GB9108853D0 - Interlayer contact structure of a semiconductor device and the fabrication method thereof - Google Patents

Interlayer contact structure of a semiconductor device and the fabrication method thereof

Info

Publication number
GB9108853D0
GB9108853D0 GB919108853A GB9108853A GB9108853D0 GB 9108853 D0 GB9108853 D0 GB 9108853D0 GB 919108853 A GB919108853 A GB 919108853A GB 9108853 A GB9108853 A GB 9108853A GB 9108853 D0 GB9108853 D0 GB 9108853D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor device
contact structure
fabrication method
interlayer contact
interlayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB919108853A
Other versions
GB2252668A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of GB9108853D0 publication Critical patent/GB9108853D0/en
Publication of GB2252668A publication Critical patent/GB2252668A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/535—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including internal interconnections, e.g. cross-under constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/5226—Via connections in a multilevel interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/528—Geometry or layout of the interconnection structure
    • H01L23/5283—Cross-sectional geometry
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01056—Barium [Ba]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01057—Lanthanum [La]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/30105—Capacitance

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
GB9108853A 1991-02-05 1991-04-25 Interlayer contact structure Withdrawn GB2252668A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019910001977A KR920017227A (en) 1991-02-05 1991-02-05 Interlayer contact structure of semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
GB9108853D0 true GB9108853D0 (en) 1991-06-12
GB2252668A GB2252668A (en) 1992-08-12

Family

ID=19310789

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9108853A Withdrawn GB2252668A (en) 1991-02-05 1991-04-25 Interlayer contact structure

Country Status (6)

Country Link
JP (1) JPH0613468A (en)
KR (1) KR920017227A (en)
DE (1) DE4113775A1 (en)
FR (1) FR2672430A1 (en)
GB (1) GB2252668A (en)
IT (1) IT1248595B (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4403604C2 (en) * 1994-02-05 1998-02-19 A B Elektronik Gmbh Device for controlling the adjustment of a throttle valve determining the performance of an internal combustion engine
US5770518A (en) * 1995-04-19 1998-06-23 Advanced Micro Devices, Inc. Semiconductor device and method of manufacturing without undercutting conductive lines
TW480636B (en) 1996-12-04 2002-03-21 Seiko Epson Corp Electronic component and semiconductor device, method for manufacturing and mounting thereof, and circuit board and electronic equipment
TW571373B (en) 1996-12-04 2004-01-11 Seiko Epson Corp Semiconductor device, circuit substrate, and electronic machine
KR20150021742A (en) 2013-08-21 2015-03-03 에스케이하이닉스 주식회사 Semiconductor device and method of manufacturing the same
US9269610B2 (en) * 2014-04-15 2016-02-23 Qualcomm Incorporated Pattern between pattern for low profile substrate
KR102610485B1 (en) * 2018-11-22 2023-12-05 엘지디스플레이 주식회사 Electroluminescent display device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57162331A (en) * 1981-03-31 1982-10-06 Fujitsu Ltd Forming method for wiring pattern
JPS61193454A (en) * 1985-02-20 1986-08-27 Mitsubishi Electric Corp Semiconductor device
US4708770A (en) * 1986-06-19 1987-11-24 Lsi Logic Corporation Planarized process for forming vias in silicon wafers
DE3902693C2 (en) * 1988-01-30 1995-11-30 Toshiba Kawasaki Kk Multi-level wiring for a semiconductor integrated circuit arrangement and method for producing multi-level wiring for semiconductor integrated circuit arrangements
US4916514A (en) * 1988-05-31 1990-04-10 Unisys Corporation Integrated circuit employing dummy conductors for planarity
JPH02222162A (en) * 1989-02-22 1990-09-04 Sharp Corp Manufacture of semiconductor device
JPH04127452A (en) * 1989-06-30 1992-04-28 Matsushita Electric Ind Co Ltd Semiconductor device and its manufacture
JP3229973B2 (en) * 1993-02-12 2001-11-19 株式会社リコー Thermal recording material

Also Published As

Publication number Publication date
GB2252668A (en) 1992-08-12
KR920017227A (en) 1992-09-26
JPH0613468A (en) 1994-01-21
IT1248595B (en) 1995-01-19
ITMI911148A1 (en) 1992-10-24
ITMI911148A0 (en) 1991-04-24
DE4113775A1 (en) 1992-08-13
FR2672430A1 (en) 1992-08-07

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)