GB9221969D0 - A device for large-area ion etching - Google Patents

A device for large-area ion etching

Info

Publication number
GB9221969D0
GB9221969D0 GB929221969A GB9221969A GB9221969D0 GB 9221969 D0 GB9221969 D0 GB 9221969D0 GB 929221969 A GB929221969 A GB 929221969A GB 9221969 A GB9221969 A GB 9221969A GB 9221969 D0 GB9221969 D0 GB 9221969D0
Authority
GB
United Kingdom
Prior art keywords
ion etching
area ion
area
etching
ion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB929221969A
Other versions
GB2261396B (en
GB2261396A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Balzers und Leybold Deutschland Holding AG
Original Assignee
Leybold AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE4223987A external-priority patent/DE4223987C2/en
Application filed by Leybold AG filed Critical Leybold AG
Publication of GB9221969D0 publication Critical patent/GB9221969D0/en
Publication of GB2261396A publication Critical patent/GB2261396A/en
Application granted granted Critical
Publication of GB2261396B publication Critical patent/GB2261396B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32532—Electrodes
    • H01J37/32541—Shape
GB9221969A 1991-11-13 1992-10-20 A device for large-area ion etching Expired - Fee Related GB2261396B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4137257 1991-11-13
DE4223987A DE4223987C2 (en) 1991-11-13 1992-07-21 Device for large-area ion etching

Publications (3)

Publication Number Publication Date
GB9221969D0 true GB9221969D0 (en) 1992-12-02
GB2261396A GB2261396A (en) 1993-05-19
GB2261396B GB2261396B (en) 1995-02-08

Family

ID=25909055

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9221969A Expired - Fee Related GB2261396B (en) 1991-11-13 1992-10-20 A device for large-area ion etching

Country Status (3)

Country Link
JP (1) JPH05222554A (en)
GB (1) GB2261396B (en)
NL (1) NL9201938A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5716485A (en) * 1995-06-07 1998-02-10 Varian Associates, Inc. Electrode designs for controlling uniformity profiles in plasma processing reactors
US6228438B1 (en) * 1999-08-10 2001-05-08 Unakis Balzers Aktiengesellschaft Plasma reactor for the treatment of large size substrates
EP3399545B1 (en) * 2017-05-04 2021-09-29 Meyer Burger (Germany) GmbH Substrate treatment system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5512733A (en) * 1978-07-14 1980-01-29 Anelva Corp Dry process etching device
US4230515A (en) * 1978-07-27 1980-10-28 Davis & Wilder, Inc. Plasma etching apparatus
JPS5669374A (en) * 1979-11-09 1981-06-10 Chiyou Lsi Gijutsu Kenkyu Kumiai Dry etching method
US4328081A (en) * 1980-02-25 1982-05-04 Micro-Plate, Inc. Plasma desmearing apparatus and method
JPS58157975A (en) * 1982-03-10 1983-09-20 Tokyo Ohka Kogyo Co Ltd Plasma etching method
JPS59217330A (en) * 1983-05-26 1984-12-07 Toshiba Corp Reactive ion etching device
EP0280074B1 (en) * 1987-02-24 1995-12-20 International Business Machines Corporation Plasma reactor

Also Published As

Publication number Publication date
GB2261396B (en) 1995-02-08
NL9201938A (en) 1993-06-01
JPH05222554A (en) 1993-08-31
GB2261396A (en) 1993-05-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20011020