GB9123003D0 - Circuit board and apparatus for recognizing the position of circuit board - Google Patents

Circuit board and apparatus for recognizing the position of circuit board

Info

Publication number
GB9123003D0
GB9123003D0 GB919123003A GB9123003A GB9123003D0 GB 9123003 D0 GB9123003 D0 GB 9123003D0 GB 919123003 A GB919123003 A GB 919123003A GB 9123003 A GB9123003 A GB 9123003A GB 9123003 D0 GB9123003 D0 GB 9123003D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
recognizing
fiducial mark
image
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB919123003A
Other versions
GB2249672A (en
GB2249672B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9123003D0 publication Critical patent/GB9123003D0/en
Publication of GB2249672A publication Critical patent/GB2249672A/en
Application granted granted Critical
Publication of GB2249672B publication Critical patent/GB2249672B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09918—Optically detected marks used for aligning tool relative to the PCB, e.g. for mounting of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Structure Of Printed Boards (AREA)
  • Image Processing (AREA)
  • Closed-Circuit Television Systems (AREA)
  • Image Analysis (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)

Abstract

In a circuit board, a fiducial mark (2) of the same material as that of a circuit pattern is formed on a main surface of a board (1) on which the circuit pattern is formed, and it is coated with a solder resist film (3). According to this circuit board, it is possible to carry out position recognition by irradiating infrared rays without exposing the fiducial mark (2), so that oxidation of the fiducial mark (2) or attachment of solder thereto are prevented. An apparatus for recognizing the position of a circuit board includes means (22) for picking up the image of the surface of a circuit board (20), means (23) for recognizing the position of the circuit board (20) from thus obtained image, and means (21) for irradiating infrared rays toward the circuit board (20). In another arrangement the apparatus is used to detect the position of part of the wiring pattern rather than a fiducial mark. FIG.6 <IMAGE>
GB9123003A 1990-11-07 1991-10-30 A method and apparatus for recognising circuit board postion, a circuit board for use in such method, use of solder resist film in such method Expired - Fee Related GB2249672B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2301580A JP2698213B2 (en) 1990-11-07 1990-11-07 Circuit board and circuit board position recognition method

Publications (3)

Publication Number Publication Date
GB9123003D0 true GB9123003D0 (en) 1991-12-18
GB2249672A GB2249672A (en) 1992-05-13
GB2249672B GB2249672B (en) 1994-08-31

Family

ID=17898661

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9123003A Expired - Fee Related GB2249672B (en) 1990-11-07 1991-10-30 A method and apparatus for recognising circuit board postion, a circuit board for use in such method, use of solder resist film in such method

Country Status (3)

Country Link
JP (1) JP2698213B2 (en)
DE (1) DE4136543C2 (en)
GB (1) GB2249672B (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4231180C2 (en) * 1992-09-17 1994-08-18 Siemens Ag Adjustment structure for determining the position of the solder mask on a printed circuit board and method for its production
US6079098A (en) * 1998-09-08 2000-06-27 Siemens Aktiengesellschaft Method and apparatus for processing substrates
JP2002118398A (en) * 2000-10-05 2002-04-19 Fuji Mach Mfg Co Ltd Method for detecting position of printed circuit board
JP2002204041A (en) * 2000-12-27 2002-07-19 Alps Electric Co Ltd Mounting position detecting structure of electric component
DE10129760B4 (en) * 2001-06-20 2008-05-15 Friwo Gerätebau Gmbh Circuit board with fiducial and method for its production and method for quality inspection
US9253009B2 (en) 2007-01-05 2016-02-02 Qualcomm Incorporated High performance station
US7710611B2 (en) * 2007-02-16 2010-05-04 Illinois Tool Works, Inc. Single and multi-spectral illumination system and method
GB2458463B (en) * 2008-03-17 2013-02-20 Dek Int Gmbh Imaging system and method
CN103037149A (en) * 2012-11-12 2013-04-10 华映视讯（吴江）有限公司 Direct energy conversion operation (DECO) 6000 equipment carrying backlight false indenter

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60241610A (en) * 1984-05-15 1985-11-30 日立電線株式会社 Refrigerant dipped superconductive conductor
JPH01214118A (en) * 1988-02-23 1989-08-28 Mitsubishi Electric Corp Semiconductor manufacturing apparatus
JPH01283993A (en) * 1988-05-11 1989-11-15 Hitachi Ltd Circuit printed board, its surface mounting component position recognition device and surface mounting component inspecting device
CA1285661C (en) * 1988-08-19 1991-07-02 Randy Tsang Automatic visual measurement of surface mount device placement
GB2231953B (en) * 1989-05-18 1993-01-20 Dynapert Ltd Method of setting up apparatus for handling electrical or electronic components

Also Published As

Publication number Publication date
DE4136543A1 (en) 1992-05-14
JPH04174307A (en) 1992-06-22
GB2249672A (en) 1992-05-13
DE4136543C2 (en) 2003-06-26
JP2698213B2 (en) 1998-01-19
GB2249672B (en) 1994-08-31

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Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 19960611

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20031030