GB926441A - Improvements relating to semiconductor devices - Google Patents

Improvements relating to semiconductor devices

Info

Publication number
GB926441A
GB926441A GB2314959A GB2314959A GB926441A GB 926441 A GB926441 A GB 926441A GB 2314959 A GB2314959 A GB 2314959A GB 2314959 A GB2314959 A GB 2314959A GB 926441 A GB926441 A GB 926441A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
lead
spider
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB2314959A
Inventor
Alan John Blundell
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Associated Electrical Industries Ltd
Original Assignee
Associated Electrical Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Associated Electrical Industries Ltd filed Critical Associated Electrical Industries Ltd
Priority to GB2314959A priority Critical patent/GB926441A/en
Priority to FR832221A priority patent/FR1261798A/en
Publication of GB926441A publication Critical patent/GB926441A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Resistance Heating (AREA)

Abstract

926,441. Semi-conductor devices. ASSOCIATED ELECTRICAL INDUSTRIES Ltd. July 1, 1960 [July 6, 1959], No. 23149/59. Class 37. In a sealed semi-conductor device a flexible spider with inwardly projecting arms is arranged in contact with and between the surface of a semi-conductor body and a disc member which seals one end of a surrounding shell member, the other end of which is connected to a base member. Fig. 1 shows the semi-conductor wafer 2 connected to base member 1 which is joined to ceramic insulating sleeve 5. The upper portion of sleeve 5 is joined to rim region of a spider 12, the resilient arms of which contact an extension on electrode 3. The flanged disc 14 contained in the rim of spider 12 is connected to lead 14. Fig. 3 shows a modification in which the lead from a third electrode, e.g. the control electrode of a controller rectifier, is led through bush 15, the lead 4 being connected by means of an additional flanged ring 19. The arrangement avoids heating of the semi-conductor member during final assembly.
GB2314959A 1959-07-06 1959-07-06 Improvements relating to semiconductor devices Expired GB926441A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB2314959A GB926441A (en) 1959-07-06 1959-07-06 Improvements relating to semiconductor devices
FR832221A FR1261798A (en) 1959-07-06 1960-07-06 Improvements to semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB2314959A GB926441A (en) 1959-07-06 1959-07-06 Improvements relating to semiconductor devices

Publications (1)

Publication Number Publication Date
GB926441A true GB926441A (en) 1963-05-15

Family

ID=10190954

Family Applications (1)

Application Number Title Priority Date Filing Date
GB2314959A Expired GB926441A (en) 1959-07-06 1959-07-06 Improvements relating to semiconductor devices

Country Status (1)

Country Link
GB (1) GB926441A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3460002A (en) * 1965-09-29 1969-08-05 Microwave Ass Semiconductor diode construction and mounting

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