GB9118373D0 - Anisotropically electroconductive composite membrane and method for the preparation thereof - Google Patents

Anisotropically electroconductive composite membrane and method for the preparation thereof

Info

Publication number
GB9118373D0
GB9118373D0 GB9118373A GB9118373A GB9118373D0 GB 9118373 D0 GB9118373 D0 GB 9118373D0 GB 9118373 A GB9118373 A GB 9118373A GB 9118373 A GB9118373 A GB 9118373A GB 9118373 D0 GB9118373 D0 GB 9118373D0
Authority
GB
United Kingdom
Prior art keywords
preparation
composite membrane
anisotropically electroconductive
electroconductive composite
anisotropically
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9118373A
Other versions
GB2248979A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Publication of GB9118373D0 publication Critical patent/GB9118373D0/en
Publication of GB2248979A publication Critical patent/GB2248979A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2464—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point
    • H01R13/2471—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the contact point pin shaped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1345—Conductors connecting electrodes to cell terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
GB9118373A 1990-08-30 1991-08-27 Anisotropically electroconductive membrane. Withdrawn GB2248979A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2228820A JPH07105174B2 (en) 1990-08-30 1990-08-30 Method for manufacturing anisotropic conductive film

Publications (2)

Publication Number Publication Date
GB9118373D0 true GB9118373D0 (en) 1991-10-09
GB2248979A GB2248979A (en) 1992-04-22

Family

ID=16882376

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9118373A Withdrawn GB2248979A (en) 1990-08-30 1991-08-27 Anisotropically electroconductive membrane.

Country Status (3)

Country Link
JP (1) JPH07105174B2 (en)
DE (1) DE4128261A1 (en)
GB (1) GB2248979A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6778967B1 (en) 1999-10-05 2004-08-17 Auto Gas Systems, Inc. System and method of cross-selling products and increasing fuel sales at a fuel service station

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR970048749A (en) * 1995-12-28 1997-07-29 김광호 Pad part of liquid crystal display element
EP1302563B1 (en) * 2001-10-11 2006-05-24 FRANZ Oberflächentechnik GmbH & Co KG Production of metal conductive surface regions on coated light-metal alloys
JP2004031203A (en) * 2002-06-27 2004-01-29 Shin Etsu Polymer Co Ltd Electrically conductive contact element and electric connector
JP2004265728A (en) 2003-02-28 2004-09-24 Jst Mfg Co Ltd Dielectric sheet
CN101682133A (en) 2007-06-18 2010-03-24 泰科电子荷兰公司 Connector for interconnecting surface-mount devices and circuit substrates
KR101040252B1 (en) * 2009-06-16 2011-06-09 주식회사 엑스엘티 Connecting Structure for Flexible Printed Circuit Board
CN108930054B (en) * 2018-09-07 2020-06-09 中国石油大学(华东) Metal micro 3D printing method based on self-assembly molecular membrane control technology

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8330391D0 (en) * 1983-11-15 1983-12-21 Gen Electric Co Plc Electrical interface arrangement
CA1284523C (en) * 1985-08-05 1991-05-28 Leo G. Svendsen Uniaxially electrically conductive articles with porous insulating substrate
JPS6340218A (en) * 1986-08-05 1988-02-20 住友スリ−エム株式会社 Anisotropic conducting film and manufacture thereof
EP0349756A3 (en) * 1988-05-30 1991-03-20 Canon Kabushiki Kaisha Method of making electric circuit device
JP2984064B2 (en) * 1989-12-19 1999-11-29 日東電工株式会社 Method for producing anisotropic conductive film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6778967B1 (en) 1999-10-05 2004-08-17 Auto Gas Systems, Inc. System and method of cross-selling products and increasing fuel sales at a fuel service station

Also Published As

Publication number Publication date
GB2248979A (en) 1992-04-22
DE4128261A1 (en) 1992-03-05
JPH04109510A (en) 1992-04-10
JPH07105174B2 (en) 1995-11-13

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)