GB9325637D0 - A method of mounting semi-conductor components onto a holder by mechanicyl clamping - Google Patents

A method of mounting semi-conductor components onto a holder by mechanicyl clamping

Info

Publication number
GB9325637D0
GB9325637D0 GB939325637A GB9325637A GB9325637D0 GB 9325637 D0 GB9325637 D0 GB 9325637D0 GB 939325637 A GB939325637 A GB 939325637A GB 9325637 A GB9325637 A GB 9325637A GB 9325637 D0 GB9325637 D0 GB 9325637D0
Authority
GB
United Kingdom
Prior art keywords
holder
clamping
mechanicyl
components onto
conductor components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB939325637A
Other versions
GB2274021A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Airbus Defence and Space GmbH
Original Assignee
Deutsche Aerospace AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Deutsche Aerospace AG filed Critical Deutsche Aerospace AG
Publication of GB9325637D0 publication Critical patent/GB9325637D0/en
Publication of GB2274021A publication Critical patent/GB2274021A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49548—Cross section geometry
    • H01L23/49551—Cross section geometry characterised by bent parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/52—Mounting semiconductor bodies in containers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71—Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72—Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Die Bonding (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Wire Bonding (AREA)

Abstract

A chip 3 is inserted without force into its holder and held in its intended position by mechanical clamping only. In this respect, respective counter mounts 1 and spring elements 2 may be previously punched out from the holder material, and adapted, by bending, to the chip dimensions, the spring elements then serving to hold the chip relative to the counter mounts. After mounting and the making of required electrical connections, the holder will be accommodated in a housing, e.g. by encapsulation. <IMAGE>
GB9325637A 1992-12-16 1993-12-15 A Method of mounting a semi-conductor chip in a holder by mechanical clamping Withdrawn GB2274021A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4242566A DE4242566A1 (en) 1992-12-16 1992-12-16 Process for mounting semiconductor components in housings by mechanical clamping

Publications (2)

Publication Number Publication Date
GB9325637D0 true GB9325637D0 (en) 1994-02-16
GB2274021A GB2274021A (en) 1994-07-06

Family

ID=6475504

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9325637A Withdrawn GB2274021A (en) 1992-12-16 1993-12-15 A Method of mounting a semi-conductor chip in a holder by mechanical clamping

Country Status (4)

Country Link
JP (1) JPH06283640A (en)
DE (1) DE4242566A1 (en)
FR (1) FR2699328A1 (en)
GB (1) GB2274021A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10319470A1 (en) * 2003-04-29 2004-11-25 W. C. Heraeus Gmbh & Co. Kg Metal-plastic composite component and method for its production
US7645639B2 (en) 2004-08-26 2010-01-12 Infineon Technologies Ag Packaging of integrated circuits to lead frames
DE102014216770A1 (en) * 2014-08-22 2016-02-25 Zf Friedrichshafen Ag Sensor module assembly

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60195943A (en) * 1984-03-19 1985-10-04 Hitachi Ltd Semiconductor device
US4766478A (en) * 1986-09-02 1988-08-23 Dennis Richard K Lead frame for semi-conductor device and process of connecting same
US4816427A (en) * 1986-09-02 1989-03-28 Dennis Richard K Process for connecting lead frame to semiconductor device
DE3636373A1 (en) * 1986-10-25 1988-05-05 Heraeus Gmbh W C Connecting clip, method of producing a connecting clip and use of two connecting clips as connecting lugs for a varistor
DE3701310A1 (en) * 1987-01-17 1988-07-28 Bodenseewerk Geraetetech Contact-making device for making contact with surface-mounted integrated circuits
US4870224A (en) * 1988-07-01 1989-09-26 Intel Corporation Integrated circuit package for surface mount technology
US4999740A (en) * 1989-03-06 1991-03-12 Allied-Signal Inc. Electronic device for managing and dissipating heat and for improving inspection and repair, and method of manufacture thereof
US4972294A (en) * 1989-04-03 1990-11-20 Motorola, Inc. Heat sink clip assembly
JPH02268459A (en) * 1989-04-10 1990-11-02 Nec Corp Semiconductor package
DE3924823A1 (en) * 1989-07-27 1991-02-21 Telefunken Electronic Gmbh Semiconductor module with several semiconductors on basic substrate - has cover substrate for all semiconductors with conductive track configuration with terminal face(s)
US5057901A (en) * 1989-09-27 1991-10-15 Die Tech, Inc. Lead frame for semi-conductor device
JPH0437160A (en) * 1990-06-01 1992-02-07 Hitachi Ltd Lead frame and assembly method of semiconductor device which uses lead frame

Also Published As

Publication number Publication date
JPH06283640A (en) 1994-10-07
FR2699328A1 (en) 1994-06-17
GB2274021A (en) 1994-07-06
DE4242566A1 (en) 1994-06-23

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)