AU7381594A - Method and device for magnetron sputtering - Google Patents
Method and device for magnetron sputteringInfo
- Publication number
- AU7381594A AU7381594A AU73815/94A AU7381594A AU7381594A AU 7381594 A AU7381594 A AU 7381594A AU 73815/94 A AU73815/94 A AU 73815/94A AU 7381594 A AU7381594 A AU 7381594A AU 7381594 A AU7381594 A AU 7381594A
- Authority
- AU
- Australia
- Prior art keywords
- magnetron sputtering
- magnetron
- sputtering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3488—Constructional details of particle beam apparatus not otherwise provided for, e.g. arrangement, mounting, housing, environment; special provisions for cleaning or maintenance of the apparatus
- H01J37/3494—Adaptation to extreme pressure conditions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3411—Constructional aspects of the reactor
- H01J37/345—Magnet arrangements in particular for cathodic sputtering apparatus
- H01J37/3458—Electromagnets in particular for cathodic sputtering apparatus
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CZ931542A CZ154293A3 (en) | 1993-07-29 | 1993-07-29 | Process and apparatus for magnetron sputtering |
CZ1542/93 | 1993-07-29 | ||
CZ1820/93 | 1993-09-03 | ||
CZ931820A CZ281073B6 (en) | 1993-09-03 | 1993-09-03 | Method of sputtering cathode material |
PCT/CZ1994/000017 WO1995004368A1 (en) | 1993-07-29 | 1994-07-28 | Method and device for magnetron sputtering |
Publications (1)
Publication Number | Publication Date |
---|---|
AU7381594A true AU7381594A (en) | 1995-02-28 |
Family
ID=25746887
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU73815/94A Abandoned AU7381594A (en) | 1993-07-29 | 1994-07-28 | Method and device for magnetron sputtering |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU7381594A (en) |
WO (1) | WO1995004368A1 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10018143C5 (en) † | 2000-04-12 | 2012-09-06 | Oerlikon Trading Ag, Trübbach | DLC layer system and method and apparatus for producing such a layer system |
US7147759B2 (en) * | 2002-09-30 | 2006-12-12 | Zond, Inc. | High-power pulsed magnetron sputtering |
CN100596312C (en) * | 2006-12-31 | 2010-03-31 | 中国科学院金属研究所 | Magnetron sputtering device |
CN102046837B (en) | 2008-06-11 | 2012-12-12 | 株式会社爱发科 | Sputtering apparatus |
JP5979034B2 (en) | 2013-02-14 | 2016-08-24 | 三菱マテリアル株式会社 | Sputtering target for protective film formation |
JP5757318B2 (en) * | 2013-11-06 | 2015-07-29 | 三菱マテリアル株式会社 | Protective film forming sputtering target and laminated wiring film |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4865708A (en) * | 1988-11-14 | 1989-09-12 | Vac-Tec Systems, Inc. | Magnetron sputtering cathode |
CZ278295B6 (en) * | 1989-08-14 | 1993-11-17 | Fyzikalni Ustav Avcr | Process of sputtering layers and apparatus for making the same |
GB9108553D0 (en) * | 1991-04-22 | 1991-06-05 | Ion Coat Ltd | Ionised vapour source |
-
1994
- 1994-07-28 WO PCT/CZ1994/000017 patent/WO1995004368A1/en active Application Filing
- 1994-07-28 AU AU73815/94A patent/AU7381594A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1995004368A1 (en) | 1995-02-09 |
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