GB922596A - Resin-cored solder - Google Patents
Resin-cored solderInfo
- Publication number
- GB922596A GB922596A GB2138659A GB2138659A GB922596A GB 922596 A GB922596 A GB 922596A GB 2138659 A GB2138659 A GB 2138659A GB 2138659 A GB2138659 A GB 2138659A GB 922596 A GB922596 A GB 922596A
- Authority
- GB
- United Kingdom
- Prior art keywords
- resin
- plasticizer
- adipic
- phthalic
- activator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The core of a cored solder comprises a resin (natural or synthetic and consisting of, or containing, abietic acid) containing an activator and a plasticizer. The plasticizer should (a) have a boiling point higher than the intended soldering temperature; (b) be present in an amount sufficient to lower the freezing point of the resin whereby a quasi-plastic, non-tearing, tack-free film remains on the soldered joint; and (c) have a vapour pressure which is so low that it will remain in the resin remaining on the soldered joint. The resin preferably contains, by weight, 1-6% of an activator and 2-10% of a plasticizer. Specified activators are aniline-, toluidine-, and naphthalene hydrazine-hydrochloride, and adipic, malonic, phthalic and succinic acids. Specified platicizers are butyl stearate, dibutyl and dioctyl sebacate, butyl and octyl esters of phthalic, adipic and tartaric acids, ketones, acid amides, alcohols and ethers.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DEL30655A DE1218257B (en) | 1958-06-25 | 1958-06-25 | Process for soft soldering using Roehrenloetzinn |
Publications (1)
Publication Number | Publication Date |
---|---|
GB922596A true GB922596A (en) | 1963-04-03 |
Family
ID=7265280
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB2138659A Expired GB922596A (en) | 1958-06-25 | 1959-06-22 | Resin-cored solder |
Country Status (4)
Country | Link |
---|---|
BE (1) | BE580007A (en) |
CH (1) | CH388071A (en) |
DE (1) | DE1218257B (en) |
GB (1) | GB922596A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4239812A (en) | 1978-01-30 | 1980-12-16 | Cooper Industries, Inc. | Soldering flux |
US4269870A (en) | 1974-05-13 | 1981-05-26 | Cooper Industries, Inc. | Solder flux and method |
WO1996037336A1 (en) * | 1995-05-24 | 1996-11-28 | Fry's Metals Inc. | Epoxy-based, voc-free soldering flux |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2921827B2 (en) * | 1979-05-29 | 1981-06-04 | Winchester Electronics Gmbh, 7100 Heilbronn | Halogen-free flux for soft soldering based on rosin |
DE102009033406A1 (en) * | 2009-07-15 | 2011-01-20 | Jl Goslar Gmbh & Co. Kg | Tubular solder production involves preparing solder material and flux melting agent, where hollow rod is produced by filling solder material in core filament made of flux melting agent |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2482923A (en) * | 1945-04-28 | 1949-09-27 | Allis Chalmers Mfg Co | Soldering flux |
GB662697A (en) * | 1949-06-22 | 1951-12-12 | John Cockbain Briggs | Improvements in and relating to fluxes and solders |
-
1958
- 1958-06-25 DE DEL30655A patent/DE1218257B/en active Pending
-
1959
- 1959-06-12 CH CH7434659A patent/CH388071A/en unknown
- 1959-06-22 GB GB2138659A patent/GB922596A/en not_active Expired
- 1959-06-24 BE BE580007A patent/BE580007A/en unknown
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4269870A (en) | 1974-05-13 | 1981-05-26 | Cooper Industries, Inc. | Solder flux and method |
US4239812A (en) | 1978-01-30 | 1980-12-16 | Cooper Industries, Inc. | Soldering flux |
WO1996037336A1 (en) * | 1995-05-24 | 1996-11-28 | Fry's Metals Inc. | Epoxy-based, voc-free soldering flux |
US5904782A (en) * | 1995-05-24 | 1999-05-18 | Fry Metals, Inc. | Epoxy based, VOC-free soldering flux |
Also Published As
Publication number | Publication date |
---|---|
DE1218257B (en) | 1966-06-02 |
BE580007A (en) | 1959-10-16 |
CH388071A (en) | 1965-02-15 |
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