GB9208673D0 - Ionised vapour source - Google Patents

Ionised vapour source

Info

Publication number
GB9208673D0
GB9208673D0 GB929208673A GB9208673A GB9208673D0 GB 9208673 D0 GB9208673 D0 GB 9208673D0 GB 929208673 A GB929208673 A GB 929208673A GB 9208673 A GB9208673 A GB 9208673A GB 9208673 D0 GB9208673 D0 GB 9208673D0
Authority
GB
United Kingdom
Prior art keywords
vapour source
ionised vapour
ionised
source
vapour
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB929208673A
Other versions
GB2255105B (en
GB2255105A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ION COAT Ltd
Original Assignee
ION COAT Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ION COAT Ltd filed Critical ION COAT Ltd
Publication of GB9208673D0 publication Critical patent/GB9208673D0/en
Publication of GB2255105A publication Critical patent/GB2255105A/en
Application granted granted Critical
Publication of GB2255105B publication Critical patent/GB2255105B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
GB9208673A 1991-04-22 1992-04-22 Ionised vapour source Expired - Lifetime GB2255105B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB919108553A GB9108553D0 (en) 1991-04-22 1991-04-22 Ionised vapour source

Publications (3)

Publication Number Publication Date
GB9208673D0 true GB9208673D0 (en) 1992-06-10
GB2255105A GB2255105A (en) 1992-10-28
GB2255105B GB2255105B (en) 1994-09-21

Family

ID=10693697

Family Applications (2)

Application Number Title Priority Date Filing Date
GB919108553A Pending GB9108553D0 (en) 1991-04-22 1991-04-22 Ionised vapour source
GB9208673A Expired - Lifetime GB2255105B (en) 1991-04-22 1992-04-22 Ionised vapour source

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB919108553A Pending GB9108553D0 (en) 1991-04-22 1991-04-22 Ionised vapour source

Country Status (1)

Country Link
GB (2) GB9108553D0 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU7381594A (en) * 1993-07-29 1995-02-28 Institute Of Physics Academy Of Sciences Of The Czech Republic Method and device for magnetron sputtering
JP3804974B2 (en) * 1995-01-25 2006-08-02 アプライド コマツ テクノロジー株式会社 Autoclave bonding of sputtering target assemblies
DE19702928C2 (en) * 1997-01-28 2001-06-07 Eitec Ges Fuer Metallisches Ha Arc evaporator
DE19731025C2 (en) * 1997-07-18 1999-10-14 Ardenne Anlagentech Gmbh Target cathode arrangement
AU9410498A (en) * 1997-11-26 1999-06-17 Vapor Technologies, Inc. Apparatus for sputtering or arc evaporation
DE10127012A1 (en) * 2001-06-05 2002-12-12 Gabriel Herbert M Electric arc vaporizing device used in production of hard material layers on substrates comprises anode, target, voltage, and magnet arrangement formed as one unit
WO2006093953A1 (en) * 2005-02-28 2006-09-08 Tosoh Smd, Inc. Sputtering target with an insulating ring and a gap between the ring and the target
CN106086805A (en) * 2016-08-05 2016-11-09 湖南玉丰真空科学技术有限公司 A kind of compound scan magnetic field coater
CA3111730C (en) 2020-03-16 2023-09-26 Vapor Technologies, Inc. Convertible magnetics for rotary cathode

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2140040B (en) * 1983-05-09 1986-09-17 Vac Tec Syst Evaporation arc stabilization
DE3738845A1 (en) * 1987-11-16 1989-05-24 Leybold Ag SPRAYING CATODE ACCORDING TO THE MAGNETRON PRINCIPLE
ATE115647T1 (en) * 1988-08-25 1994-12-15 Hauzer Ind Bv PHYSICAL VAPOR DEPOSITION DOUBLE COATING APPARATUS AND PROCESS.

Also Published As

Publication number Publication date
GB2255105B (en) 1994-09-21
GB2255105A (en) 1992-10-28
GB9108553D0 (en) 1991-06-05

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Legal Events

Date Code Title Description
PE20 Patent expired after termination of 20 years

Expiry date: 20120421