GB908677A - Improvements relating to electrical printed circuit assemblies - Google Patents

Improvements relating to electrical printed circuit assemblies

Info

Publication number
GB908677A
GB908677A GB3974060A GB3974060A GB908677A GB 908677 A GB908677 A GB 908677A GB 3974060 A GB3974060 A GB 3974060A GB 3974060 A GB3974060 A GB 3974060A GB 908677 A GB908677 A GB 908677A
Authority
GB
United Kingdom
Prior art keywords
printed circuit
circuit assemblies
improvements relating
backing
nov
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3974060A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Publication of GB908677A publication Critical patent/GB908677A/en
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • H05K3/284Applying non-metallic protective coatings for encapsulating mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305Moulding and encapsulation
    • H05K2203/1316Moulded encapsulation of mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)

Abstract

908,677. Mounting electrical equipment. LICENTIA PATENT - VERWALTUNGS - G.m.b.H. Nov. 18, 1960 [Nov. 19, 1959], No. 39740/60. Class 37. Printed circuit assemblies, in which electrical components are mounted on a backing-plate bearing a printed circuit, or are formed thereon by printed circuit methods, are encased, except for terminal parts, in an envelope comprising a cold-setting low-pressure resin containing a hardener and a flexibilizing agent. A backing- plate 1 carrying resistors, capacitors, transistors 2 or the like interconnected by a printed circuit is enclosed, except for terminal members 3, in an envelope 4 which consists of a cold-setting lowpressure castable resin having an epoxy equivalent of 230 and containing 5 to 12% of an amine hardener and between 1% and 60% of polyglycol as a flexibilizing agent.
GB3974060A 1959-11-19 1960-11-18 Improvements relating to electrical printed circuit assemblies Expired GB908677A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DEL0034742 1959-11-19

Publications (1)

Publication Number Publication Date
GB908677A true GB908677A (en) 1962-10-24

Family

ID=7266793

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3974060A Expired GB908677A (en) 1959-11-19 1960-11-18 Improvements relating to electrical printed circuit assemblies

Country Status (1)

Country Link
GB (1) GB908677A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10688916B2 (en) 2018-05-10 2020-06-23 Dura Operating, Llc Multiple resin over-mold for printed circuit board electronics and light guide
US10939544B2 (en) 2018-05-10 2021-03-02 Dura Operating, Llc Multiple resin over-mold for printed circuit board electronics and light guide

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10688916B2 (en) 2018-05-10 2020-06-23 Dura Operating, Llc Multiple resin over-mold for printed circuit board electronics and light guide
US10939544B2 (en) 2018-05-10 2021-03-02 Dura Operating, Llc Multiple resin over-mold for printed circuit board electronics and light guide

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