GB9119025D0 - Method of connecting upper and lower interconnections - Google Patents

Method of connecting upper and lower interconnections

Info

Publication number
GB9119025D0
GB9119025D0 GB919119025A GB9119025A GB9119025D0 GB 9119025 D0 GB9119025 D0 GB 9119025D0 GB 919119025 A GB919119025 A GB 919119025A GB 9119025 A GB9119025 A GB 9119025A GB 9119025 D0 GB9119025 D0 GB 9119025D0
Authority
GB
United Kingdom
Prior art keywords
connecting upper
lower interconnections
interconnections
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB919119025A
Other versions
GB2247987A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of GB9119025D0 publication Critical patent/GB9119025D0/en
Publication of GB2247987A publication Critical patent/GB2247987A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
    • H01L21/76885—By forming conductive members before deposition of protective insulating material, e.g. pillars, studs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76819—Smoothing of the dielectric
GB9119025A 1990-09-14 1991-09-05 Metallic interconnections for semiconductor devices Withdrawn GB2247987A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2244511A JPH04123458A (en) 1990-09-14 1990-09-14 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
GB9119025D0 true GB9119025D0 (en) 1991-10-23
GB2247987A GB2247987A (en) 1992-03-18

Family

ID=17119771

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9119025A Withdrawn GB2247987A (en) 1990-09-14 1991-09-05 Metallic interconnections for semiconductor devices

Country Status (3)

Country Link
JP (1) JPH04123458A (en)
DE (1) DE4130535A1 (en)
GB (1) GB2247987A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR950006343B1 (en) * 1992-05-16 1995-06-14 금성일렉트론주식회사 Fabricating method of semiconductor device
JPH0697288A (en) * 1992-09-09 1994-04-08 Kawasaki Steel Corp Manufacture of semiconductor device
KR0140646B1 (en) * 1994-01-12 1998-07-15 문정환 Mancefacture of semicouductor device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4892845A (en) * 1984-08-31 1990-01-09 Texas Instruments Incorporated Method for forming contacts through a thick oxide layer on a semiconductive device
JPS61258453A (en) * 1985-05-13 1986-11-15 Toshiba Corp Manufacture of semiconductor device
US4824521A (en) * 1987-04-01 1989-04-25 Fairchild Semiconductor Corporation Planarization of metal pillars on uneven substrates
EP0317770A1 (en) * 1987-11-23 1989-05-31 Texas Instruments Incorporated Self aligned planar metal interconnection for a VLSI device
JPH10116834A (en) * 1996-10-11 1998-05-06 Toshiba Corp Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
GB2247987A (en) 1992-03-18
JPH04123458A (en) 1992-04-23
DE4130535A1 (en) 1992-03-19

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)