GB881571A - Improvements relating to the cooling of semi-conductor devices - Google Patents

Improvements relating to the cooling of semi-conductor devices

Info

Publication number
GB881571A
GB881571A GB3074258A GB3074258A GB881571A GB 881571 A GB881571 A GB 881571A GB 3074258 A GB3074258 A GB 3074258A GB 3074258 A GB3074258 A GB 3074258A GB 881571 A GB881571 A GB 881571A
Authority
GB
United Kingdom
Prior art keywords
box
mica
copper
disc
wall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3074258A
Other languages
English (en)
Inventor
John Jarrett Davis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Stone J and Co Ltd
Original Assignee
Stone J and Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to NL243350D priority Critical patent/NL243350A/xx
Priority to NL293350D priority patent/NL293350A/xx
Application filed by Stone J and Co Ltd filed Critical Stone J and Co Ltd
Priority to GB3074258A priority patent/GB881571A/en
Priority to ES0251880A priority patent/ES251880A1/es
Priority to FR805644A priority patent/FR1236322A/fr
Priority to DEST15616A priority patent/DE1205196B/de
Priority to BE583030A priority patent/BE583030A/fr
Publication of GB881571A publication Critical patent/GB881571A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4031—Packaged discrete devices, e.g. to-3 housings, diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/4062—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to or through board or cabinet
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Casings For Electric Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
GB3074258A 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices Expired GB881571A (en)

Priority Applications (7)

Application Number Priority Date Filing Date Title
NL243350D NL243350A (fr) 1958-09-25
NL293350D NL293350A (fr) 1958-09-25
GB3074258A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices
ES0251880A ES251880A1 (es) 1958-09-25 1959-09-03 Una disposiciën en semiconductores
FR805644A FR1236322A (fr) 1958-09-25 1959-09-21 Perfectionnements au refroidissement des dispositifs semi-conducteurs
DEST15616A DE1205196B (de) 1958-09-25 1959-09-25 Halbleiteranordnung mit mindestens einem Halbleiterbauelement
BE583030A BE583030A (fr) 1958-09-25 1959-09-25 Perfectionnements relatifs au refroidissement de dispositifs semi-conducteurs

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3074258A GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Publications (1)

Publication Number Publication Date
GB881571A true GB881571A (en) 1961-11-08

Family

ID=10312426

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3074258A Expired GB881571A (en) 1958-09-25 1958-09-25 Improvements relating to the cooling of semi-conductor devices

Country Status (6)

Country Link
BE (1) BE583030A (fr)
DE (1) DE1205196B (fr)
ES (1) ES251880A1 (fr)
FR (1) FR1236322A (fr)
GB (1) GB881571A (fr)
NL (2) NL243350A (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
US4445735A (en) * 1980-12-05 1984-05-01 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Electrical connection device for high density contacts
EP0198378A2 (fr) * 1985-04-08 1986-10-22 Otis Elevator Company Appareil pour dissiper la chaleur de composants électriques et procédé pour la fabrication d'un tel appareil
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A2 (fr) * 2005-02-10 2006-08-16 Behr-Hella Thermocontrol GmbH Commande d'unité de ventilation pour véhicule

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2423070A1 (de) * 1973-07-06 1975-01-23 Siemens Ag Anordnung eines leistungshalbleiters

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB321299A (en) * 1952-01-22 1929-11-07 William Charles King Improvements in or relating to heating buildings by electricity
BE565471A (fr) * 1957-03-08
DE1751741U (de) * 1957-05-17 1957-09-05 Telefunken Gmbh Gehaeuseanordnung zur kuehlung von leistungskristalloden.
DE1768720U (de) * 1957-12-16 1958-06-19 Licentia Gmbh Einrichtung zur kuehlung von transistoren.

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2495838A1 (fr) * 1980-12-05 1982-06-11 Cii Honeywell Bull Dispositif de refroidissement amovible pour supports de circuits integres
EP0053967A1 (fr) * 1980-12-05 1982-06-16 COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) Dispositif de refroidissement amovible pour supports de circuits intégrés
US4445735A (en) * 1980-12-05 1984-05-01 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Electrical connection device for high density contacts
EP0198378A2 (fr) * 1985-04-08 1986-10-22 Otis Elevator Company Appareil pour dissiper la chaleur de composants électriques et procédé pour la fabrication d'un tel appareil
EP0198378A3 (fr) * 1985-04-08 1986-12-30 Otis Elevator Company Appareil pour dissiper la chaleur de composants électriques et procédé pour la fabrication d'un tel appareil
US5594355A (en) * 1994-07-19 1997-01-14 Delta Design, Inc. Electrical contactor apparatus for testing integrated circuit devices
EP1691595A2 (fr) * 2005-02-10 2006-08-16 Behr-Hella Thermocontrol GmbH Commande d'unité de ventilation pour véhicule
EP1691595A3 (fr) * 2005-02-10 2012-01-18 Behr-Hella Thermocontrol GmbH Commande d'unité de ventilation pour véhicule

Also Published As

Publication number Publication date
ES251880A1 (es) 1960-03-16
NL243350A (fr)
DE1205196B (de) 1965-11-18
BE583030A (fr) 1960-01-18
NL293350A (fr)
FR1236322A (fr) 1960-07-15

Similar Documents

Publication Publication Date Title
US3229756A (en) Semiconductor heat sink and/or cooler
US2751528A (en) Rectifier cell mounting
US2887628A (en) Semiconductor device construction
GB1029171A (en) A semiconductor arrangement
US3829740A (en) Cooling arrangement for a direct current power supply
GB881571A (en) Improvements relating to the cooling of semi-conductor devices
US3173061A (en) Cooled semi-conductor rectifier assembly
GB965723A (en) A combined transformer and semi-conductor rectifier installation
US3196317A (en) Heatsinks and rectifier assembly for a dynamoelectric machine
GB1076237A (en) Rectifier arrangements
US4506320A (en) Power rectifier arrangement
US3280390A (en) Electrical semiconductor device
US3054032A (en) Heat sink for a. c.-d. c. rectifier
GB906559A (en) Improvements in or relating to semi-conductor rectifier installations
GB886456A (en) Semiconductor rectifiers
US2915685A (en) Dry rectifier assembly and housing therefor
US3210636A (en) Electrical converters
GB956934A (en) Sealed semiconductor devices and mounting means therefor
GB902832A (en) Improvements relating to electric arc welding supply circuits
GB917042A (en) Current rectifiers
CN211208430U (zh) 一种智能伺服变压器
JPH02269424A (ja) 船外機用充電装置の取付け構造
GB1064387A (en) A semiconductor rectifier device
CN211481787U (zh) 一种伺服变压器散热模块
GB1081652A (en) Improvements relating to liquid cooled electric transformer/rectifier equipment