307314
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB15000/62A Expired GB938453A (en) | 1961-04-26 | 1962-04-18 | Improvements in or relating to thermoelectric devices |
Country Status (2)
| Country | Link |
|---|---|
| BE (1) | BE616047A (en) |
| GB (1) | GB938453A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3528893A (en) * | 1966-11-22 | 1970-09-15 | Atomic Energy Authority Uk | Vacuum depositing and electrodepositing method of forming a thermoelectric module |
| DE102007010577A1 (en) * | 2007-02-26 | 2008-08-28 | Micropelt Gmbh | Method for manufacturing thermoelectric element, involves arranging electrical contact of electrically conductive contact material at thermoelectric material |
-
0
- BE BE616047D patent/BE616047A/xx unknown
-
1962
- 1962-04-18 GB GB15000/62A patent/GB938453A/en not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3528893A (en) * | 1966-11-22 | 1970-09-15 | Atomic Energy Authority Uk | Vacuum depositing and electrodepositing method of forming a thermoelectric module |
| DE102007010577A1 (en) * | 2007-02-26 | 2008-08-28 | Micropelt Gmbh | Method for manufacturing thermoelectric element, involves arranging electrical contact of electrically conductive contact material at thermoelectric material |
| DE102007010577B4 (en) * | 2007-02-26 | 2009-02-05 | Micropelt Gmbh | Method for producing a thermoelectric component |
Also Published As
| Publication number | Publication date |
|---|---|
| BE616047A (en) |
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