GB9308677D0 - Thin film multi-layer interconnect - Google Patents

Thin film multi-layer interconnect

Info

Publication number
GB9308677D0
GB9308677D0 GB9308677A GB9308677A GB9308677D0 GB 9308677 D0 GB9308677 D0 GB 9308677D0 GB 9308677 A GB9308677 A GB 9308677A GB 9308677 A GB9308677 A GB 9308677A GB 9308677 D0 GB9308677 D0 GB 9308677D0
Authority
GB
United Kingdom
Prior art keywords
thin film
layer interconnect
film multi
interconnect
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9308677A
Other versions
GB2277832A (en
GB2277832B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BAE Systems PLC
Original Assignee
British Aerospace PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by British Aerospace PLC filed Critical British Aerospace PLC
Priority to GB9308677A priority Critical patent/GB2277832B/en
Publication of GB9308677D0 publication Critical patent/GB9308677D0/en
Publication of GB2277832A publication Critical patent/GB2277832A/en
Application granted granted Critical
Publication of GB2277832B publication Critical patent/GB2277832B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H05K1/0221—Coaxially shielded signal lines comprising a continuous shielding layer partially or wholly surrounding the signal lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/002—Casings with localised screening
    • H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/467—Adding a circuit layer by thin film methods
GB9308677A 1993-04-27 1993-04-27 Thin film multi-layer interconnect Expired - Fee Related GB2277832B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9308677A GB2277832B (en) 1993-04-27 1993-04-27 Thin film multi-layer interconnect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9308677A GB2277832B (en) 1993-04-27 1993-04-27 Thin film multi-layer interconnect

Publications (3)

Publication Number Publication Date
GB9308677D0 true GB9308677D0 (en) 1993-06-09
GB2277832A GB2277832A (en) 1994-11-09
GB2277832B GB2277832B (en) 1997-01-15

Family

ID=10734544

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9308677A Expired - Fee Related GB2277832B (en) 1993-04-27 1993-04-27 Thin film multi-layer interconnect

Country Status (1)

Country Link
GB (1) GB2277832B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112373077A (en) * 2020-10-22 2021-02-19 江苏南锦电子材料有限公司 Assembling method of electromagnetic shielding heat-conducting adhesive tape

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0916237B1 (en) 1996-07-31 2001-01-17 Dyconex Patente Process for producing connecting conductors
US6545338B1 (en) * 1999-10-28 2003-04-08 Koninklijke Philips Electronics N.V. Methods for implementing co-axial interconnect lines in a CMOS process for high speed RF and microwave applications
US6569757B1 (en) 1999-10-28 2003-05-27 Philips Electronics North America Corporation Methods for forming co-axial interconnect lines in a CMOS process for high speed applications
CN1315822A (en) * 2000-03-30 2001-10-03 日本胜利株式会社 Film resistance element for printed circuit board and forming method thereof
JP2002111233A (en) * 2000-10-03 2002-04-12 Victor Co Of Japan Ltd Printed-wiring board and its manufacturing method
GB2379089A (en) * 2001-08-21 2003-02-26 Ubinetics Ltd RF screening for printed circuit boards
GB2382231B (en) * 2001-11-01 2003-12-24 Motorola Inc Isolator devices for current suppression
FR2849346B1 (en) * 2002-12-20 2006-12-08 Thales Sa SURFACE MOUNTING HYPERFREQUENCY HOUSING AND CORRESPONDING MOUNTING WITH A MULTILAYER CIRCUIT.
CN102315518B (en) * 2010-06-29 2014-03-12 华为技术有限公司 Feed network and antenna

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60198753A (en) * 1983-12-13 1985-10-08 フェアチャイルド　セミコンダクタ　コーポレーション Method and device for reducing signal transmitting loss in super lsi integrated circuit
GB2168857A (en) * 1984-11-14 1986-06-25 Int Standard Electric Corp Method and structure for interconnecting high frequency components
JP2616280B2 (en) * 1991-04-27 1997-06-04 株式会社村田製作所 Oscillator and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112373077A (en) * 2020-10-22 2021-02-19 江苏南锦电子材料有限公司 Assembling method of electromagnetic shielding heat-conducting adhesive tape

Also Published As

Publication number Publication date
GB2277832A (en) 1994-11-09
GB2277832B (en) 1997-01-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20100427