KR870006647A - IC chip protection coating method - Google Patents

IC chip protection coating method Download PDF

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Publication number
KR870006647A
KR870006647A KR1019850010125A KR850010125A KR870006647A KR 870006647 A KR870006647 A KR 870006647A KR 1019850010125 A KR1019850010125 A KR 1019850010125A KR 850010125 A KR850010125 A KR 850010125A KR 870006647 A KR870006647 A KR 870006647A
Authority
KR
South Korea
Prior art keywords
coating method
protection coating
chip protection
chip
substrate
Prior art date
Application number
KR1019850010125A
Other languages
Korean (ko)
Other versions
KR880001538B1 (en
Inventor
김승완
Original Assignee
김승완
우진정밀 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김승완, 우진정밀 주식회사 filed Critical 김승완
Priority to KR1019850010125A priority Critical patent/KR880001538B1/en
Publication of KR870006647A publication Critical patent/KR870006647A/en
Application granted granted Critical
Publication of KR880001538B1 publication Critical patent/KR880001538B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Die Bonding (AREA)

Abstract

내용 없음.No content.

Description

아이시(IC)칩보호 코팅방법IC chip protection coating method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (2)

공지의 방법으로 기판에 IC칩을 고착시키고 IC회로와 기판의 회로단자를 연결시킨 것에 에폭시수지 100부와 경화제 2-5부를 혼합한 것을 적하하여 90-130℃에서 경화시킴을 특징으로 하는 IC칩보호 코팅방법.IC chip is fixed to the substrate by a known method, and 100 parts of epoxy resin and 2-5 parts of a curing agent are added dropwise to the IC chip and the circuit terminal of the substrate, and then cured at 90-130 ° C. Protective coating method. 제1항에 있어서 경화제로 메틸아민, 에틸아민, t-부틸아민, 디에틸아민, 에틸렌디아민 등을 사용함을 특징으로 하는 IC칩보호 코팅방법.The method of claim 1, wherein methylamine, ethylamine, t-butylamine, diethylamine, ethylenediamine, or the like is used as a curing agent. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019850010125A 1985-12-31 1985-12-31 I.c.chip protection process KR880001538B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019850010125A KR880001538B1 (en) 1985-12-31 1985-12-31 I.c.chip protection process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019850010125A KR880001538B1 (en) 1985-12-31 1985-12-31 I.c.chip protection process

Publications (2)

Publication Number Publication Date
KR870006647A true KR870006647A (en) 1987-07-13
KR880001538B1 KR880001538B1 (en) 1988-08-19

Family

ID=19244627

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019850010125A KR880001538B1 (en) 1985-12-31 1985-12-31 I.c.chip protection process

Country Status (1)

Country Link
KR (1) KR880001538B1 (en)

Also Published As

Publication number Publication date
KR880001538B1 (en) 1988-08-19

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