GB8811583D0 - Semiconductor devices - Google Patents

Semiconductor devices

Info

Publication number
GB8811583D0
GB8811583D0 GB8811583A GB8811583A GB8811583D0 GB 8811583 D0 GB8811583 D0 GB 8811583D0 GB 8811583 A GB8811583 A GB 8811583A GB 8811583 A GB8811583 A GB 8811583A GB 8811583 D0 GB8811583 D0 GB 8811583D0
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
semiconductor
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8811583A
Other versions
GB2218847A (en
GB2218847B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co PLC
Original Assignee
General Electric Co PLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co PLC filed Critical General Electric Co PLC
Priority to GB8811583A priority Critical patent/GB2218847B/en
Publication of GB8811583D0 publication Critical patent/GB8811583D0/en
Publication of GB2218847A publication Critical patent/GB2218847A/en
Application granted granted Critical
Publication of GB2218847B publication Critical patent/GB2218847B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5386—Geometry or layout of the interconnection structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB8811583A 1988-05-16 1988-05-16 Carrier for semiconductor devices Expired - Fee Related GB2218847B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8811583A GB2218847B (en) 1988-05-16 1988-05-16 Carrier for semiconductor devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8811583A GB2218847B (en) 1988-05-16 1988-05-16 Carrier for semiconductor devices

Publications (3)

Publication Number Publication Date
GB8811583D0 true GB8811583D0 (en) 1988-06-22
GB2218847A GB2218847A (en) 1989-11-22
GB2218847B GB2218847B (en) 1991-04-24

Family

ID=10636985

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8811583A Expired - Fee Related GB2218847B (en) 1988-05-16 1988-05-16 Carrier for semiconductor devices

Country Status (1)

Country Link
GB (1) GB2218847B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8918482D0 (en) * 1989-08-14 1989-09-20 Inmos Ltd Packaging semiconductor chips
GB2292004A (en) * 1994-07-29 1996-02-07 Ibm Uk Electronic circuit package
FR2797348B1 (en) * 1999-08-02 2001-10-19 Cit Alcatel METHOD FOR OBTAINING A HIGH DENSITY MODULE FROM ELECTRONIC, MODULAR, ENCAPSULATED COMPONENTS AND MODULE THUS OBTAINED

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH518005A (en) * 1970-01-21 1972-01-15 Siemens Ag Electrical connection element for connecting a microelectronic circuit with external wiring
GB1303350A (en) * 1971-05-24 1973-01-17
NL7704773A (en) * 1977-05-02 1978-11-06 Philips Nv HYBRID CIRCUIT EQUIPPED WITH SEMICONDUCTOR CIRCUIT.

Also Published As

Publication number Publication date
GB2218847A (en) 1989-11-22
GB2218847B (en) 1991-04-24

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930516