GB9313121D0 - Photodetector - Google Patents
PhotodetectorInfo
- Publication number
- GB9313121D0 GB9313121D0 GB939313121A GB9313121A GB9313121D0 GB 9313121 D0 GB9313121 D0 GB 9313121D0 GB 939313121 A GB939313121 A GB 939313121A GB 9313121 A GB9313121 A GB 9313121A GB 9313121 D0 GB9313121 D0 GB 9313121D0
- Authority
- GB
- United Kingdom
- Prior art keywords
- photodetector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2831—Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
- H01L22/34—Circuits for electrically characterising or monitoring manufacturing processes, e. g. whole test die, wafers filled with test structures, on-board-devices incorporated on each die, process control monitors or pad structures thereof, devices in scribe line
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1462—Coatings
- H01L27/14623—Optical shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14643—Photodiode arrays; MOS imagers
- H01L27/14649—Infrared imagers
- H01L27/1465—Infrared imagers of the hybrid type
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5013608A JPH06232234A (en) | 1993-01-29 | 1993-01-29 | Optical detection element |
Publications (3)
Publication Number | Publication Date |
---|---|
GB9313121D0 true GB9313121D0 (en) | 1993-08-11 |
GB2274739A GB2274739A (en) | 1994-08-03 |
GB2274739B GB2274739B (en) | 1996-09-11 |
Family
ID=11837949
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB9313121A Expired - Fee Related GB2274739B (en) | 1993-01-29 | 1993-06-24 | Photodetector |
Country Status (4)
Country | Link |
---|---|
US (1) | US5371352A (en) |
JP (1) | JPH06232234A (en) |
FR (1) | FR2701164B1 (en) |
GB (1) | GB2274739B (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5617036A (en) * | 1995-02-24 | 1997-04-01 | The Whitaker Corporation | Laser/pin assembly with integrated burn-in assembly |
US5692084A (en) * | 1996-06-11 | 1997-11-25 | The Whitaker Corporation | Package for an optoelectronic device |
US5764836A (en) * | 1996-06-11 | 1998-06-09 | The Whitaker Corporation | Pigtailed package for an optoelectronic device |
US5838912A (en) * | 1996-09-04 | 1998-11-17 | International Business Machines Corporation | Distribution of digitally encoded presentations |
CH691237A5 (en) * | 1997-07-15 | 2001-05-31 | Em Microelectronic Marin Sa | integrated photosensor. |
GB2332775A (en) * | 1997-12-23 | 1999-06-30 | Lsi Logic Corp | Testing optical/electronic integrated circuits |
CN108336064B (en) * | 2018-01-30 | 2020-05-05 | 德淮半导体有限公司 | Test apparatus, method of manufacturing test apparatus, and test method |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6211393A (en) * | 1985-07-09 | 1987-01-20 | Toshiba Corp | Probe substrate for testing solid-state image pickup device |
JPH02174161A (en) * | 1988-12-26 | 1990-07-05 | Fuji Xerox Co Ltd | Image readout device |
JP2545154B2 (en) * | 1990-06-04 | 1996-10-16 | 松下電器産業株式会社 | Method of forming contact structure |
JPH0485961A (en) * | 1990-07-30 | 1992-03-18 | Mitsubishi Electric Corp | Optical sensor |
-
1993
- 1993-01-29 JP JP5013608A patent/JPH06232234A/en active Pending
- 1993-06-24 GB GB9313121A patent/GB2274739B/en not_active Expired - Fee Related
- 1993-07-06 US US08/085,990 patent/US5371352A/en not_active Expired - Fee Related
- 1993-07-30 FR FR9309457A patent/FR2701164B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH06232234A (en) | 1994-08-19 |
FR2701164A1 (en) | 1994-08-05 |
US5371352A (en) | 1994-12-06 |
FR2701164B1 (en) | 1995-03-31 |
GB2274739B (en) | 1996-09-11 |
GB2274739A (en) | 1994-08-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19980624 |