GB8723863D0 - Soldering process & circuit board - Google Patents

Soldering process & circuit board

Info

Publication number
GB8723863D0
GB8723863D0 GB878723863A GB8723863A GB8723863D0 GB 8723863 D0 GB8723863 D0 GB 8723863D0 GB 878723863 A GB878723863 A GB 878723863A GB 8723863 A GB8723863 A GB 8723863A GB 8723863 D0 GB8723863 D0 GB 8723863D0
Authority
GB
United Kingdom
Prior art keywords
circuit board
soldering process
soldering
board
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB878723863A
Other versions
GB2210818A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Plessey Co Ltd
Original Assignee
Plessey Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Plessey Co Ltd filed Critical Plessey Co Ltd
Priority to GB8723863A priority Critical patent/GB2210818A/en
Publication of GB8723863D0 publication Critical patent/GB8723863D0/en
Publication of GB2210818A publication Critical patent/GB2210818A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10166—Transistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/0455—PTH for surface mount device [SMD], e.g. wherein solder flows through the PTH during mounting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
GB8723863A 1987-10-10 1987-10-10 A process for soldering a component to a printed circuit board Withdrawn GB2210818A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8723863A GB2210818A (en) 1987-10-10 1987-10-10 A process for soldering a component to a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8723863A GB2210818A (en) 1987-10-10 1987-10-10 A process for soldering a component to a printed circuit board

Publications (2)

Publication Number Publication Date
GB8723863D0 true GB8723863D0 (en) 1987-11-11
GB2210818A GB2210818A (en) 1989-06-21

Family

ID=10625147

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8723863A Withdrawn GB2210818A (en) 1987-10-10 1987-10-10 A process for soldering a component to a printed circuit board

Country Status (1)

Country Link
GB (1) GB2210818A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0851275A (en) * 1994-04-08 1996-02-20 Vlt Corp Method and circuitry for soldering electric element
ITMI20112084A1 (en) * 2011-11-17 2013-05-18 St Microelectronics Srl WAVE WELDING ON PRINTED CIRCUIT BOARD OF SURFACE MOUNTED ELECTRONIC DEVICES

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3500538A (en) * 1966-08-29 1970-03-17 Gen Electric Method for producing a wire having improved soldering characteristics
US3755890A (en) * 1969-01-28 1973-09-04 Burroughs Corp Vacuum-heat treatment of printed circuit boards
DE2215623A1 (en) * 1972-03-30 1973-10-11 Bosch Gmbh Robert METHOD OF APPLYING SOFT SOLDER TO A METALLIZED CIRCUIT BOARD
FR2418606A1 (en) * 1978-02-28 1979-09-21 Kollmorgen Tech Corp PRINTED CIRCUIT BOARD WITH IMPLANTED COMPONENTS AND MANUFACTURING PROCESS OF SUCH BOARD
DE2852753C3 (en) * 1978-12-06 1985-06-20 Württembergische Metallwarenfabrik, 7340 Geislingen Method for fastening components with flat connection contacts on a printed circuit board and template for carrying out the method

Also Published As

Publication number Publication date
GB2210818A (en) 1989-06-21

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)